SG11201404613VA - A post chemical-mechanical-polishing (post-cmp) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or a polycarboxylic acid - Google Patents
A post chemical-mechanical-polishing (post-cmp) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or a polycarboxylic acidInfo
- Publication number
- SG11201404613VA SG11201404613VA SG11201404613VA SG11201404613VA SG11201404613VA SG 11201404613V A SG11201404613V A SG 11201404613VA SG 11201404613V A SG11201404613V A SG 11201404613VA SG 11201404613V A SG11201404613V A SG 11201404613VA SG 11201404613V A SG11201404613V A SG 11201404613VA
- Authority
- SG
- Singapore
- Prior art keywords
- post
- cmp
- polishing
- mechanical
- containing compound
- Prior art date
Links
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 title 1
- 239000002253 acid Substances 0.000 title 1
- 238000004140 cleaning Methods 0.000 title 1
- 150000001875 compounds Chemical class 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
- 150000005846 sugar alcohols Chemical class 0.000 title 1
- 229910052717 sulfur Inorganic materials 0.000 title 1
- 239000011593 sulfur Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3427—Organic compounds containing sulfur containing thiol, mercapto or sulfide groups, e.g. thioethers or mercaptales
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/662—Carbohydrates or derivatives
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/722—Ethers of polyoxyalkylene glycols having mixed oxyalkylene groups; Polyalkoxylated fatty alcohols or polyalkoxylated alkylaryl alcohols with mixed oxyalkylele groups
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2065—Polyhydric alcohols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2082—Polycarboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/349—Organic compounds containing sulfur additionally containing nitrogen atoms, e.g. nitro, nitroso, amino, imino, nitrilo, nitrile groups containing compounds or their derivatives or thio urea
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
- C11D3/3765—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions in liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/268—Carbohydrates or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/40—Specific cleaning or washing processes
- C11D2111/44—Multi-step processes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Physics & Mathematics (AREA)
- Molecular Biology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261595180P | 2012-02-06 | 2012-02-06 | |
| PCT/IB2013/050625 WO2013118013A1 (en) | 2012-02-06 | 2013-01-24 | A post chemical-mechanical-polishing (post-cmp) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or a polycarboxylic acid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201404613VA true SG11201404613VA (en) | 2014-09-26 |
Family
ID=48946959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201404613VA SG11201404613VA (en) | 2012-02-06 | 2013-01-24 | A post chemical-mechanical-polishing (post-cmp) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or a polycarboxylic acid |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US9458415B2 (en) |
| EP (2) | EP3385363B1 (en) |
| JP (2) | JP6231017B2 (en) |
| KR (1) | KR102050704B1 (en) |
| CN (1) | CN104093824B (en) |
| IL (1) | IL233665B (en) |
| MY (1) | MY171165A (en) |
| RU (1) | RU2631870C2 (en) |
| SG (1) | SG11201404613VA (en) |
| TW (2) | TWI580775B (en) |
| WO (1) | WO2013118013A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10926201B2 (en) * | 2012-02-12 | 2021-02-23 | Ide Technologies Ltd. | Integrated unit for intake and pretreatment with local backwashing |
