SG108298A1 - Method for forming a released microstructure suitable for a microelectromechanical device - Google Patents

Method for forming a released microstructure suitable for a microelectromechanical device

Info

Publication number
SG108298A1
SG108298A1 SG200203408A SG200203408A SG108298A1 SG 108298 A1 SG108298 A1 SG 108298A1 SG 200203408 A SG200203408 A SG 200203408A SG 200203408 A SG200203408 A SG 200203408A SG 108298 A1 SG108298 A1 SG 108298A1
Authority
SG
Singapore
Prior art keywords
forming
microelectromechanical device
microstructure suitable
released microstructure
released
Prior art date
Application number
SG200203408A
Inventor
Xiaosong Tang
Bee Lee Chua
Zhihong Li
C Tien Norman
Eng Hock Francis Tay
Original Assignee
Agency Science Tech & Res
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency Science Tech & Res filed Critical Agency Science Tech & Res
Priority to SG200203408A priority Critical patent/SG108298A1/en
Priority to PCT/SG2003/000141 priority patent/WO2003104141A1/en
Priority to AU2003248599A priority patent/AU2003248599A1/en
Publication of SG108298A1 publication Critical patent/SG108298A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
    • B81C1/00936—Releasing the movable structure without liquid etchant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0135—Controlling etch progression
    • B81C2201/014—Controlling etch progression by depositing an etch stop layer, e.g. silicon nitride, silicon oxide, metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
SG200203408A 2002-06-10 2002-06-10 Method for forming a released microstructure suitable for a microelectromechanical device SG108298A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG200203408A SG108298A1 (en) 2002-06-10 2002-06-10 Method for forming a released microstructure suitable for a microelectromechanical device
PCT/SG2003/000141 WO2003104141A1 (en) 2002-06-10 2003-06-10 Method for forming a released microstructure suitable for a microelectromechanical device
AU2003248599A AU2003248599A1 (en) 2002-06-10 2003-06-10 Method for forming a released microstructure suitable for a microelectromechanical device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200203408A SG108298A1 (en) 2002-06-10 2002-06-10 Method for forming a released microstructure suitable for a microelectromechanical device

Publications (1)

Publication Number Publication Date
SG108298A1 true SG108298A1 (en) 2005-01-28

Family

ID=29729282

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200203408A SG108298A1 (en) 2002-06-10 2002-06-10 Method for forming a released microstructure suitable for a microelectromechanical device

Country Status (3)

Country Link
AU (1) AU2003248599A1 (en)
SG (1) SG108298A1 (en)
WO (1) WO2003104141A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7485485B2 (en) * 2004-02-09 2009-02-03 Microvision, Inc. Method and apparatus for making a MEMS scanner
JP4556454B2 (en) * 2004-03-15 2010-10-06 パナソニック電工株式会社 Manufacturing method of semiconductor device
CN113666331B (en) * 2021-08-23 2024-07-12 苏州司南传感科技有限公司 Thin silicon release process compatible with MEMS deep silicon etching process

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002033649A1 (en) * 2000-10-06 2002-04-25 Ultratouch Corporation A dynamic color imaging method and system
US6074890A (en) * 1998-01-08 2000-06-13 Rockwell Science Center, Llc Method of fabricating suspended single crystal silicon micro electro mechanical system (MEMS) devices
US6544898B2 (en) * 2001-06-25 2003-04-08 Adc Telecommunications, Inc. Method for improved die release of a semiconductor device from a wafer

Also Published As

Publication number Publication date
WO2003104141A1 (en) 2003-12-18
WO2003104141A8 (en) 2004-04-29
AU2003248599A1 (en) 2003-12-22

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