SG11201406535UA - Material deposition system and method for depositing materials on a substrate - Google Patents
Material deposition system and method for depositing materials on a substrateInfo
- Publication number
- SG11201406535UA SG11201406535UA SG11201406535UA SG11201406535UA SG11201406535UA SG 11201406535U A SG11201406535U A SG 11201406535UA SG 11201406535U A SG11201406535U A SG 11201406535UA SG 11201406535U A SG11201406535U A SG 11201406535UA SG 11201406535U A SG11201406535U A SG 11201406535UA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- deposition system
- material deposition
- depositing materials
- depositing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/165—Preventing or detecting of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
- B41J2/16517—Cleaning of print head nozzles
- B41J2/16552—Cleaning of print head nozzles using cleaning fluids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
- B05B15/555—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids discharged by cleaning nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/165—Preventing or detecting of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
- B41J2/16517—Cleaning of print head nozzles
- B41J2/16552—Cleaning of print head nozzles using cleaning fluids
- B41J2002/16555—Air or gas for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/02—Air-assisted ejection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/448,724 US9089863B2 (en) | 2012-04-17 | 2012-04-17 | Method for cleaning a nozzle of a material deposition system |
PCT/US2013/036695 WO2013158588A2 (en) | 2012-04-17 | 2013-04-16 | Material deposition system and method for depositing materials on a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201406535UA true SG11201406535UA (en) | 2014-11-27 |
Family
ID=48485428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201406535UA SG11201406535UA (en) | 2012-04-17 | 2013-04-16 | Material deposition system and method for depositing materials on a substrate |
Country Status (10)
Country | Link |
---|---|
US (1) | US9089863B2 (en) |
EP (1) | EP2838730B1 (en) |
JP (2) | JP2015524156A (en) |
KR (1) | KR101977434B1 (en) |
IN (1) | IN2014DN08515A (en) |
MY (1) | MY195025A (en) |
PH (1) | PH12014502276A1 (en) |
SG (1) | SG11201406535UA (en) |
TW (1) | TWI606764B (en) |
WO (1) | WO2013158588A2 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9636868B2 (en) | 2012-08-16 | 2017-05-02 | Stratasys, Inc. | Additive manufacturing system with extended printing volume, and methods of use thereof |
US11020899B2 (en) | 2012-08-16 | 2021-06-01 | Stratasys, Inc. | Additive manufacturing system with extended printing volume, and methods of use thereof |
US9327350B2 (en) | 2012-08-16 | 2016-05-03 | Stratasys, Inc. | Additive manufacturing technique for printing three-dimensional parts with printed receiving surfaces |
US10029415B2 (en) * | 2012-08-16 | 2018-07-24 | Stratasys, Inc. | Print head nozzle for use with additive manufacturing system |
US9475078B2 (en) | 2012-10-29 | 2016-10-25 | Illinois Tool Works Inc. | Automated multiple head cleaner for a dispensing system and related method |
US11266344B2 (en) | 2016-09-21 | 2022-03-08 | Samsung Electronics Co., Ltd. | Method for measuring skin condition and electronic device therefor |
JP6849909B2 (en) * | 2017-02-07 | 2021-03-31 | 富士通株式会社 | Soldering method, soldering equipment, and method of keeping the solder wet of the jet nozzle |
USD888115S1 (en) | 2017-03-16 | 2020-06-23 | Stratasys, Inc. | Nozzle |
US11247387B2 (en) | 2018-08-30 | 2022-02-15 | Stratasys, Inc. | Additive manufacturing system with platen having vacuum and air bearing |
CN111014089A (en) * | 2018-10-09 | 2020-04-17 | 深圳市腾盛精密装备股份有限公司 | Cleaning device for needle head and glue dispensing equipment |
US20210301943A1 (en) * | 2020-03-27 | 2021-09-30 | Illinois Tool Works Inc. | Dispensing unit having fixed flexible diaphragm seal |
US11246249B2 (en) | 2020-04-15 | 2022-02-08 | Illinois Tool Works Inc. | Tilt and rotate dispenser having strain wave gear system |
