SG10202002172TA - Sealable sheet - Google Patents

Sealable sheet

Info

Publication number
SG10202002172TA
SG10202002172TA SG10202002172TA SG10202002172TA SG10202002172TA SG 10202002172T A SG10202002172T A SG 10202002172TA SG 10202002172T A SG10202002172T A SG 10202002172TA SG 10202002172T A SG10202002172T A SG 10202002172TA SG 10202002172T A SG10202002172T A SG 10202002172TA
Authority
SG
Singapore
Prior art keywords
sealable sheet
sealable
sheet
Prior art date
Application number
SG10202002172TA
Inventor
Iino Chie
OHARA Yasumichi
Shimizu Yuusaku
Habu Takashi
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG10202002172TA publication Critical patent/SG10202002172TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
SG10202002172TA 2019-03-19 2020-03-10 Sealable sheet SG10202002172TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019051362A JP7343989B2 (en) 2019-03-19 2019-03-19 Sealing sheet

Publications (1)

Publication Number Publication Date
SG10202002172TA true SG10202002172TA (en) 2020-10-29

Family

ID=72559682

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202002172TA SG10202002172TA (en) 2019-03-19 2020-03-10 Sealable sheet

Country Status (4)

Country Link
JP (1) JP7343989B2 (en)
CN (1) CN111716848A (en)
SG (1) SG10202002172TA (en)
TW (1) TW202040758A (en)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4383768B2 (en) 2003-04-23 2009-12-16 スリーエム イノベイティブ プロパティズ カンパニー Film adhesive for sealing, film laminate for sealing, and sealing method
JP4872587B2 (en) * 2006-10-12 2012-02-08 日立化成工業株式会社 Sealing film and semiconductor device using the same
JP2009097014A (en) * 2007-09-27 2009-05-07 Hitachi Chem Co Ltd Liquid resin composition for sealing, electronic component device and wafer level chip size package
JP2009141020A (en) * 2007-12-04 2009-06-25 Furukawa Electric Co Ltd:The Electronic component sealing sheet
JP5918943B2 (en) * 2011-08-10 2016-05-18 味の素株式会社 Manufacturing method of semiconductor package
KR101906408B1 (en) * 2011-10-04 2018-10-11 삼성전자주식회사 Semiconductor package and method of manufacturing the same
JP5921927B2 (en) * 2012-03-27 2016-05-24 日東電工株式会社 Heat release type adhesive sheet
JP6393092B2 (en) * 2013-08-07 2018-09-19 日東電工株式会社 Hollow type electronic device sealing resin sheet and method for producing hollow type electronic device package
JP6274784B2 (en) * 2013-08-26 2018-02-07 日東電工株式会社 Resin sheet for sealing electronic device and method for manufacturing electronic device package
JP2017163105A (en) 2016-03-11 2017-09-14 日東電工株式会社 Optical semiconductor device covering sheet, adhesion layer-covering layer-attached optical semiconductor device and manufacturing method thereof, and method for manufacturing adhesion layer-attached optical semiconductor device
JP6524003B2 (en) * 2016-03-17 2019-06-05 東芝メモリ株式会社 Semiconductor device
JP6933463B2 (en) * 2016-12-28 2021-09-08 日東電工株式会社 Resin sheet
JP6995505B2 (en) * 2017-06-22 2022-01-14 日東電工株式会社 Dicing die bond film

Also Published As

Publication number Publication date
JP2020155534A (en) 2020-09-24
TW202040758A (en) 2020-11-01
JP7343989B2 (en) 2023-09-13
CN111716848A (en) 2020-09-29

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