SG10201710688SA - Chemically-amplified positive photosensitive resin composition, manufacturing method of substrate with casting mold, and manufacturing method of electroplated molded article - Google Patents

Chemically-amplified positive photosensitive resin composition, manufacturing method of substrate with casting mold, and manufacturing method of electroplated molded article

Info

Publication number
SG10201710688SA
SG10201710688SA SG10201710688SA SG10201710688SA SG10201710688SA SG 10201710688S A SG10201710688S A SG 10201710688SA SG 10201710688S A SG10201710688S A SG 10201710688SA SG 10201710688S A SG10201710688S A SG 10201710688SA SG 10201710688S A SG10201710688S A SG 10201710688SA
Authority
SG
Singapore
Prior art keywords
manufacturing
positive photosensitive
resin composition
photosensitive resin
chemically
Prior art date
Application number
SG10201710688SA
Inventor
Chi-Ming Liu
Chun-An Shih
Original Assignee
Chi Mei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chi Mei Corp filed Critical Chi Mei Corp
Publication of SG10201710688SA publication Critical patent/SG10201710688SA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

CHEMICALLYAMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, MANUFACTURING METHOD OF SUBSTRATE WITH CASTING MOLD, AND MANUFACTURING METHOD OF ELECTROPLATED MOLDED ARTICLE OF THE DISCLOSURE A chemically-amplified positive photosensitive resin composition with excellent sensitivity and rectangularity, a manufacturing method of a substrate with a casting mold, and a manufacturing method of an electroplated molded article are provided. 10 The chemically-amplified type positive photosensitive resin composition contains a resin (A) containing an acid-dissociated protecting group and obtained by polymerizing a monomer mixture, a novolac resin (B), a photoacid generator (C), and a solvent (D). In particular, the novolac resin (B) is obtained by a polycondensation of cresol aromatic hydroxyl compound and an aldehyde compound, and based on an integral area of 100% 15 of a molecular weight of the novolac resin (B) measured by gel permeation chromatography, a cresol binuclear area of the novolac resin (B) is between 0.5% and 6%. Fig. 1 84
SG10201710688SA 2016-12-27 2017-12-21 Chemically-amplified positive photosensitive resin composition, manufacturing method of substrate with casting mold, and manufacturing method of electroplated molded article SG10201710688SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105143354A TWI681253B (en) 2016-12-27 2016-12-27 Chemically-amplified type positive photo sensitive resin composition, method for manufacturing substrate with casting mold, and method for manufacturing plating molded article

Publications (1)

Publication Number Publication Date
SG10201710688SA true SG10201710688SA (en) 2018-07-30

Family

ID=62700846

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201710688SA SG10201710688SA (en) 2016-12-27 2017-12-21 Chemically-amplified positive photosensitive resin composition, manufacturing method of substrate with casting mold, and manufacturing method of electroplated molded article

Country Status (3)

Country Link
CN (1) CN108241257B (en)
SG (1) SG10201710688SA (en)
TW (1) TWI681253B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220057714A1 (en) * 2018-12-12 2022-02-24 Jsr Corporation Photosensitive resin composition, method for producing resist pattern film, and method for producing plated formed product

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI226509B (en) * 2000-09-12 2005-01-11 Fuji Photo Film Co Ltd Positive resist composition
JP5517860B2 (en) * 2009-10-16 2014-06-11 富士フイルム株式会社 Photosensitive resin composition, method for forming cured film, cured film, organic EL display device, and liquid crystal display device
TWI408501B (en) * 2010-06-15 2013-09-11 Chi Mei Corp A positive-type photosensitive resin composition, and a method of forming a pattern using the composition
TWI453543B (en) * 2012-05-16 2014-09-21 Chi Mei Corp Positive photosensitive resin composition and its application
WO2015037695A1 (en) * 2013-09-13 2015-03-19 富士フイルム株式会社 Photosensitive resin composition, method for producing cured film, cured film, liquid crystal display device and organic el display device
JP6342683B2 (en) * 2014-03-20 2018-06-13 東京応化工業株式会社 Chemical amplification type positive photosensitive resin composition

Also Published As

Publication number Publication date
TW201823862A (en) 2018-07-01
CN108241257B (en) 2022-11-08
TWI681253B (en) 2020-01-01
CN108241257A (en) 2018-07-03

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