SG11201401203RA - Methods and apparatus for classification of defects using surface height attributes - Google Patents
Methods and apparatus for classification of defects using surface height attributesInfo
- Publication number
- SG11201401203RA SG11201401203RA SG11201401203RA SG11201401203RA SG11201401203RA SG 11201401203R A SG11201401203R A SG 11201401203RA SG 11201401203R A SG11201401203R A SG 11201401203RA SG 11201401203R A SG11201401203R A SG 11201401203RA SG 11201401203R A SG11201401203R A SG 11201401203RA
- Authority
- SG
- Singapore
- Prior art keywords
- classification
- defects
- methods
- surface height
- height attributes
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
- G06T2207/10012—Stereo images
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10028—Range image; Depth image; 3D point clouds
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10056—Microscopic image
- G06T2207/10061—Microscopic image from scanning electron microscope
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/252,042 US8502146B2 (en) | 2011-10-03 | 2011-10-03 | Methods and apparatus for classification of defects using surface height attributes |
| PCT/US2012/056317 WO2013052283A1 (en) | 2011-10-03 | 2012-09-20 | Methods and apparatus for classification of defects using surface height attributes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201401203RA true SG11201401203RA (en) | 2014-05-29 |
Family
ID=47991686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201401203RA SG11201401203RA (en) | 2011-10-03 | 2012-09-20 | Methods and apparatus for classification of defects using surface height attributes |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8502146B2 (en) |
| EP (1) | EP2764349A4 (en) |
| JP (1) | JP6188695B2 (en) |
| KR (1) | KR101809315B1 (en) |
| SG (1) | SG11201401203RA (en) |
| TW (1) | TWI580952B (en) |
| WO (1) | WO2013052283A1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9595091B2 (en) | 2012-04-19 | 2017-03-14 | Applied Materials Israel, Ltd. | Defect classification using topographical attributes |
| US9715723B2 (en) | 2012-04-19 | 2017-07-25 | Applied Materials Israel Ltd | Optimization of unknown defect rejection for automatic defect classification |
| US10043264B2 (en) | 2012-04-19 | 2018-08-07 | Applied Materials Israel Ltd. | Integration of automatic and manual defect classification |
| US9858658B2 (en) | 2012-04-19 | 2018-01-02 | Applied Materials Israel Ltd | Defect classification using CAD-based context attributes |
| US9607233B2 (en) | 2012-04-20 | 2017-03-28 | Applied Materials Israel Ltd. | Classifier readiness and maintenance in automatic defect classification |
| US9466101B2 (en) * | 2013-05-01 | 2016-10-11 | Taiwan Semiconductor Manufacturing Company Limited | Detection of defects on wafer during semiconductor fabrication |
| US9430824B2 (en) * | 2013-05-14 | 2016-08-30 | Kla-Tencor Corporation | Machine learning method and apparatus for inspecting reticles |
| TWI627546B (en) * | 2013-06-29 | 2018-06-21 | 新納普系統股份有限公司 | Chip cross-section identification and rendering during failure analysis |
| US10114368B2 (en) | 2013-07-22 | 2018-10-30 | Applied Materials Israel Ltd. | Closed-loop automatic defect inspection and classification |
| US9489599B2 (en) | 2013-11-03 | 2016-11-08 | Kla-Tencor Corp. | Decision tree construction for automatic classification of defects on semiconductor wafers |
| KR101939288B1 (en) * | 2014-02-12 | 2019-01-16 | 에이에스엠엘 네델란즈 비.브이. | Method of optimizing a process window |
| JP6546826B2 (en) * | 2015-10-08 | 2019-07-17 | 株式会社日立パワーソリューションズ | Defect inspection method and apparatus therefor |
| US10957608B2 (en) * | 2017-04-28 | 2021-03-23 | Kla-Tencor Corporation | Guided scanning electron microscopy metrology based on wafer topography |
