SG10202000335VA - Manufacturing method for multiple MEMS sound transducers - Google Patents
Manufacturing method for multiple MEMS sound transducersInfo
- Publication number
- SG10202000335VA SG10202000335VA SG10202000335VA SG10202000335VA SG10202000335VA SG 10202000335V A SG10202000335V A SG 10202000335VA SG 10202000335V A SG10202000335V A SG 10202000335VA SG 10202000335V A SG10202000335V A SG 10202000335VA SG 10202000335V A SG10202000335V A SG 10202000335VA
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- sound transducers
- mems sound
- multiple mems
- transducers
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/02—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Micromachines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102019101227 | 2019-01-17 | ||
| DE102019101325.9A DE102019101325A1 (en) | 2019-01-17 | 2019-01-18 | Manufacturing process for multiple MEMS transducers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10202000335VA true SG10202000335VA (en) | 2020-08-28 |
Family
ID=71402642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10202000335VA SG10202000335VA (en) | 2019-01-17 | 2020-01-14 | Manufacturing method for multiple MEMS sound transducers |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11375317B2 (en) |
| EP (1) | EP3684081B1 (en) |
| KR (1) | KR20200090124A (en) |
| CN (1) | CN111439719A (en) |
| AU (1) | AU2020200291A1 (en) |
| CA (1) | CA3068717A1 (en) |
| DE (1) | DE102019101325A1 (en) |
| SG (1) | SG10202000335VA (en) |
| TW (1) | TW202104067A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202023102447U1 (en) | 2023-05-05 | 2023-06-23 | Technische Universität Chemnitz, Körperschaft des öffentlichen Rechts | Micromechanical ultrasonic transducer |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6953977B2 (en) * | 2000-02-08 | 2005-10-11 | Boston Microsystems, Inc. | Micromechanical piezoelectric device |
| US7420317B2 (en) * | 2004-10-15 | 2008-09-02 | Fujifilm Dimatix, Inc. | Forming piezoelectric actuators |
| JP2006245098A (en) * | 2005-03-01 | 2006-09-14 | Seiko Epson Corp | Electronic component and manufacturing method thereof, and electronic apparatus |
| DE102006032925B8 (en) * | 2006-07-15 | 2008-11-06 | Schott Ag | Electronic assembly and method for encapsulating electronic components and integrated circuits |
| US8215176B2 (en) * | 2009-05-27 | 2012-07-10 | Continental Automotive Systems, Inc. | Pressure sensor for harsh media sensing and flexible packaging |
| US8585187B2 (en) * | 2011-04-29 | 2013-11-19 | Xerox Corporation | High density electrical interconnect for printing devices using flex circuits and dielectric underfill |
| US8811636B2 (en) * | 2011-11-29 | 2014-08-19 | Qualcomm Mems Technologies, Inc. | Microspeaker with piezoelectric, metal and dielectric membrane |
| US9584889B2 (en) | 2013-08-27 | 2017-02-28 | Infineon Technologies Ag | System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille |
| US9584886B2 (en) | 2014-07-16 | 2017-02-28 | Htc Corporation | Micro-speaker |
| CN105493520B (en) * | 2014-08-26 | 2020-05-15 | 歌尔股份有限公司 | Fully wafer-level packaged MEMS microphone and method of manufacturing the same |
| WO2016042928A1 (en) * | 2014-09-19 | 2016-03-24 | 日本電波工業株式会社 | Piezoelectric device and method for manufacturing same |
| US9701534B2 (en) * | 2015-01-28 | 2017-07-11 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming MEMS package |
| DE102015107560A1 (en) * | 2015-05-13 | 2016-11-17 | USound GmbH | Sound transducer arrangement with MEMS sound transducer |
| DE102015107557A1 (en) | 2015-05-13 | 2016-11-17 | USound GmbH | Circuit board module with a continuous recess and related sound transducer arrangement and manufacturing method |
| US9761571B2 (en) * | 2015-09-17 | 2017-09-12 | Deca Technologies Inc. | Thermally enhanced fully molded fan-out module |
| DE102015116640A1 (en) | 2015-10-01 | 2017-04-06 | USound GmbH | MEMS printed circuit board module with integrated piezoelectric structure and sound transducer arrangement |
| US20170133334A1 (en) * | 2015-11-09 | 2017-05-11 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
| US10840430B2 (en) * | 2016-06-30 | 2020-11-17 | Intel Corporation | Piezoelectric package-integrated sensing devices |
| US10163834B2 (en) * | 2016-09-09 | 2018-12-25 | Powertech Technology Inc. | Chip package structure comprising encapsulant having concave surface |
| US11049734B2 (en) * | 2016-11-29 | 2021-06-29 | Pep Innovation Pte. Ltd. | Method of packaging chip and chip package structure |
| DE102017207887B3 (en) | 2017-05-10 | 2018-10-31 | Infineon Technologies Ag | Process for fabricating packaged MEMS devices at wafer level |
| US10822224B2 (en) * | 2017-10-18 | 2020-11-03 | Nxp Usa, Inc. | Packaged pressure sensor device |
| US11114315B2 (en) * | 2017-11-29 | 2021-09-07 | Pep Innovation Pte. Ltd. | Chip packaging method and package structure |
| CN208300025U (en) * | 2018-06-25 | 2018-12-28 | 歌尔股份有限公司 | MEMS piezoelectric microphones |
-
2019
- 2019-01-18 DE DE102019101325.9A patent/DE102019101325A1/en active Pending
-
2020
- 2020-01-08 CN CN202010017889.XA patent/CN111439719A/en active Pending
- 2020-01-14 SG SG10202000335VA patent/SG10202000335VA/en unknown
- 2020-01-15 AU AU2020200291A patent/AU2020200291A1/en not_active Abandoned
- 2020-01-15 TW TW109101353A patent/TW202104067A/en unknown
- 2020-01-16 EP EP20152246.3A patent/EP3684081B1/en active Active
- 2020-01-16 CA CA3068717A patent/CA3068717A1/en not_active Abandoned
- 2020-01-16 KR KR1020200006087A patent/KR20200090124A/en unknown
- 2020-01-17 US US16/745,959 patent/US11375317B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20200090124A (en) | 2020-07-28 |
| TW202104067A (en) | 2021-02-01 |
| US20200236467A1 (en) | 2020-07-23 |
| DE102019101325A1 (en) | 2020-07-23 |
| EP3684081A1 (en) | 2020-07-22 |
| AU2020200291A1 (en) | 2020-08-06 |
| US11375317B2 (en) | 2022-06-28 |
| EP3684081B1 (en) | 2022-04-27 |
| CA3068717A1 (en) | 2020-07-17 |
| CN111439719A (en) | 2020-07-24 |
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