SG10201710688SA - Chemically-amplified positive photosensitive resin composition, manufacturing method of substrate with casting mold, and manufacturing method of electroplated molded article - Google Patents

Chemically-amplified positive photosensitive resin composition, manufacturing method of substrate with casting mold, and manufacturing method of electroplated molded article

Info

Publication number
SG10201710688SA
SG10201710688SA SG10201710688SA SG10201710688SA SG10201710688SA SG 10201710688S A SG10201710688S A SG 10201710688SA SG 10201710688S A SG10201710688S A SG 10201710688SA SG 10201710688S A SG10201710688S A SG 10201710688SA SG 10201710688S A SG10201710688S A SG 10201710688SA
Authority
SG
Singapore
Prior art keywords
manufacturing
positive photosensitive
resin composition
photosensitive resin
chemically
Prior art date
Application number
SG10201710688SA
Inventor
Chi-Ming Liu
Chun-An Shih
Original Assignee
Chi Mei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chi Mei Corp filed Critical Chi Mei Corp
Publication of SG10201710688SA publication Critical patent/SG10201710688SA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

CHEMICALLYAMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, MANUFACTURING METHOD OF SUBSTRATE WITH CASTING MOLD, AND MANUFACTURING METHOD OF ELECTROPLATED MOLDED ARTICLE OF THE DISCLOSURE A chemically-amplified positive photosensitive resin composition with excellent sensitivity and rectangularity, a manufacturing method of a substrate with a casting mold, and a manufacturing method of an electroplated molded article are provided. 10 The chemically-amplified type positive photosensitive resin composition contains a resin (A) containing an acid-dissociated protecting group and obtained by polymerizing a monomer mixture, a novolac resin (B), a photoacid generator (C), and a solvent (D). In particular, the novolac resin (B) is obtained by a polycondensation of cresol aromatic hydroxyl compound and an aldehyde compound, and based on an integral area of 100% 15 of a molecular weight of the novolac resin (B) measured by gel permeation chromatography, a cresol binuclear area of the novolac resin (B) is between 0.5% and 6%. Fig. 1 84
SG10201710688SA 2016-12-27 2017-12-21 Chemically-amplified positive photosensitive resin composition, manufacturing method of substrate with casting mold, and manufacturing method of electroplated molded article SG10201710688SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105143354A TWI681253B (en) 2016-12-27 2016-12-27 Chemically-amplified type positive photo sensitive resin composition, method for manufacturing substrate with casting mold, and method for manufacturing plating molded article

Publications (1)

Publication Number Publication Date
SG10201710688SA true SG10201710688SA (en) 2018-07-30

Family

ID=62700846

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201710688SA SG10201710688SA (en) 2016-12-27 2017-12-21 Chemically-amplified positive photosensitive resin composition, manufacturing method of substrate with casting mold, and manufacturing method of electroplated molded article

Country Status (3)

Country Link
CN (1) CN108241257B (en)
SG (1) SG10201710688SA (en)
TW (1) TWI681253B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210101219A (en) * 2018-12-12 2021-08-18 제이에스알 가부시끼가이샤 A photosensitive resin composition, a method for producing a resist pattern film, and a method for producing a plated article

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI226509B (en) * 2000-09-12 2005-01-11 Fuji Photo Film Co Ltd Positive resist composition
JP5517860B2 (en) * 2009-10-16 2014-06-11 富士フイルム株式会社 Photosensitive resin composition, method for forming cured film, cured film, organic EL display device, and liquid crystal display device
TWI408501B (en) * 2010-06-15 2013-09-11 Chi Mei Corp A positive-type photosensitive resin composition, and a method of forming a pattern using the composition
TWI453543B (en) * 2012-05-16 2014-09-21 Chi Mei Corp Positive photosensitive resin composition and its application
WO2015037695A1 (en) * 2013-09-13 2015-03-19 富士フイルム株式会社 Photosensitive resin composition, method for producing cured film, cured film, liquid crystal display device and organic el display device
JP6342683B2 (en) * 2014-03-20 2018-06-13 東京応化工業株式会社 Chemical amplification type positive photosensitive resin composition

Also Published As

Publication number Publication date
CN108241257A (en) 2018-07-03
CN108241257B (en) 2022-11-08
TWI681253B (en) 2020-01-01
TW201823862A (en) 2018-07-01

Similar Documents

Publication Publication Date Title
GB201015397D0 (en) Polymerisation method
FR2442252A1 (en) THERMOPLASTIC MOLDING COMPOSITION BASED ON POLY RESIN (OXYPHENYLENE) AND AN AROMATIC ALKENYL RESIN MODIFIED WITH A POLYSILOXANE
RU2015111650A (en) Liquid epoxy coating compositions, methods and products
EP3850024A4 (en) Cross-linking compositions for forming cross-linked organic polymers, organic polymer compositions, methods of forming the same, and molded articles produced therefrom
GB2486078A (en) Patternable low-k dielectric interconnect structure with a graded cap layer and method of fabrication
WO2009154879A3 (en) Polymeric molds and articles made therefrom
TW201612645A (en) Chemically amplified positive resist material and pattern forming method
WO2013087592A3 (en) Epoxy resin compositions
SG10201710674VA (en) Chemically-amplified positive photosensitive resin composition, manufacturing method of substrate with casting mold, and manufacturing method of electroplated molded article
SG10201710688SA (en) Chemically-amplified positive photosensitive resin composition, manufacturing method of substrate with casting mold, and manufacturing method of electroplated molded article
WO2012061457A3 (en) Siloxane graft co-polymers for mold release
TW200725175A (en) Curable resin composition, forming method of cured film, and cured film
TW200602806A (en) Radiation-sensitive resin composition, interlayer insulation film, microlens and process for producing them
EP1245637A4 (en) Light-diffusing resin composition
ATE410461T1 (en) POLYETHER-POLYMER MATRIX
DE502006009105D1 (en) METHOD FOR PRODUCING A PHOTOCHROMIC PLASTIC OBJECT
SG10201800553SA (en) Method for Producing Modified Conjugated Diene-Based Polymer, Polymer Composition, Crosslinked Polymer, and Tire
EP3035121A3 (en) Monomer, polymer, resist composition, and patterning process
TW200722923A (en) Positive type photosensitive resin composition and cured film manufactured therefrom
TW200736829A (en) Photosensitive resin composition and pattern forming method using the same
TW201144943A (en) Positive photosensitive resin composition and method of forming pattern with the same composition
WO2008084645A1 (en) Printing plate material
MY183182A (en) Thermoplastic resin composition and resin molded article
MX2019002261A (en) Epoxy-modified vinyl copolymer, thermoplastic resin composition containing same and molded article of said thermoplastic resin composition.
EP3121214A3 (en) Novel transparent polymers and methods for making the same