| CN108431931B (en) * | 2015-12-22 | 2023-08-18 | 巴斯夫欧洲公司 | Composition for post-chemical mechanical polishing cleaning |
| TWI673357B (en) * | 2016-12-14 | 2019-10-01 | 美商卡博特微電子公司 | Composition and method for removing residue from chemical-mechanical planarization substrate |
| WO2018136511A1 (en) * | 2017-01-18 | 2018-07-26 | Entegris, Inc. | Compositions and methods for removing ceria particles from a surface |
| KR20200058428A (en) | 2017-10-10 | 2020-05-27 | 미쯔비시 케미컬 주식회사 | Cleaning solution, cleaning method and manufacturing method of semiconductor wafer |
| US11446708B2 (en) * | 2017-12-04 | 2022-09-20 | Entegris, Inc. | Compositions and methods for reducing interaction between abrasive particles and a cleaning brush |
| JP7211298B2 (en) * | 2019-07-24 | 2023-01-24 | Jsr株式会社 | CLEANING COMPOSITION AND PRODUCTION METHOD THEREOF |
| JP7467188B2 (en) | 2020-03-24 | 2024-04-15 | キオクシア株式会社 | CMP method and CMP cleaning agent |
| KR20220061628A (en) * | 2020-11-06 | 2022-05-13 | 주식회사 케이씨텍 | Composition for dissolving abrasive particles and cleaning method using same |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY114292A (en) * | 1989-10-26 | 2002-09-30 | Momentive Performance Mat Jp | Method for removing residual liquid cleaning agent using a rinsing composition containing a polyorganosiloxane |
| JP2003013266A (en) * | 2001-06-28 | 2003-01-15 | Wako Pure Chem Ind Ltd | Substrate cleaning agent |
| JP4221191B2 (en) | 2002-05-16 | 2009-02-12 | 関東化学株式会社 | Cleaning liquid composition after CMP |
| WO2004100245A1 (en) * | 2003-05-02 | 2004-11-18 | Ekc Technology, Inc. | Removal of post-etch residues in semiconductor processing |
| US7087564B2 (en) | 2004-03-05 | 2006-08-08 | Air Liquide America, L.P. | Acidic chemistry for post-CMP cleaning |
| SG158920A1 (en) | 2005-01-27 | 2010-02-26 | Advanced Tech Materials | Compositions for processing of semiconductor substrates |
| KR101088568B1 (en) * | 2005-04-19 | 2011-12-05 | 아반토르 퍼포먼스 머티리얼스, 인크. | Non-aqueous photoresist stripper that inhibits galvanic corrosion |
| JP4667147B2 (en) * | 2005-07-15 | 2011-04-06 | 株式会社トクヤマ | Substrate cleaning solution |
| TW200734448A (en) | 2006-02-03 | 2007-09-16 | Advanced Tech Materials | Low pH post-CMP residue removal composition and method of use |
| JP4732948B2 (en) | 2006-05-01 | 2011-07-27 | 株式会社エヌ・ティ・ティ・ドコモ | Transmitting apparatus, receiving apparatus, and random access control method |
| CN101130876B (en) * | 2006-08-25 | 2012-02-29 | 安集微电子（上海）有限公司 | Metal anti-corrosion rinsing liquid used for semiconductor manufacture process |
| US20080139436A1 (en) * | 2006-09-18 | 2008-06-12 | Chris Reid | Two step cleaning process to remove resist, etch residue, and copper oxide from substrates having copper and low-K dielectric material |
| WO2009032460A1 (en) * | 2007-08-02 | 2009-03-12 | Advanced Technology Materials, Inc. | Non-fluoride containing composition for the removal of residue from a microelectronic device |
| JP2009071165A (en) * | 2007-09-14 | 2009-04-02 | Mitsubishi Chemicals Corp | Substrate cleaning liquid for semiconductor device |
| JP2009099945A (en) * | 2007-09-28 | 2009-05-07 | Fujifilm Corp | Cleaning agent for semiconductor device and cleaning method using the same |
| TW200946621A (en) * | 2007-10-29 | 2009-11-16 | Ekc Technology Inc | Chemical mechanical polishing and wafer cleaning composition comprising amidoxime compounds and associated method for use |
| TW200946448A (en) * | 2007-10-29 | 2009-11-16 | Ekc Technology Inc | Stabilization of hydroxylamine containing solutions and method for their preparation |
| KR20100108365A (en) * | 2007-12-07 | 2010-10-06 | 폰타나 테크놀로지 | Method and composition for cleaning wafers |
