SG106592A1 - High performance sub-system design and assembly - Google Patents

High performance sub-system design and assembly

Info

Publication number
SG106592A1
SG106592A1 SG200006177A SG200006177A SG106592A1 SG 106592 A1 SG106592 A1 SG 106592A1 SG 200006177 A SG200006177 A SG 200006177A SG 200006177 A SG200006177 A SG 200006177A SG 106592 A1 SG106592 A1 SG 106592A1
Authority
SG
Singapore
Prior art keywords
assembly
high performance
system design
performance sub
sub
Prior art date
Application number
SG200006177A
Inventor
Mou-Shiung Lin
Original Assignee
Mou Shiung Lin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mou Shiung Lin filed Critical Mou Shiung Lin
Priority to SG200006177A priority Critical patent/SG106592A1/en
Priority claimed from US09/849,039 external-priority patent/US6586266B1/en
Publication of SG106592A1 publication Critical patent/SG106592A1/en

Links

SG200006177A 2000-10-27 2000-10-27 High performance sub-system design and assembly SG106592A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200006177A SG106592A1 (en) 2000-10-27 2000-10-27 High performance sub-system design and assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200006177A SG106592A1 (en) 2000-10-27 2000-10-27 High performance sub-system design and assembly
US09/849,039 US6586266B1 (en) 1999-03-01 2001-05-04 High performance sub-system design and assembly

Publications (1)

Publication Number Publication Date
SG106592A1 true SG106592A1 (en) 2004-10-29

Family

ID=34082468

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200006177A SG106592A1 (en) 2000-10-27 2000-10-27 High performance sub-system design and assembly

Country Status (1)

Country Link
SG (1) SG106592A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5461333A (en) * 1993-03-15 1995-10-24 At&T Ipm Corp. Multi-chip modules having chip-to-chip interconnections with reduced signal voltage level and swing
US5534465A (en) * 1995-01-10 1996-07-09 At&T Corp. Method for making multichip circuits using active semiconductor substrates
US5731945A (en) * 1995-02-22 1998-03-24 International Business Machines Corporation Multichip semiconductor structures with consolidated circuitry and programmable ESD protection for input/output nodes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5461333A (en) * 1993-03-15 1995-10-24 At&T Ipm Corp. Multi-chip modules having chip-to-chip interconnections with reduced signal voltage level and swing
US5534465A (en) * 1995-01-10 1996-07-09 At&T Corp. Method for making multichip circuits using active semiconductor substrates
US5731945A (en) * 1995-02-22 1998-03-24 International Business Machines Corporation Multichip semiconductor structures with consolidated circuitry and programmable ESD protection for input/output nodes
US5807791A (en) * 1995-02-22 1998-09-15 International Business Machines Corporation Methods for fabricating multichip semiconductor structures with consolidated circuitry and programmable ESD protection for input/output nodes

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