SG10201908976QA - Barrier slurry removal rate improvement - Google Patents
Barrier slurry removal rate improvementInfo
- Publication number
- SG10201908976QA SG10201908976QA SG10201908976QA SG10201908976QA SG10201908976QA SG 10201908976Q A SG10201908976Q A SG 10201908976QA SG 10201908976Q A SG10201908976Q A SG 10201908976QA SG 10201908976Q A SG10201908976Q A SG 10201908976QA SG 10201908976Q A SG10201908976Q A SG 10201908976QA
- Authority
- SG
- Singapore
- Prior art keywords
- removal rate
- rate improvement
- slurry removal
- barrier slurry
- barrier
- Prior art date
Links
- 230000004888 barrier function Effects 0.000 title 1
- 239000002002 slurry Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Treatment Of Sludge (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862738427P | 2018-09-28 | 2018-09-28 | |
US16/577,580 US20200102476A1 (en) | 2018-09-28 | 2019-09-20 | Barrier Slurry Removal Rate Improvement |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201908976QA true SG10201908976QA (en) | 2020-04-29 |
Family
ID=68084726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201908976QA SG10201908976QA (en) | 2018-09-28 | 2019-09-26 | Barrier slurry removal rate improvement |
Country Status (7)
Country | Link |
---|---|
US (1) | US20200102476A1 (en) |
EP (1) | EP3628714B1 (en) |
JP (1) | JP7048550B2 (en) |
KR (1) | KR102406821B1 (en) |
CN (1) | CN111087929A (en) |
SG (1) | SG10201908976QA (en) |
TW (1) | TWI796520B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113122143B (en) * | 2019-12-31 | 2024-03-08 | 安集微电子(上海)有限公司 | Chemical mechanical polishing solution and application thereof in copper polishing |
WO2021162978A1 (en) * | 2020-02-13 | 2021-08-19 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of use thereof |
US20210301405A1 (en) * | 2020-03-25 | 2021-09-30 | Versum Materials Us, Llc | Barrier Chemical Mechanical Planarization Slurries For Cobalt Films |
EP4214286A1 (en) | 2020-09-18 | 2023-07-26 | CMC Materials, Inc. | Silica-based slurry for selective polishing of carbon-based films |
CN114686113A (en) * | 2020-12-30 | 2022-07-01 | 安集微电子科技(上海)股份有限公司 | Chemical mechanical polishing solution and using method thereof |
CN115197645B (en) * | 2021-04-02 | 2024-02-20 | Sk恩普士有限公司 | Polishing composition for semiconductor process and method for manufacturing semiconductor device |
WO2023004269A1 (en) * | 2021-07-23 | 2023-01-26 | Versum Materials Us, Llc | Pad-in-a-bottle (pib) technology for copper barrier slurries |
CN115386302B (en) * | 2022-08-23 | 2023-06-02 | 常州时创能源股份有限公司 | Additive for silicon wafer back polishing and application thereof |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU6537000A (en) * | 1999-08-13 | 2001-03-13 | Cabot Microelectronics Corporation | Polishing system with stopping compound and method of its use |
US7491252B2 (en) | 2002-03-25 | 2009-02-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Tantalum barrier removal solution |
ATE403936T1 (en) * | 2002-04-30 | 2008-08-15 | Hitachi Chemical Co Ltd | POLISHING FLUID AND POLISHING PROCESS |
US7186653B2 (en) * | 2003-07-30 | 2007-03-06 | Climax Engineered Materials, Llc | Polishing slurries and methods for chemical mechanical polishing |
WO2006133249A2 (en) * | 2005-06-06 | 2006-12-14 | Advanced Technology Materials, Inc. | Integrated chemical mechanical polishing composition and process for single platen processing |
CN101153205A (en) * | 2006-09-29 | 2008-04-02 | 安集微电子(上海)有限公司 | Chemical mechanical polishing solution for polishing low dielectric materials |
US20080149884A1 (en) * | 2006-12-21 | 2008-06-26 | Junaid Ahmed Siddiqui | Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing |
JP2009094430A (en) * | 2007-10-12 | 2009-04-30 | Adeka Corp | Polishing composition for cmp |
JP5371416B2 (en) * | 2008-12-25 | 2013-12-18 | 富士フイルム株式会社 | Polishing liquid and polishing method |
US9735030B2 (en) * | 2014-09-05 | 2017-08-15 | Fujifilm Planar Solutions, LLC | Polishing compositions and methods for polishing cobalt films |
US10570313B2 (en) * | 2015-02-12 | 2020-02-25 | Versum Materials Us, Llc | Dishing reducing in tungsten chemical mechanical polishing |
US10144850B2 (en) * | 2015-09-25 | 2018-12-04 | Versum Materials Us, Llc | Stop-on silicon containing layer additive |
JP6797811B2 (en) * | 2015-09-30 | 2020-12-09 | 株式会社フジミインコーポレーテッド | Polishing method |
US20190256741A1 (en) * | 2016-06-09 | 2019-08-22 | Hitachi Chemical Company, Ltd. | Cmp polishing solution and polishing method |
US10253216B2 (en) * | 2016-07-01 | 2019-04-09 | Versum Materials Us, Llc | Additives for barrier chemical mechanical planarization |
-
2019
- 2019-09-20 US US16/577,580 patent/US20200102476A1/en active Pending
- 2019-09-24 TW TW108134378A patent/TWI796520B/en active
- 2019-09-26 SG SG10201908976QA patent/SG10201908976QA/en unknown
- 2019-09-27 KR KR1020190119819A patent/KR102406821B1/en active IP Right Grant
- 2019-09-27 JP JP2019176657A patent/JP7048550B2/en active Active
- 2019-09-29 CN CN201910932623.5A patent/CN111087929A/en active Pending
- 2019-09-30 EP EP19200329.1A patent/EP3628714B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN111087929A (en) | 2020-05-01 |
JP2020059847A (en) | 2020-04-16 |
EP3628714A1 (en) | 2020-04-01 |
TW202014487A (en) | 2020-04-16 |
KR102406821B1 (en) | 2022-06-10 |
KR20200036790A (en) | 2020-04-07 |
TWI796520B (en) | 2023-03-21 |
EP3628714B1 (en) | 2022-06-15 |
US20200102476A1 (en) | 2020-04-02 |
JP7048550B2 (en) | 2022-04-05 |
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