SG10201913343PA - Method of processing workpiece - Google Patents
Method of processing workpieceInfo
- Publication number
- SG10201913343PA SG10201913343PA SG10201913343PA SG10201913343PA SG10201913343PA SG 10201913343P A SG10201913343P A SG 10201913343PA SG 10201913343P A SG10201913343P A SG 10201913343PA SG 10201913343P A SG10201913343P A SG 10201913343PA SG 10201913343P A SG10201913343P A SG 10201913343PA
- Authority
- SG
- Singapore
- Prior art keywords
- processing workpiece
- workpiece
- processing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019005776A JP7118558B2 (en) | 2019-01-17 | 2019-01-17 | Workpiece processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201913343PA true SG10201913343PA (en) | 2020-08-28 |
Family
ID=71402706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201913343PA SG10201913343PA (en) | 2019-01-17 | 2019-12-26 | Method of processing workpiece |
Country Status (6)
Country | Link |
---|---|
US (1) | US11471991B2 (en) |
JP (1) | JP7118558B2 (en) |
KR (1) | KR20200089600A (en) |
CN (1) | CN111438580B (en) |
DE (1) | DE102020200540A1 (en) |
SG (1) | SG10201913343PA (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4144480B1 (en) * | 2021-09-01 | 2024-01-31 | Siltronic AG | Method of grinding semiconductor wafers |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100550491B1 (en) * | 2003-05-06 | 2006-02-09 | 스미토모덴키고교가부시키가이샤 | Nitride semiconductor substrate and processing method of nitride semiconductor substrate |
JP4464113B2 (en) * | 2003-11-27 | 2010-05-19 | 株式会社ディスコ | Wafer processing equipment |
JP4758222B2 (en) | 2005-12-21 | 2011-08-24 | 株式会社ディスコ | Wafer processing method and apparatus |
JP2007235069A (en) * | 2006-03-03 | 2007-09-13 | Tokyo Seimitsu Co Ltd | Wafer machining method |
JP5406676B2 (en) | 2009-11-10 | 2014-02-05 | 株式会社ディスコ | Wafer processing equipment |
JP5679183B2 (en) | 2011-01-21 | 2015-03-04 | 株式会社ディスコ | Hard substrate grinding method |
JP6425505B2 (en) * | 2014-11-17 | 2018-11-21 | 株式会社ディスコ | Grinding method of workpiece |
JP2017056522A (en) * | 2015-09-17 | 2017-03-23 | 株式会社ディスコ | Grinding wheel and grinding method |
JP6704275B2 (en) * | 2016-03-28 | 2020-06-03 | 株式会社ディスコ | Device wafer evaluation method |
JP6792363B2 (en) * | 2016-07-22 | 2020-11-25 | 株式会社ディスコ | Grinding device |
JP6856335B2 (en) * | 2016-09-06 | 2021-04-07 | 株式会社ディスコ | Processing equipment |
JP6732382B2 (en) * | 2016-10-12 | 2020-07-29 | 株式会社ディスコ | Processing device and method of processing workpiece |
-
2019
- 2019-01-17 JP JP2019005776A patent/JP7118558B2/en active Active
- 2019-12-23 KR KR1020190172781A patent/KR20200089600A/en not_active Application Discontinuation
- 2019-12-26 SG SG10201913343PA patent/SG10201913343PA/en unknown
-
2020
- 2020-01-13 CN CN202010030425.2A patent/CN111438580B/en active Active
- 2020-01-15 US US16/743,269 patent/US11471991B2/en active Active
- 2020-01-17 DE DE102020200540.0A patent/DE102020200540A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2020110906A (en) | 2020-07-27 |
US20200230773A1 (en) | 2020-07-23 |
KR20200089600A (en) | 2020-07-27 |
DE102020200540A1 (en) | 2020-07-23 |
CN111438580A (en) | 2020-07-24 |
JP7118558B2 (en) | 2022-08-16 |
TW202042967A (en) | 2020-12-01 |
US11471991B2 (en) | 2022-10-18 |
CN111438580B (en) | 2023-09-19 |
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