| JP2009194049A (en) * | 2008-02-13 | 2009-08-27 | Sanyo Chem Ind Ltd | Detergent for copper wire semiconductor |
| JP5412661B2 (en) * | 2008-03-28 | 2014-02-12 | 富士フイルム株式会社 | Semiconductor device cleaning agent and semiconductor device cleaning method using the same |
| JP5561914B2 (en) * | 2008-05-16 | 2014-07-30 | 関東化学株式会社 | Semiconductor substrate cleaning liquid composition |
| US20090291873A1 (en) | 2008-05-22 | 2009-11-26 | Air Products And Chemicals, Inc. | Method and Composition for Post-CMP Cleaning of Copper Interconnects Comprising Noble Metal Barrier Layers |
| CN101685272A (en) * | 2008-09-26 | 2010-03-31 | 安集微电子（上海）有限公司 | Photoresist cleaning agent |
| KR101752684B1 (en) * | 2008-10-21 | 2017-07-04 | 엔테그리스, 아이엔씨. | Copper cleaning and protection formulations |
| JP2010153790A (en) * | 2008-11-21 | 2010-07-08 | Jsr Corp | Water-based dispersing substance for chemical machinery polishing, chemical machinery polishing method using the same, and method of preparing water-based dispersing substance for chemical machinery polishing |
| WO2011000694A1 (en) | 2009-06-30 | 2011-01-06 | Basf Se | Aqueous alkaline cleaning compositions and methods of their use |
| KR101751553B1 (en) | 2009-06-30 | 2017-06-27 | 바스프 에스이 | Aqueous alkaline cleaning compositions and methods of their use |
| US8765653B2 (en) * | 2009-07-07 | 2014-07-01 | Air Products And Chemicals, Inc. | Formulations and method for post-CMP cleaning |
| US8101561B2 (en) * | 2009-11-17 | 2012-01-24 | Wai Mun Lee | Composition and method for treating semiconductor substrate surface |
| US8894774B2 (en) * | 2011-04-27 | 2014-11-25 | Intermolecular, Inc. | Composition and method to remove excess material during manufacturing of semiconductor devices |
-
2013
- 2013-01-24 JP JP2014555353A patent/JP6231017B2/en active Active
- 2013-01-24 CN CN201380007434.8A patent/CN104093824B/en active Active
- 2013-01-24 SG SG11201404613VA patent/SG11201404613VA/en unknown
- 2013-01-24 US US14/376,978 patent/US9458415B2/en active Active
- 2013-01-24 EP EP18169062.9A patent/EP3385363B1/en active Active
- 2013-01-24 KR KR1020147025096A patent/KR102050704B1/en active IP Right Grant
- 2013-01-24 RU RU2014136176A patent/RU2631870C2/en active
- 2013-01-24 EP EP13746032.5A patent/EP2812422B1/en active Active
- 2013-01-24 WO PCT/IB2013/050625 patent/WO2013118013A1/en active Application Filing
- 2013-01-24 MY MYPI2014002274A patent/MY171165A/en unknown
- 2013-02-05 TW TW102104464A patent/TWI580775B/en active
- 2013-02-05 TW TW106101052A patent/TWI624542B/en active
-
2014
- 2014-07-16 IL IL233665A patent/IL233665B/en active IP Right Grant
-
2017
- 2017-06-15 JP JP2017117450A patent/JP6577526B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017222860A (en) | 2017-12-21 |
| WO2013118013A1 (en) | 2013-08-15 |
| TWI624542B (en) | 2018-05-21 |
| EP2812422A1 (en) | 2014-12-17 |
| RU2631870C2 (en) | 2017-09-28 |
| US9458415B2 (en) | 2016-10-04 |
| JP2015512959A (en) | 2015-04-30 |
| JP6231017B2 (en) | 2017-11-15 |
| IL233665B (en) | 2018-12-31 |
| TWI580775B (en) | 2017-05-01 |
| TW201335361A (en) | 2013-09-01 |
| MY171165A (en) | 2019-09-28 |
| CN104093824B (en) | 2018-05-11 |
| EP3385363B1 (en) | 2022-03-16 |
| EP2812422A4 (en) | 2016-10-19 |
| EP3385363A1 (en) | 2018-10-10 |
| KR20140123994A (en) | 2014-10-23 |
| JP6577526B2 (en) | 2019-09-18 |
| US20150018261A1 (en) | 2015-01-15 |
| KR102050704B1 (en) | 2019-12-02 |
| EP2812422B1 (en) | 2019-08-07 |
| TW201718842A (en) | 2017-06-01 |
| IL233665A0 (en) | 2014-08-31 |
| RU2014136176A (en) | 2016-03-27 |
| CN104093824A (en) | 2014-10-08 |
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