SG10201807415PA - Pattern forming apparatus, deciding method, program, information processing apparatus, and article manufacturing method - Google Patents

Pattern forming apparatus, deciding method, program, information processing apparatus, and article manufacturing method

Info

Publication number
SG10201807415PA
SG10201807415PA SG10201807415PA SG10201807415PA SG10201807415PA SG 10201807415P A SG10201807415P A SG 10201807415PA SG 10201807415P A SG10201807415P A SG 10201807415PA SG 10201807415P A SG10201807415P A SG 10201807415PA SG 10201807415P A SG10201807415P A SG 10201807415PA
Authority
SG
Singapore
Prior art keywords
mark
pattern forming
forming apparatus
program
article manufacturing
Prior art date
Application number
SG10201807415PA
Inventor
Egashira Shinichi
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG10201807415PA publication Critical patent/SG10201807415PA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7092—Signal processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment

Abstract

OF THE DISCLOSURE PATTERN FORMING APPARATUS, DECIDING METHOD, PROGRAM, INFORMATION PROCESSING APPARATUS, AND ARTICLE MANUFACTURING METHOD 5 The present invention provides a pattern forming apparatus including a detection optical system configured to obtain optical information of a mark provided on a substrate by detecting the mark, and a processing unit configured to perform a process of obtaining a position of the mark by using a template for obtaining the position of the mark by being applied to the optical information of 10 the mark and a window which indicates a region for extracting an amount of characteristic indicating the position of the mark from a waveform signal obtained from the optical information, wherein the processing unit decides, based on the optical information of the mark obtained by the detection optical system, a parameter indicating at least one of a shape of the template and a shape of the 15 window for each of a plurality of substrates. (Figure 9)
SG10201807415PA 2017-08-30 2018-08-29 Pattern forming apparatus, deciding method, program, information processing apparatus, and article manufacturing method SG10201807415PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017166111A JP6567004B2 (en) 2017-08-30 2017-08-30 Pattern forming apparatus, determination method, program, information processing apparatus, and article manufacturing method

Publications (1)

Publication Number Publication Date
SG10201807415PA true SG10201807415PA (en) 2019-03-28

Family

ID=63173998

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201807415PA SG10201807415PA (en) 2017-08-30 2018-08-29 Pattern forming apparatus, deciding method, program, information processing apparatus, and article manufacturing method

Country Status (7)

Country Link
US (1) US10831116B2 (en)
EP (1) EP3451063B1 (en)
JP (1) JP6567004B2 (en)
KR (1) KR102376606B1 (en)
CN (1) CN109427748B (en)
SG (1) SG10201807415PA (en)
TW (2) TWI739276B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6767811B2 (en) * 2016-08-31 2020-10-14 キヤノン株式会社 Position detection method, position detection device, lithography device and article manufacturing method
JP6945601B2 (en) * 2017-08-30 2021-10-06 キヤノン株式会社 Pattern forming device, determination method, program, information processing device and manufacturing method of goods
JP6750654B2 (en) * 2018-09-19 2020-09-02 株式会社三洋物産 Amusement machine
JP7278138B2 (en) * 2019-04-18 2023-05-19 キヤノン株式会社 Substrate processing apparatus, article manufacturing method, substrate processing method, substrate processing system, management device, and program
KR20210038143A (en) * 2019-09-30 2021-04-07 (주)쎄미시스코 System and method of inspecting object based on artificial intelligence
US20220223480A1 (en) * 2021-01-14 2022-07-14 Changxin Memory Technologies, Inc. Wafer measurement method and apparatus, medium, and electronic device

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US5525808A (en) * 1992-01-23 1996-06-11 Nikon Corporaton Alignment method and alignment apparatus with a statistic calculation using a plurality of weighted coordinate positions
JPH06151274A (en) * 1992-11-11 1994-05-31 Hitachi Ltd Method and device for positioning semiconductor integrated circuit pattern
JP3490797B2 (en) * 1995-05-23 2004-01-26 株式会社ルネサステクノロジ Pattern position measuring method and optical device using the same
JP3894505B2 (en) * 1995-10-16 2007-03-22 キヤノン株式会社 Position detection method, position detection apparatus, semiconductor exposure apparatus, and semiconductor manufacturing method
JPH10326739A (en) * 1997-05-23 1998-12-08 Nikon Corp Alignment method and exposure method
JP4165871B2 (en) * 2002-03-15 2008-10-15 キヤノン株式会社 Position detection method, position detection apparatus, and exposure apparatus
JP4018438B2 (en) * 2002-04-30 2007-12-05 キヤノン株式会社 Management system for managing semiconductor exposure equipment
JPWO2005008753A1 (en) * 2003-05-23 2006-11-16 株式会社ニコン Template creation method and apparatus, pattern detection method, position detection method and apparatus, exposure method and apparatus, device manufacturing method, and template creation program
JP2005030963A (en) * 2003-07-08 2005-02-03 Canon Inc Position detecting method
WO2005096353A1 (en) * 2004-03-31 2005-10-13 Nikon Corporation Alignment condition decision method and device, and exposure method and device
TWI451475B (en) * 2004-08-19 2014-09-01 尼康股份有限公司 An alignment information display method and a recording device having a program, an alignment method, an exposure method, a component manufacturing method, a display system, a display device, a measurement device, and a measurement method
JP4290177B2 (en) * 2005-06-08 2009-07-01 キヤノン株式会社 Mold, alignment method, pattern forming apparatus, pattern transfer apparatus, and chip manufacturing method
JP5002221B2 (en) * 2006-09-11 2012-08-15 キヤノン株式会社 Device for detecting the position of a mark
US8440375B2 (en) * 2007-05-29 2013-05-14 Nikon Corporation Exposure method and electronic device manufacturing method
JP2009130184A (en) * 2007-11-26 2009-06-11 Canon Inc Alignment method, exposure method, pattern forming method and exposure device
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Also Published As

Publication number Publication date
KR102376606B1 (en) 2022-03-21
JP2019045585A (en) 2019-03-22
TW201921135A (en) 2019-06-01
KR20190024720A (en) 2019-03-08
EP3451063B1 (en) 2023-02-01
US20190064679A1 (en) 2019-02-28
TWI739276B (en) 2021-09-11
JP6567004B2 (en) 2019-08-28
US10831116B2 (en) 2020-11-10
CN109427748A (en) 2019-03-05
EP3451063A1 (en) 2019-03-06
TW202020581A (en) 2020-06-01
CN109427748B (en) 2023-08-22
TWI684832B (en) 2020-02-11

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