SG109435A1 - Leaded mcm package and method therefor - Google Patents

Leaded mcm package and method therefor

Info

Publication number
SG109435A1
SG109435A1 SG200007212A SG200007212A SG109435A1 SG 109435 A1 SG109435 A1 SG 109435A1 SG 200007212 A SG200007212 A SG 200007212A SG 200007212 A SG200007212 A SG 200007212A SG 109435 A1 SG109435 A1 SG 109435A1
Authority
SG
Singapore
Prior art keywords
leaded
method therefor
mcm package
mcm
package
Prior art date
Application number
SG200007212A
Inventor
Chuen Khiang Wang
Fung Leng Chen
Yong Khim Swee
Original Assignee
Chuen Khiang Wang
Fung Leng Chen
Yong Khim Swee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chuen Khiang Wang, Fung Leng Chen, Yong Khim Swee filed Critical Chuen Khiang Wang
Priority to SG200007212A priority Critical patent/SG109435A1/en
Publication of SG109435A1 publication Critical patent/SG109435A1/en

Links

SG200007212A 2000-12-07 2000-12-07 Leaded mcm package and method therefor SG109435A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200007212A SG109435A1 (en) 2000-12-07 2000-12-07 Leaded mcm package and method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200007212A SG109435A1 (en) 2000-12-07 2000-12-07 Leaded mcm package and method therefor

Publications (1)

Publication Number Publication Date
SG109435A1 true SG109435A1 (en) 2005-03-30

Family

ID=34588227

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200007212A SG109435A1 (en) 2000-12-07 2000-12-07 Leaded mcm package and method therefor

Country Status (1)

Country Link
SG (1) SG109435A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0378209A2 (en) * 1989-01-11 1990-07-18 Kabushiki Kaisha Toshiba Hybrid resin-sealed semiconductor device
EP0409196A2 (en) * 1989-07-18 1991-01-23 Kabushiki Kaisha Toshiba Plastic molded type semiconductor device
US5349233A (en) * 1992-04-20 1994-09-20 Kabushiki Kaisha Toshiba Lead frame and semiconductor module using the same having first and second islands and three distinct pluralities of leads and semiconductor module using the lead frame

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0378209A2 (en) * 1989-01-11 1990-07-18 Kabushiki Kaisha Toshiba Hybrid resin-sealed semiconductor device
EP0409196A2 (en) * 1989-07-18 1991-01-23 Kabushiki Kaisha Toshiba Plastic molded type semiconductor device
US5349233A (en) * 1992-04-20 1994-09-20 Kabushiki Kaisha Toshiba Lead frame and semiconductor module using the same having first and second islands and three distinct pluralities of leads and semiconductor module using the lead frame

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