SG10201807290WA - Device and method for removing liquid from a surface of a disc-like article - Google Patents

Device and method for removing liquid from a surface of a disc-like article

Info

Publication number
SG10201807290WA
SG10201807290WA SG10201807290WA SG10201807290WA SG10201807290WA SG 10201807290W A SG10201807290W A SG 10201807290WA SG 10201807290W A SG10201807290W A SG 10201807290WA SG 10201807290W A SG10201807290W A SG 10201807290WA SG 10201807290W A SG10201807290W A SG 10201807290WA
Authority
SG
Singapore
Prior art keywords
article
disc
dispenser
gas
liquid
Prior art date
Application number
SG10201807290WA
Other languages
English (en)
Inventor
Semmelrock Christoph
hammer Dietmar
Original Assignee
Lam Res Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Ag filed Critical Lam Res Ag
Publication of SG10201807290WA publication Critical patent/SG10201807290WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG10201807290WA 2014-02-27 2015-02-13 Device and method for removing liquid from a surface of a disc-like article SG10201807290WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/192,416 US10410888B2 (en) 2014-02-27 2014-02-27 Device and method for removing liquid from a surface of a disc-like article

Publications (1)

Publication Number Publication Date
SG10201807290WA true SG10201807290WA (en) 2018-09-27

Family

ID=53882911

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201501164YA SG10201501164YA (en) 2014-02-27 2015-02-13 Device and method for removing liquid from a surface of a disc-like article
SG10201807290WA SG10201807290WA (en) 2014-02-27 2015-02-13 Device and method for removing liquid from a surface of a disc-like article

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201501164YA SG10201501164YA (en) 2014-02-27 2015-02-13 Device and method for removing liquid from a surface of a disc-like article

Country Status (4)

Country Link
US (1) US10410888B2 (zh)
KR (1) KR102175562B1 (zh)
SG (2) SG10201501164YA (zh)
TW (1) TWI690008B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10410888B2 (en) * 2014-02-27 2019-09-10 Lam Research Ag Device and method for removing liquid from a surface of a disc-like article
US11467508B2 (en) * 2018-07-25 2022-10-11 Applied Materials, Inc. Pellicle adhesive residue removal system and methods

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW386235B (en) 1995-05-23 2000-04-01 Tokyo Electron Ltd Method for spin rinsing
JP2000273817A (ja) * 1999-03-23 2000-10-03 Nichireki Co Ltd 路面用液体散布装置
JP2001088009A (ja) * 1999-09-24 2001-04-03 Speedfam Co Ltd ポリッシングパッドのドレッシング装置
US6536454B2 (en) 2000-07-07 2003-03-25 Sez Ag Device for treating a disc-shaped object
KR20050035318A (ko) * 2003-10-10 2005-04-18 세메스 주식회사 기판 세정 건조 장치 및 방법
TWI286353B (en) * 2004-10-12 2007-09-01 Tokyo Electron Ltd Substrate processing method and substrate processing apparatus
JP2006147773A (ja) * 2004-11-18 2006-06-08 Ebara Corp 研磨装置および研磨方法
KR100782486B1 (ko) * 2006-08-21 2007-12-05 삼성전자주식회사 세정물질 분사유니트 및 이를 갖는 웨이퍼 세정장치
WO2008041211A2 (en) 2006-10-02 2008-04-10 Sez Ag Device and method for removing liquid from a surface of a disc-like article
KR20080072230A (ko) * 2007-02-01 2008-08-06 세메스 주식회사 스캔 분사형 노즐 구동부를 가진 기판 처리 장치
US20110289795A1 (en) * 2010-02-16 2011-12-01 Tomoatsu Ishibashi Substrate drying apparatus, substrate drying method and control program
US10410888B2 (en) * 2014-02-27 2019-09-10 Lam Research Ag Device and method for removing liquid from a surface of a disc-like article

Also Published As

Publication number Publication date
KR102175562B1 (ko) 2020-11-09
US10410888B2 (en) 2019-09-10
SG10201501164YA (en) 2015-09-29
TW201604986A (zh) 2016-02-01
KR20150101958A (ko) 2015-09-04
US20150243533A1 (en) 2015-08-27
TWI690008B (zh) 2020-04-01

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