SG10201912468VA - End effector measuring module and end effector monitoring apparatus using the same - Google Patents

End effector measuring module and end effector monitoring apparatus using the same

Info

Publication number
SG10201912468VA
SG10201912468VA SG10201912468VA SG10201912468VA SG10201912468VA SG 10201912468V A SG10201912468V A SG 10201912468VA SG 10201912468V A SG10201912468V A SG 10201912468VA SG 10201912468V A SG10201912468V A SG 10201912468VA SG 10201912468V A SG10201912468V A SG 10201912468VA
Authority
SG
Singapore
Prior art keywords
end effector
same
monitoring apparatus
measuring module
measuring
Prior art date
Application number
SG10201912468VA
Inventor
Kyu Ok Lee
Jin Hee Lim
Original Assignee
Kyu Ok Lee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyu Ok Lee filed Critical Kyu Ok Lee
Publication of SG10201912468VA publication Critical patent/SG10201912468VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/088—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices with position, velocity or acceleration sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/087—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices for sensing other physical parameters, e.g. electrical or chemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
    • B25J9/1664—Programme controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
SG10201912468VA 2019-02-22 2019-12-18 End effector measuring module and end effector monitoring apparatus using the same SG10201912468VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190021277A KR102020533B1 (en) 2019-02-22 2019-02-22 End effector detecting module and end effector monitoring device using the same

Publications (1)

Publication Number Publication Date
SG10201912468VA true SG10201912468VA (en) 2020-09-29

Family

ID=67951026

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201912468VA SG10201912468VA (en) 2019-02-22 2019-12-18 End effector measuring module and end effector monitoring apparatus using the same

Country Status (5)

Country Link
US (1) US11772278B2 (en)
KR (1) KR102020533B1 (en)
CN (1) CN215183865U (en)
SG (1) SG10201912468VA (en)
WO (1) WO2020171350A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102020533B1 (en) * 2019-02-22 2019-09-10 임진희 End effector detecting module and end effector monitoring device using the same
KR102694325B1 (en) * 2021-12-21 2024-08-09 이규옥 FOUP with end effector detection sensor and integrated data management system thereof
KR102669767B1 (en) * 2022-04-01 2024-05-28 주식회사 유진테크 Substrate transfer device and method for determining abnormality of substrate transfer device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8041450B2 (en) * 2007-10-04 2011-10-18 Asm Japan K.K. Position sensor system for substrate transfer robot
JP2009135276A (en) * 2007-11-30 2009-06-18 Panasonic Corp Substrate carrier
US7963736B2 (en) * 2008-04-03 2011-06-21 Asm Japan K.K. Wafer processing apparatus with wafer alignment device
KR101385594B1 (en) * 2012-09-28 2014-04-15 삼성디스플레이 주식회사 Automated transportation system being feasible auto correction and teaching loading, and control method thereof
KR101613135B1 (en) 2012-10-29 2016-04-18 로제 가부시키가이샤 Device and method for detecting position of semiconductor substrate
US10228303B2 (en) * 2014-03-31 2019-03-12 Automation Controls & Engineering, LLC Flexible automation cell for performing secondary operations in concert with a machining center and roll check operations
KR102073728B1 (en) * 2014-11-26 2020-02-05 주식회사 원익아이피에스 Apparatus for transfering substrate and method for transfering the same
KR101620545B1 (en) * 2015-02-11 2016-05-13 국제엘렉트릭코리아 주식회사 Substrate aligning device, gate Valve And Cluster Apparatus Including The Same
JP6528525B2 (en) * 2015-04-27 2019-06-12 セイコーエプソン株式会社 Robot and robot system
DE102015012961B4 (en) * 2015-10-08 2022-05-05 Kastanienbaum GmbH robotic system
US10796940B2 (en) * 2018-11-05 2020-10-06 Lam Research Corporation Enhanced automatic wafer centering system and techniques for same
US11148289B1 (en) * 2019-01-08 2021-10-19 Amazon Technologies, Inc. Entanglement end effector for autonomous object retrieval
KR102020533B1 (en) * 2019-02-22 2019-09-10 임진희 End effector detecting module and end effector monitoring device using the same

Also Published As

Publication number Publication date
WO2020171350A1 (en) 2020-08-27
US11772278B2 (en) 2023-10-03
CN215183865U (en) 2021-12-14
US20210252717A1 (en) 2021-08-19
KR102020533B1 (en) 2019-09-10

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