SG10202010943TA - Cutting apparatus - Google Patents

Cutting apparatus

Info

Publication number
SG10202010943TA
SG10202010943TA SG10202010943TA SG10202010943TA SG10202010943TA SG 10202010943T A SG10202010943T A SG 10202010943TA SG 10202010943T A SG10202010943T A SG 10202010943TA SG 10202010943T A SG10202010943T A SG 10202010943TA SG 10202010943T A SG10202010943T A SG 10202010943TA
Authority
SG
Singapore
Prior art keywords
cutting apparatus
cutting
Prior art date
Application number
SG10202010943TA
Inventor
Nitta Shuji
Yuzawa Harunobu
Matsushita Yoshio
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10202010943TA publication Critical patent/SG10202010943TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/005—Computer numerical control means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/143—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • General Engineering & Computer Science (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Details Of Cutting Devices (AREA)
  • Crushing And Pulverization Processes (AREA)
SG10202010943TA 2019-11-27 2020-11-03 Cutting apparatus SG10202010943TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019214138A JP7387408B2 (en) 2019-11-27 2019-11-27 cutting equipment

Publications (1)

Publication Number Publication Date
SG10202010943TA true SG10202010943TA (en) 2021-06-29

Family

ID=75973628

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202010943TA SG10202010943TA (en) 2019-11-27 2020-11-03 Cutting apparatus

Country Status (7)

Country Link
US (1) US11161268B2 (en)
JP (1) JP7387408B2 (en)
KR (1) KR20210065845A (en)
CN (1) CN112847850A (en)
MY (1) MY197789A (en)
SG (1) SG10202010943TA (en)
TW (1) TW202120258A (en)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6030326A (en) * 1997-06-05 2000-02-29 Tokyo Seimitsu Co., Ltd. Automatic blade changing system
JP2002154054A (en) 2000-11-17 2002-05-28 Disco Abrasive Syst Ltd Attaching mechanism for cutting blade
JP2009194326A (en) 2008-02-18 2009-08-27 Disco Abrasive Syst Ltd Processing device
JP2009255242A (en) 2008-04-18 2009-11-05 Disco Abrasive Syst Ltd Suction device, retaining table, conveying device, workpiece machining device, and method for machining workpiece
JP5326537B2 (en) 2008-12-12 2013-10-30 株式会社ジェイテクト Operation board
JP5908757B2 (en) 2012-03-14 2016-04-26 株式会社ディスコ Pass / fail judgment method for holding table
US20140341796A1 (en) 2013-05-20 2014-11-20 Veeco Instruments, Inc. Dual-side wafer bar grinding
JP6108999B2 (en) * 2013-07-18 2017-04-05 株式会社ディスコ Cutting equipment
JP6069122B2 (en) * 2013-07-22 2017-02-01 株式会社ディスコ Cutting equipment
JP2016132046A (en) * 2015-01-16 2016-07-25 株式会社ディスコ Mount flange
WO2017004131A1 (en) * 2015-06-30 2017-01-05 Techtronic Industries Co. Ltd. Vacuum cleaner with brushroll control
JP6847512B2 (en) 2016-12-14 2021-03-24 株式会社ディスコ Cutting equipment and cutting method
JP7019241B2 (en) * 2017-09-21 2022-02-15 株式会社ディスコ Cutting blade mounting mechanism

Also Published As

Publication number Publication date
JP7387408B2 (en) 2023-11-28
TW202120258A (en) 2021-06-01
KR20210065845A (en) 2021-06-04
JP2021084163A (en) 2021-06-03
MY197789A (en) 2023-07-14
US11161268B2 (en) 2021-11-02
US20210154874A1 (en) 2021-05-27
CN112847850A (en) 2021-05-28

Similar Documents

Publication Publication Date Title
SG10201906208VA (en) Cutting apparatus
SG10202003857QA (en) Cutting apparatus
GB201917727D0 (en) Apparatus
EP3603907A4 (en) Cutting apparatus
GB202405245D0 (en) Cutting device
GB201906801D0 (en) Perforating apparatus
KR102053876B9 (en) Cutting device
SG11202111411VA (en) Body-positioning apparatus
GB201904079D0 (en) Apparatus
GB202016842D0 (en) Multi-Gym apparatus
SG10201911503TA (en) Cutting apparatus
GB202007971D0 (en) Hair0styling apparatus
CA188555S (en) Food cutting apparatus
PL3785543T3 (en) Cutting device
EP3924595C0 (en) Pipe cutting apparatus
GB202111099D0 (en) Light-emiting apparatus
HUE062020T2 (en) Cutting unit
ZA201906197B (en) Cutting apparatus
GB201914997D0 (en) Apparatus
GB201814727D0 (en) Cutting apparatus
ZA201906316B (en) Cutting apparatus
GB201918864D0 (en) Apparatus
GB201913436D0 (en) Cutting block
GB201907188D0 (en) Apparatus
GB201905243D0 (en) Radiotherepy apparatus