| US11048163B2 (en) * | 2017-11-07 | 2021-06-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Inspection method of a photomask and an inspection system |
| CN111292303B (en) * | 2020-01-21 | 2023-09-19 | 湖北文理学院 | Weld defect type detection method and device, electronic equipment and storage medium |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006113073A (en) * | 1997-07-04 | 2006-04-27 | Hitachi Ltd | System and method for pattern defect inspection |
| US6987873B1 (en) * | 1998-07-08 | 2006-01-17 | Applied Materials, Inc. | Automatic defect classification with invariant core classes |
| US6353222B1 (en) | 1998-09-03 | 2002-03-05 | Applied Materials, Inc. | Determining defect depth and contour information in wafer structures using multiple SEM images |
| JP2002116161A (en) * | 2000-10-05 | 2002-04-19 | Jeol Ltd | Convexness/concaveness judging device for detected pattern, convexness/concaveness judging method, pattern defect judging device, and pattern defect judging method |
| JP3990981B2 (en) * | 2000-12-15 | 2007-10-17 | ケイエルエイ−テンコー コーポレイション | Method and apparatus for inspecting a substrate |
| US7473911B2 (en) * | 2002-07-30 | 2009-01-06 | Applied Materials, Israel, Ltd. | Specimen current mapper |
| JP2004214060A (en) * | 2003-01-06 | 2004-07-29 | Hitachi High-Technologies Corp | Scanning electron microscope, and testpiece observation method using it |
| US7910885B2 (en) * | 2003-07-11 | 2011-03-22 | Applied Materials Israel, Ltd. | System and method for determining a cross sectional feature of a structural element using a reference structural element |
| CN1820194B (en) * | 2003-07-30 | 2012-06-13 | 应用材料以色列公司 | Scanning electron microscope having multiple detectors and a method for multiple detector based imaging |
| KR100543467B1 (en) * | 2003-12-11 | 2006-01-20 | 삼성전자주식회사 | Method and system for measuring critical dimension of fine pattern |
| JP4936985B2 (en) | 2007-05-14 | 2012-05-23 | 株式会社日立ハイテクノロジーズ | Scanning electron microscope and three-dimensional shape measuring apparatus using the same |
| JP2009270976A (en) * | 2008-05-08 | 2009-11-19 | Hitachi High-Technologies Corp | Flaw reviewing method and flaw reviewing apparatus |
| DE102008062928A1 (en) * | 2008-12-23 | 2010-07-01 | Nawotec Gmbh | A method of determining a repair shape of a defect at or near an edge of a substrate of a photomask |
| US8294125B2 (en) * | 2009-11-18 | 2012-10-23 | Kla-Tencor Corporation | High-sensitivity and high-throughput electron beam inspection column enabled by adjustable beam-limiting aperture |
| US20120223227A1 (en) * | 2011-03-04 | 2012-09-06 | Chien-Huei Chen | Apparatus and methods for real-time three-dimensional sem imaging and viewing of semiconductor wafers |
-
2011
- 2011-10-03 US US13/252,042 patent/US8502146B2/en active Active
-
2012
- 2012-09-20 KR KR1020147011927A patent/KR101809315B1/en active IP Right Grant
- 2012-09-20 EP EP12838397.3A patent/EP2764349A4/en not_active Withdrawn
- 2012-09-20 JP JP2014534587A patent/JP6188695B2/en active Active
- 2012-09-20 WO PCT/US2012/056317 patent/WO2013052283A1/en active Application Filing
- 2012-09-20 SG SG11201401203RA patent/SG11201401203RA/en unknown
- 2012-10-02 TW TW101136384A patent/TWI580952B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI580952B (en) | 2017-05-01 |
| US20130082174A1 (en) | 2013-04-04 |
| TW201319556A (en) | 2013-05-16 |
| US8502146B2 (en) | 2013-08-06 |
| EP2764349A4 (en) | 2015-04-22 |
| KR101809315B1 (en) | 2017-12-14 |
| JP6188695B2 (en) | 2017-08-30 |
| JP2015500979A (en) | 2015-01-08 |
| WO2013052283A1 (en) | 2013-04-11 |
| EP2764349A1 (en) | 2014-08-13 |
| KR20140072178A (en) | 2014-06-12 |
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