SG10201809087UA - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
SG10201809087UA
SG10201809087UA SG10201809087UA SG10201809087UA SG10201809087UA SG 10201809087U A SG10201809087U A SG 10201809087UA SG 10201809087U A SG10201809087U A SG 10201809087UA SG 10201809087U A SG10201809087U A SG 10201809087UA SG 10201809087U A SG10201809087U A SG 10201809087UA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
tutlive
tif7ka
rybcitml
oftra
Prior art date
Application number
SG10201809087UA
Inventor
Takahashi Nobuyuki
Kimba Toshifumi
Kinoshita Masaki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201809087UA publication Critical patent/SG10201809087UA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • B24B37/013Devices or means for detecting lapping completion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/205Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G01B11/0633Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection using one or more discrete wavelengths
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/02Details
    • G01J3/0205Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
    • G01J3/0218Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows using optical fibers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/02Details
    • G01J3/0291Housings; Spectrometer accessories; Spatial arrangement of elements, e.g. folded path arrangements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/02Details
    • G01J3/10Arrangements of light sources specially adapted for spectrometry or colorimetry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/28Investigating the spectrum
    • G01J3/42Absorption spectrometry; Double beam spectrometry; Flicker spectrometry; Reflection spectrometry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/8422Investigating thin films, e.g. matrix isolation method
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers

Abstract

M;i - ; 0 7r• - i ffri•VE YUP,Mac tif7Ka, fr,@ ---. —7ML - lilt 1-1„ RybcitML - t-ke t-,-_,,<— L , )1(, • - M1 — • 6 \"-- :/ . 7°A .- U, -/<---- : - _*)%wrC ,- __ - iv •friti- 6 tutLiVE- ,;_ , --.ii, L tit'. -f<- - . H:, YON, - ;--- ii/ - gts'R46 4 7°0 - Aftoycjp,,;.. , --) 1/0 - ) 0 - 111A:-tigi` it6J 1 3t-/<— -- eb 9 , -‹—a, A - -r<—:-5`( - t -- 4 - 6)`0E,;-- — il , oftra_A6751 - 67 2 tY).g>1315.6 1 )*Z. , 1 A\" -- J • 6o 18
SG10201809087UA 2017-10-19 2018-10-16 Polishing apparatus SG10201809087UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017202848A JP6902452B2 (en) 2017-10-19 2017-10-19 Polishing equipment

Publications (1)

Publication Number Publication Date
SG10201809087UA true SG10201809087UA (en) 2019-05-30

Family

ID=66169115

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201809087UA SG10201809087UA (en) 2017-10-19 2018-10-16 Polishing apparatus

Country Status (3)

Country Link
US (1) US11413720B2 (en)
JP (1) JP6902452B2 (en)
SG (1) SG10201809087UA (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117086736B (en) * 2023-10-20 2023-12-26 南通南洋照明科技有限公司 Mirror polishing device for manufacturing LED lamp

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3932836B2 (en) * 2001-07-27 2007-06-20 株式会社日立製作所 Thin film thickness measuring method and apparatus, and device manufacturing method using the same
JP4279738B2 (en) * 2004-07-22 2009-06-17 リンテック株式会社 UV irradiation equipment
US7409260B2 (en) 2005-08-22 2008-08-05 Applied Materials, Inc. Substrate thickness measuring during polishing
CN102490112B (en) * 2006-10-06 2015-03-25 株式会社荏原制作所 Processing end point detecting method, polishing method and polishing apparatus
KR101678082B1 (en) * 2007-02-23 2016-11-21 어플라이드 머티어리얼스, 인코포레이티드 Using spectra to determine polishing endpoints
KR20110118815A (en) 2009-02-13 2011-11-01 엑셀리타스 테크놀로지스 엘이디 솔루션스, 인크. Led illumination device
JP6039545B2 (en) * 2010-05-05 2016-12-07 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Dynamic or adaptive tracking of spectral features for endpoint detection
JP5980476B2 (en) * 2010-12-27 2016-08-31 株式会社荏原製作所 Polishing apparatus and polishing method
KR101187453B1 (en) 2011-01-25 2012-10-02 김용태 Optically transmittable Sheet including optical fiber cable, Method and Apparatus for detecting end point in CMP process using thereof
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
JP5941763B2 (en) * 2012-06-15 2016-06-29 株式会社荏原製作所 Polishing method
JP6046933B2 (en) * 2012-07-10 2016-12-21 株式会社荏原製作所 Polishing method
US9095952B2 (en) 2013-01-23 2015-08-04 Applied Materials, Inc. Reflectivity measurements during polishing using a camera
JP6473050B2 (en) * 2015-06-05 2019-02-20 株式会社荏原製作所 Polishing equipment
JP6475604B2 (en) * 2015-11-24 2019-02-27 株式会社荏原製作所 Polishing method
JP6846605B2 (en) * 2016-03-17 2021-03-24 パナソニックIpマネジメント株式会社 Fiber coupling device

Also Published As

Publication number Publication date
JP6902452B2 (en) 2021-07-14
US20190118331A1 (en) 2019-04-25
JP2019075526A (en) 2019-05-16
US11413720B2 (en) 2022-08-16

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