SG10201802340QA - Method and system for structural health monitoring of bonded joints - Google Patents

Method and system for structural health monitoring of bonded joints

Info

Publication number
SG10201802340QA
SG10201802340QA SG10201802340QA SG10201802340QA SG10201802340QA SG 10201802340Q A SG10201802340Q A SG 10201802340QA SG 10201802340Q A SG10201802340Q A SG 10201802340QA SG 10201802340Q A SG10201802340Q A SG 10201802340QA SG 10201802340Q A SG10201802340Q A SG 10201802340QA
Authority
SG
Singapore
Prior art keywords
adhesive
health monitoring
properties
structural health
simulated
Prior art date
Application number
SG10201802340QA
Inventor
Mohammadreza Jahanbin
Jeong-Beom Ihn
Original Assignee
Boeing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boeing Co filed Critical Boeing Co
Publication of SG10201802340QA publication Critical patent/SG10201802340QA/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0066—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by exciting or detecting vibration or acceleration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/07—Analysing solids by measuring propagation velocity or propagation time of acoustic waves
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/043—Analysing solids in the interior, e.g. by shear waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/07—Analysing solids by measuring propagation velocity or propagation time of acoustic waves
    • G01N29/075—Analysing solids by measuring propagation velocity or propagation time of acoustic waves by measuring or comparing phase angle
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/11—Analysing solids by measuring attenuation of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4409—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
    • G01N29/4427—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with stored values, e.g. threshold values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4409—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
    • G01N29/4436—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with a reference signal
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/048—Monitoring; Safety
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0231—Composite or layered materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/0289—Internal structure, e.g. defects, grain size, texture
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/23—Pc programming
    • G05B2219/23445—Real time simulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Geometry (AREA)
  • Evolutionary Computation (AREA)
  • Computer Hardware Design (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

METHOD AND SYSTEM FOR STRUCTURAL HEALTH MONITORING OF BONDED JOINTS Systems and methods for structural health monitoring of adhesively bonded joints using guided waves. The method determines the quality of adhesive bonds between two materials by injecting a high-frequency ultrasonic signal and measuring a characteristic of the ultrasonic waves which propagate through the adhesive, trapped and guided by the interfaces between the bonded materials and the adhesive. Prior to an inspection of an 5 actual adhesively bonded structure, that structure is simulated using a finite element model. Also propagation of guided ultrasonic waves along the adhesive bondline is simulated to derive interface wave predicted properties. During ultrasonic inspection of the actual structure, interface wave measured properties are derived. The quality of the adhesive bondline is determined by comparing the empirical interface wave measured 10 properties to simulated interface wave predicted properties. Fig. 11
SG10201802340QA 2017-05-23 2018-03-21 Method and system for structural health monitoring of bonded joints SG10201802340QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/602,871 US20180340858A1 (en) 2017-05-23 2017-05-23 Application of Ultrasonic Guided Waves for Structural Health Monitoring of Bonded Joints

Publications (1)

Publication Number Publication Date
SG10201802340QA true SG10201802340QA (en) 2018-12-28

Family

ID=62236159

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201802340QA SG10201802340QA (en) 2017-05-23 2018-03-21 Method and system for structural health monitoring of bonded joints

Country Status (4)

Country Link
US (1) US20180340858A1 (en)
CN (1) CN108932359A (en)
GB (1) GB2563978B (en)
SG (1) SG10201802340QA (en)

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FR3057957B1 (en) * 2016-10-25 2018-11-02 Safran METHOD FOR NON-DESTRUCTIVE CONTROL OF A GLUE ASSEMBLY
EP3710824A1 (en) * 2017-11-13 2020-09-23 ExxonMobil Research and Engineering Company Methods of using nondestructive material inspection systems
CN111344564A (en) * 2017-11-13 2020-06-26 埃克森美孚研究工程公司 Method and system for non-destructive material inspection
GB2572215A (en) * 2018-03-23 2019-09-25 Short Brothers Ltd Detection of kiss bonds within composite components
US10953608B2 (en) * 2018-08-09 2021-03-23 The Boeing Company Structural health monitoring of curved composite structures using ultrasonic guided waves
KR20210143936A (en) * 2019-04-17 2021-11-29 디엠씨 글로벌 아이엔씨. Methods and systems for identifying bond boundaries between normal and weak bonds in multilayer articles
US11454595B2 (en) 2019-12-06 2022-09-27 Saudi Arabian Oil Company Systems and methods for evaluating a structural health of composite components by correlating positions of displaced nanoparticles
CN111177968B (en) * 2020-01-02 2022-01-18 大连理工大学 Method for quickly inserting two-dimensional zero-thickness cohesive force unit into target area
NO20200190A1 (en) * 2020-02-14 2021-08-16 Optonor As System and method for analysing an object
US11262195B2 (en) 2020-03-02 2022-03-01 The Boeing Company Surface roughness analysis system and methods of analyzing surface roughness of a workpiece
US11366085B2 (en) * 2020-03-19 2022-06-21 The Boeing Company Integrated laser bond inspection and associated systems and methods
EP3940338A1 (en) * 2020-07-15 2022-01-19 The Boeing Company Characterizing internal structures via ultrasound
JP7273375B2 (en) * 2021-03-16 2023-05-15 株式会社豊田中央研究所 Deterioration measurement device and deterioration measurement method for adhesive joints
CN113466335A (en) * 2021-06-28 2021-10-01 大连理工大学 Ultrasonic guided wave honeycomb sandwich structure debonding layer diagnosis method
CN113720919A (en) * 2021-08-07 2021-11-30 南京中车浦镇城轨车辆有限责任公司 Method for detecting debonding defect of vehicle window bonding interface
CN114088818B (en) * 2021-11-16 2024-03-22 南京工业大学 Ultrasonic guided wave method and system for identifying global rigidity

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5408881A (en) * 1993-09-15 1995-04-25 National Research Council Of Canada High resolution ultrasonic interferometry for quantitative mondestructive characterization of interfacial adhesion in multilayer composites
US7313959B2 (en) * 2005-05-25 2008-01-01 The Boeing Company Magnetically attracted apparatus, system, and method for remote bondline thickness measurement
GB0818383D0 (en) * 2008-10-08 2008-11-12 Qinetiq Ltd Compposite evaluation
US8812251B2 (en) * 2011-04-12 2014-08-19 The Boeing Company System and method for monitoring bonding integrity
US9506836B2 (en) * 2012-10-09 2016-11-29 The Boeing Company Methods and systems for structural health monitoring
DE102014209773A1 (en) * 2014-05-22 2015-11-26 Siemens Aktiengesellschaft Simulation-based defect assessment with ultrasound
CN104820017B (en) * 2015-04-26 2017-07-14 北京工业大学 Multi-layer bonded structural interface Morphology observation method
CN105486747B (en) * 2015-11-19 2018-06-29 北京工业大学 The SH wave detecting methods of bonded structure interface configuration
US10495609B2 (en) * 2016-10-18 2019-12-03 The Aerospace Corporation Ultrasonic inspection technique to assess bond quality in composite structures

Also Published As

Publication number Publication date
US20180340858A1 (en) 2018-11-29
GB201806617D0 (en) 2018-06-06
GB2563978B (en) 2019-09-25
GB2563978A (en) 2019-01-02
CN108932359A (en) 2018-12-04

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