SG109435A1 - Leaded mcm package and method therefor - Google Patents
Leaded mcm package and method thereforInfo
- Publication number
- SG109435A1 SG109435A1 SG200007212A SG200007212A SG109435A1 SG 109435 A1 SG109435 A1 SG 109435A1 SG 200007212 A SG200007212 A SG 200007212A SG 200007212 A SG200007212 A SG 200007212A SG 109435 A1 SG109435 A1 SG 109435A1
- Authority
- SG
- Singapore
- Prior art keywords
- leaded
- method therefor
- mcm package
- mcm
- package
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200007212A SG109435A1 (en) | 2000-12-07 | 2000-12-07 | Leaded mcm package and method therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200007212A SG109435A1 (en) | 2000-12-07 | 2000-12-07 | Leaded mcm package and method therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
SG109435A1 true SG109435A1 (en) | 2005-03-30 |
Family
ID=34588227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200007212A SG109435A1 (en) | 2000-12-07 | 2000-12-07 | Leaded mcm package and method therefor |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG109435A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0378209A2 (en) * | 1989-01-11 | 1990-07-18 | Kabushiki Kaisha Toshiba | Hybrid resin-sealed semiconductor device |
EP0409196A2 (en) * | 1989-07-18 | 1991-01-23 | Kabushiki Kaisha Toshiba | Plastic molded type semiconductor device |
US5349233A (en) * | 1992-04-20 | 1994-09-20 | Kabushiki Kaisha Toshiba | Lead frame and semiconductor module using the same having first and second islands and three distinct pluralities of leads and semiconductor module using the lead frame |
-
2000
- 2000-12-07 SG SG200007212A patent/SG109435A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0378209A2 (en) * | 1989-01-11 | 1990-07-18 | Kabushiki Kaisha Toshiba | Hybrid resin-sealed semiconductor device |
EP0409196A2 (en) * | 1989-07-18 | 1991-01-23 | Kabushiki Kaisha Toshiba | Plastic molded type semiconductor device |
US5349233A (en) * | 1992-04-20 | 1994-09-20 | Kabushiki Kaisha Toshiba | Lead frame and semiconductor module using the same having first and second islands and three distinct pluralities of leads and semiconductor module using the lead frame |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB0015233D0 (en) | Indexing method and apparatus | |
GB0008264D0 (en) | Novel method and compounds | |
GB0225660D0 (en) | Well reference apparatus and method | |
AU9447701A (en) | Package | |
HUP0100744A3 (en) | Filling method and filling device | |
CZ20001501A3 (en) | Packaging method | |
GB0024796D0 (en) | Package | |
GB0014185D0 (en) | Compound and method | |
GB0102976D0 (en) | Enclosing device and method | |
HK1023543A1 (en) | Package method and package apparatus thereof | |
GB0122679D0 (en) | Packaging apparatus and method therefor | |
TW488556U (en) | Memory package method and apparatus | |
SG109436A1 (en) | Leaded mcm package and method therefor | |
SG109435A1 (en) | Leaded mcm package and method therefor | |
GB9907736D0 (en) | Banding apparatus and method | |
GB9913223D0 (en) | Wrapping apparatus and method | |
GB2358785B (en) | Method and apparatus for encapsulating the hand | |
GB9802837D0 (en) | Package | |
GB9821758D0 (en) | Package | |
GB2374333B (en) | Packaging apparatus and method | |
GB0113722D0 (en) | Condiut and box connecting device | |
CA89813S (en) | Package | |
GB0008271D0 (en) | Novel method and compounds | |
GB0008642D0 (en) | Novel method and compounds | |
GB0030846D0 (en) | Novel method and compounds |