US11805634B2 (en) * | 2021-08-03 | 2023-10-31 | Illinois Tool Works Inc. | Tilt and rotate dispenser having motion control |
US11904337B2 (en) | 2021-08-03 | 2024-02-20 | Illinois Tool Works Inc. | Tilt and rotate dispenser having material flow rate control |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4106032A (en) | 1974-09-26 | 1978-08-08 | Matsushita Electric Industrial Co., Limited | Apparatus for applying liquid droplets to a surface by using a high speed laminar air flow to accelerate the same |
US4598303A (en) | 1984-11-28 | 1986-07-01 | Tektronix, Inc. | Method and apparatus for operating an ink jet head of an ink jet printer |
US4613875A (en) | 1985-04-08 | 1986-09-23 | Tektronix, Inc. | Air assisted ink jet head with projecting internal ink drop-forming orifice outlet |
US4728969A (en) | 1986-07-11 | 1988-03-01 | Tektronix, Inc. | Air assisted ink jet head with single compartment ink chamber |
JP3223677B2 (en) * | 1993-11-30 | 2001-10-29 | 株式会社スリーボンド | Nozzle hardening prevention device |
US5819983A (en) | 1995-11-22 | 1998-10-13 | Camelot Sysems, Inc. | Liquid dispensing system with sealing augering screw and method for dispensing |
US6514569B1 (en) | 2000-01-14 | 2003-02-04 | Kenneth Crouch | Variable volume positive displacement dispensing system and method |
JP2004066165A (en) * | 2002-08-08 | 2004-03-04 | Dainippon Printing Co Ltd | Coating head cleaning device and cleaning method |
US7294309B1 (en) | 2003-05-15 | 2007-11-13 | Takeda San Diego, Inc. | Small volume liquid handling apparatus and method |
GB2412088B (en) * | 2004-03-19 | 2007-09-19 | Zipher Ltd | Liquid supply system |
US7569406B2 (en) | 2006-01-09 | 2009-08-04 | Cree, Inc. | Method for coating semiconductor device using droplet deposition |
US7980197B2 (en) | 2006-11-03 | 2011-07-19 | Illinois Tool Works, Inc. | Method and apparatus for dispensing a viscous material on a substrate |
TWI332440B (en) | 2007-11-01 | 2010-11-01 | Ind Tech Res Inst | A dropplet ejection device for a highly viscous fluid |
JP2010088965A (en) * | 2008-10-03 | 2010-04-22 | Riso Kagaku Corp | Liquid agent discharge device |
JP2010104863A (en) | 2008-10-28 | 2010-05-13 | Seiko Epson Corp | Droplet discharge device |
KR101665051B1 (en) * | 2009-12-17 | 2016-10-12 | 주식회사 탑 엔지니어링 | Apparatus for measuring LC weight and LC dispenser including the same |
US8714716B2 (en) | 2010-08-25 | 2014-05-06 | Illinois Tool Works Inc. | Pulsed air-actuated micro-droplet on demand ink jet |
-
2012
- 2012-04-17 US US13/448,724 patent/US9089863B2/en active Active
-
2013
- 2013-04-02 TW TW102111936A patent/TWI606764B/en active
- 2013-04-16 IN IN8515DEN2014 patent/IN2014DN08515A/en unknown
- 2013-04-16 MY MYPI2014702979A patent/MY195025A/en unknown
- 2013-04-16 JP JP2015507098A patent/JP2015524156A/en not_active Withdrawn
- 2013-04-16 WO PCT/US2013/036695 patent/WO2013158588A2/en active Application Filing
- 2013-04-16 EP EP13724926.4A patent/EP2838730B1/en active Active
- 2013-04-16 KR KR1020147032197A patent/KR101977434B1/en active IP Right Grant
- 2013-04-16 SG SG11201406535UA patent/SG11201406535UA/en unknown
-
2014
- 2014-10-09 PH PH12014502276A patent/PH12014502276A1/en unknown
-
2018
- 2018-03-14 JP JP2018047028A patent/JP6538913B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2018110266A (en) | 2018-07-12 |
EP2838730B1 (en) | 2020-01-22 |
KR20150010744A (en) | 2015-01-28 |
TWI606764B (en) | 2017-11-21 |
MY195025A (en) | 2023-01-03 |
CN104395085A (en) | 2015-03-04 |
KR101977434B1 (en) | 2019-05-10 |
WO2013158588A2 (en) | 2013-10-24 |
US20130269731A1 (en) | 2013-10-17 |
WO2013158588A3 (en) | 2013-12-12 |
EP2838730A2 (en) | 2015-02-25 |
US9089863B2 (en) | 2015-07-28 |
JP2015524156A (en) | 2015-08-20 |
JP6538913B2 (en) | 2019-07-03 |
PH12014502276B1 (en) | 2014-12-10 |
PH12014502276A1 (en) | 2014-12-10 |
TW201345349A (en) | 2013-11-01 |
IN2014DN08515A (en) | 2015-05-15 |
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