SG11201502535YA - Holding device for a product and treatment method - Google Patents

Holding device for a product and treatment method

Info

Publication number
SG11201502535YA
SG11201502535YA SG11201502535YA SG11201502535YA SG11201502535YA SG 11201502535Y A SG11201502535Y A SG 11201502535YA SG 11201502535Y A SG11201502535Y A SG 11201502535YA SG 11201502535Y A SG11201502535Y A SG 11201502535YA SG 11201502535Y A SG11201502535Y A SG 11201502535YA
Authority
SG
Singapore
Prior art keywords
product
holding device
treatment method
treatment
holding
Prior art date
Application number
SG11201502535YA
Inventor
Ralph Rauenbusch
Christian Thomas
Ray Weinhold
Heinz Klingl
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of SG11201502535YA publication Critical patent/SG11201502535YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • External Artificial Organs (AREA)
  • Gasket Seals (AREA)
SG11201502535YA 2012-10-02 2013-09-16 Holding device for a product and treatment method SG11201502535YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012019389.0A DE102012019389B4 (en) 2012-10-02 2012-10-02 Holding device for a product and treatment method
PCT/EP2013/069117 WO2014053300A1 (en) 2012-10-02 2013-09-16 Holding device for a product and treatment method

Publications (1)

Publication Number Publication Date
SG11201502535YA true SG11201502535YA (en) 2015-05-28

Family

ID=49223763

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201502535YA SG11201502535YA (en) 2012-10-02 2013-09-16 Holding device for a product and treatment method

Country Status (10)

Country Link
US (1) US9222192B2 (en)
EP (1) EP2904133B1 (en)
JP (1) JP5886484B2 (en)
KR (1) KR101630585B1 (en)
CN (1) CN104685111B (en)
DE (1) DE102012019389B4 (en)
MY (1) MY163251A (en)
SG (1) SG11201502535YA (en)
TW (1) TWI583828B (en)
WO (1) WO2014053300A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT3034657T (en) * 2014-12-19 2019-05-31 Atotech Deutschland Gmbh Substrate holder for vertical galvanic metal deposition
JP6596372B2 (en) * 2016-03-22 2019-10-23 株式会社荏原製作所 Substrate holder and plating apparatus
JP6510461B2 (en) * 2016-05-25 2019-05-08 日本特殊陶業株式会社 Substrate holding device
JP6746474B2 (en) * 2016-11-14 2020-08-26 株式会社荏原製作所 Leak inspection method, leak inspection device, electrolytic plating method, and electrolytic plating device
EP3376530B1 (en) 2017-03-16 2019-08-14 ATOTECH Deutschland GmbH Automated substrate holder loading device
GB2568126B (en) * 2017-07-27 2022-04-06 Semsysco Gmbh Substrate locking system for chemical and/or electrolytic surface treatment
GB2564896B (en) * 2017-07-27 2021-12-01 Semsysco Gmbh Substrate locking system for chemical and/or electrolytic surface treatment
JP6971922B2 (en) * 2018-06-27 2021-11-24 株式会社荏原製作所 Board holder
JP7100556B2 (en) * 2018-10-05 2022-07-13 株式会社荏原製作所 A device for causing the board holder to hold the board and / or releasing the holding of the board by the board holder, and a plating device having the same device.
JP7132136B2 (en) * 2019-01-23 2022-09-06 上村工業株式会社 Work holding jig and electroplating device
JP7132135B2 (en) * 2019-01-23 2022-09-06 上村工業株式会社 Work holding jig and electroplating device
JP7132134B2 (en) * 2019-01-23 2022-09-06 上村工業株式会社 Work holding jig and electroplating device
TWI807120B (en) * 2019-10-23 2023-07-01 宇泰和股份有限公司 electrode frame
EP4043618B1 (en) * 2020-01-21 2024-06-19 Semsysco GmbH Substrate holding and locking system for chemical and/or electrolytic surface treatment
CN214244657U (en) * 2020-11-30 2021-09-21 京东方科技集团股份有限公司 Substrate carrier and electrochemical deposition equipment
TWI821659B (en) * 2021-04-30 2023-11-11 奧地利商勝思科技有限公司 Substrate holding and locking system and method for chemical or electrolytic or chemical and electrolytic surface treatment

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19736352C1 (en) * 1997-08-21 1998-12-10 Atotech Deutschland Gmbh Apparatus for contacting flat items in continuous galvanising installations
DE29721741U1 (en) 1997-12-09 1998-03-05 Strecker, Günther, 74080 Heilbronn Bracket-like holding device for electroplating
DE10019720A1 (en) * 2000-04-20 2001-10-31 Atotech Deutschland Gmbh Method and device for electrical contacting of plate-like items to be treated in electrolytic processes
CN1253606C (en) 2001-02-23 2006-04-26 株式会社荏原制作所 Copper-plating solution, plating method and plating apparatus
JP3827627B2 (en) * 2002-08-13 2006-09-27 株式会社荏原製作所 Plating apparatus and plating method
DE10241619B4 (en) * 2002-09-04 2004-07-22 Atotech Deutschland Gmbh Device and method for the electrolytic treatment of at least superficially electrically conductive material to be treated
JP3109711U (en) * 2004-10-05 2005-06-02 久幸 加茂 Vacuum suction holding jig for single-sided surface treatment
DE102007026634B4 (en) * 2007-06-06 2009-04-16 Atotech Deutschland Gmbh Vertical plant for electroplating treatment of a workpiece and method for conveying the workpiece
JP5766048B2 (en) * 2010-08-19 2015-08-19 株式会社荏原製作所 Substrate holder and plating apparatus
US9464362B2 (en) * 2012-07-18 2016-10-11 Deca Technologies Inc. Magnetically sealed wafer plating jig system and method

Also Published As

Publication number Publication date
KR101630585B1 (en) 2016-06-14
CN104685111A (en) 2015-06-03
TWI583828B (en) 2017-05-21
EP2904133B1 (en) 2018-02-21
JP2015535891A (en) 2015-12-17
US20150225868A1 (en) 2015-08-13
JP5886484B2 (en) 2016-03-16
CN104685111B (en) 2016-09-21
WO2014053300A1 (en) 2014-04-10
TW201420816A (en) 2014-06-01
DE102012019389B4 (en) 2018-03-29
KR20150043522A (en) 2015-04-22
DE102012019389A1 (en) 2014-04-03
EP2904133A1 (en) 2015-08-12
MY163251A (en) 2017-08-30
US9222192B2 (en) 2015-12-29

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