SG10201809087UA - Polishing apparatus - Google Patents
Polishing apparatusInfo
- Publication number
- SG10201809087UA SG10201809087UA SG10201809087UA SG10201809087UA SG10201809087UA SG 10201809087U A SG10201809087U A SG 10201809087UA SG 10201809087U A SG10201809087U A SG 10201809087UA SG 10201809087U A SG10201809087U A SG 10201809087UA SG 10201809087U A SG10201809087U A SG 10201809087UA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing apparatus
- tutlive
- tif7ka
- rybcitml
- oftra
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
- G01B11/0633—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection using one or more discrete wavelengths
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
- G01J3/0218—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows using optical fibers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0291—Housings; Spectrometer accessories; Spatial arrangement of elements, e.g. folded path arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/10—Arrangements of light sources specially adapted for spectrometry or colorimetry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/42—Absorption spectrometry; Double beam spectrometry; Flicker spectrometry; Reflection spectrometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/8422—Investigating thin films, e.g. matrix isolation method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
Abstract
M;i - ; 0 7r• - i ffri•VE YUP,Mac tif7Ka, fr,@ ---. —7ML - lilt 1-1„ RybcitML - t-ke t-,-_,,<— L , )1(, • - M1 — • 6 \"-- :/ . 7°A .- U, -/<---- : - _*)%wrC ,- __ - iv •friti- 6 tutLiVE- ,;_ , --.ii, L tit'. -f<- - . H:, YON, - ;--- ii/ - gts'R46 4 7°0 - Aftoycjp,,;.. , --) 1/0 - ) 0 - 111A:-tigi` it6J 1 3t-/<— -- eb 9 , -‹—a, A - -r<—:-5`( - t -- 4 - 6)`0E,;-- — il , oftra_A6751 - 67 2 tY).g>1315.6 1 )*Z. , 1 A\" -- J • 6o 18
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017202848A JP6902452B2 (en) | 2017-10-19 | 2017-10-19 | Polishing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201809087UA true SG10201809087UA (en) | 2019-05-30 |
Family
ID=66169115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201809087UA SG10201809087UA (en) | 2017-10-19 | 2018-10-16 | Polishing apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | US11413720B2 (en) |
JP (1) | JP6902452B2 (en) |
SG (1) | SG10201809087UA (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117086736B (en) * | 2023-10-20 | 2023-12-26 | 南通南洋照明科技有限公司 | Mirror polishing device for manufacturing LED lamp |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3932836B2 (en) * | 2001-07-27 | 2007-06-20 | 株式会社日立製作所 | Thin film thickness measuring method and apparatus, and device manufacturing method using the same |
JP4279738B2 (en) * | 2004-07-22 | 2009-06-17 | リンテック株式会社 | UV irradiation equipment |
US7409260B2 (en) | 2005-08-22 | 2008-08-05 | Applied Materials, Inc. | Substrate thickness measuring during polishing |
CN102490112B (en) * | 2006-10-06 | 2015-03-25 | 株式会社荏原制作所 | Processing end point detecting method, polishing method and polishing apparatus |
KR101678082B1 (en) * | 2007-02-23 | 2016-11-21 | 어플라이드 머티어리얼스, 인코포레이티드 | Using spectra to determine polishing endpoints |
KR20110118815A (en) | 2009-02-13 | 2011-11-01 | 엑셀리타스 테크놀로지스 엘이디 솔루션스, 인크. | Led illumination device |
JP6039545B2 (en) * | 2010-05-05 | 2016-12-07 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Dynamic or adaptive tracking of spectral features for endpoint detection |
JP5980476B2 (en) * | 2010-12-27 | 2016-08-31 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
KR101187453B1 (en) | 2011-01-25 | 2012-10-02 | 김용태 | Optically transmittable Sheet including optical fiber cable, Method and Apparatus for detecting end point in CMP process using thereof |
US8535115B2 (en) * | 2011-01-28 | 2013-09-17 | Applied Materials, Inc. | Gathering spectra from multiple optical heads |
JP5941763B2 (en) * | 2012-06-15 | 2016-06-29 | 株式会社荏原製作所 | Polishing method |
JP6046933B2 (en) * | 2012-07-10 | 2016-12-21 | 株式会社荏原製作所 | Polishing method |
US9095952B2 (en) | 2013-01-23 | 2015-08-04 | Applied Materials, Inc. | Reflectivity measurements during polishing using a camera |
JP6473050B2 (en) * | 2015-06-05 | 2019-02-20 | 株式会社荏原製作所 | Polishing equipment |
JP6475604B2 (en) * | 2015-11-24 | 2019-02-27 | 株式会社荏原製作所 | Polishing method |
JP6846605B2 (en) * | 2016-03-17 | 2021-03-24 | パナソニックIpマネジメント株式会社 | Fiber coupling device |
-
2017
- 2017-10-19 JP JP2017202848A patent/JP6902452B2/en active Active
-
2018
- 2018-10-16 US US16/162,063 patent/US11413720B2/en active Active
- 2018-10-16 SG SG10201809087UA patent/SG10201809087UA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP6902452B2 (en) | 2021-07-14 |
US20190118331A1 (en) | 2019-04-25 |
JP2019075526A (en) | 2019-05-16 |
US11413720B2 (en) | 2022-08-16 |
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