SG10202102718XA - Inspection apparatus and method of adjusting position of chuck top - Google Patents

Inspection apparatus and method of adjusting position of chuck top

Info

Publication number
SG10202102718XA
SG10202102718XA SG10202102718XA SG10202102718XA SG 10202102718X A SG10202102718X A SG 10202102718XA SG 10202102718X A SG10202102718X A SG 10202102718XA SG 10202102718X A SG10202102718X A SG 10202102718XA
Authority
SG
Singapore
Prior art keywords
inspection apparatus
adjusting position
chuck top
chuck
adjusting
Prior art date
Application number
Inventor
Endo Tomoya
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG10202102718XA publication Critical patent/SG10202102718XA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
SG10202102718X 2020-03-25 2021-03-17 Inspection apparatus and method of adjusting position of chuck top SG10202102718XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020054848A JP7437991B2 (en) 2020-03-25 2020-03-25 Inspection device and chuck top position adjustment method

Publications (1)

Publication Number Publication Date
SG10202102718XA true SG10202102718XA (en) 2021-10-28

Family

ID=77855771

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202102718X SG10202102718XA (en) 2020-03-25 2021-03-17 Inspection apparatus and method of adjusting position of chuck top

Country Status (5)

Country Link
US (1) US11454667B2 (en)
JP (1) JP7437991B2 (en)
KR (2) KR20210119891A (en)
CN (1) CN113514745A (en)
SG (1) SG10202102718XA (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11650246B1 (en) * 2022-02-02 2023-05-16 Western Digital Technologies, Inc. Localized onboard socket heating elements for burn-in test boards

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6362245A (en) * 1986-09-02 1988-03-18 Canon Inc Wafer prober
KR100536610B1 (en) * 2003-08-29 2005-12-14 삼성전자주식회사 Apparatus For Calibrating Probe Station
KR101007871B1 (en) 2008-08-20 2011-01-14 주식회사 쎄믹스 Apparatus and method of correcting planarity between prob card and chuck plate
KR101028433B1 (en) * 2008-11-20 2011-04-15 주식회사 쎄믹스 Wafer probe station and method thereof
JP5941713B2 (en) 2012-03-14 2016-06-29 東京エレクトロン株式会社 Wafer inspection interface and wafer inspection apparatus
JP6041175B2 (en) 2015-03-30 2016-12-07 株式会社東京精密 Prober
JP6652361B2 (en) * 2015-09-30 2020-02-19 東京エレクトロン株式会社 Wafer inspection apparatus and wafer inspection method
JP6823986B2 (en) 2016-09-28 2021-02-03 東京エレクトロン株式会社 Board inspection equipment and board inspection method

Also Published As

Publication number Publication date
JP2021158156A (en) 2021-10-07
CN113514745A (en) 2021-10-19
KR20230170885A (en) 2023-12-19
US20210302492A1 (en) 2021-09-30
JP7437991B2 (en) 2024-02-26
US11454667B2 (en) 2022-09-27
KR20210119891A (en) 2021-10-06

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