SG10201705205WA - Toroidal plasma abatement apparatus and method - Google Patents
Toroidal plasma abatement apparatus and methodInfo
- Publication number
- SG10201705205WA SG10201705205WA SG10201705205WA SG10201705205WA SG10201705205WA SG 10201705205W A SG10201705205W A SG 10201705205WA SG 10201705205W A SG10201705205W A SG 10201705205WA SG 10201705205W A SG10201705205W A SG 10201705205WA SG 10201705205W A SG10201705205W A SG 10201705205WA
- Authority
- SG
- Singapore
- Prior art keywords
- abatement apparatus
- toroidal plasma
- plasma abatement
- toroidal
- plasma
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/32—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00
- B01D53/323—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00 by electrostatic effects or by high-voltage electric fields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
- B01D53/76—Gas phase processes, e.g. by using aerosols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32321—Discharge generated by other radiation
- H01J37/32339—Discharge generated by other radiation using electromagnetic radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32651—Shields, e.g. dark space shields, Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
- H01J37/32844—Treating effluent gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/20—Halogens or halogen compounds
- B01D2257/206—Organic halogen compounds
- B01D2257/2064—Chlorine
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
- H05H1/4645—Radiofrequency discharges
- H05H1/4652—Radiofrequency discharges using inductive coupling means, e.g. coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2245/00—Applications of plasma devices
- H05H2245/10—Treatment of gases
- H05H2245/15—Ambient air; Ozonisers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
- Y02C20/00—Capture or disposal of greenhouse gases
- Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Biomedical Technology (AREA)
- Plasma Technology (AREA)
- Treating Waste Gases (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361783360P | 2013-03-14 | 2013-03-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201705205WA true SG10201705205WA (en) | 2017-07-28 |
Family
ID=50732285
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201705205WA SG10201705205WA (en) | 2013-03-14 | 2014-03-14 | Toroidal plasma abatement apparatus and method |
SG11201507152RA SG11201507152RA (en) | 2013-03-14 | 2014-03-14 | Toroidal plasma abatement apparatus and method |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201507152RA SG11201507152RA (en) | 2013-03-14 | 2014-03-14 | Toroidal plasma abatement apparatus and method |
Country Status (8)
Country | Link |
---|---|
US (3) | US9630142B2 (en) |
EP (1) | EP2969134A1 (en) |
JP (2) | JP6154953B2 (en) |
KR (1) | KR102009513B1 (en) |
CN (1) | CN105209156B (en) |
SG (2) | SG10201705205WA (en) |
TW (1) | TWI634938B (en) |
WO (1) | WO2014152908A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105879599A (en) * | 2014-12-24 | 2016-08-24 | 苏州超等环保科技有限公司 | Anti-explosion plasma organic waste gas treatment device |
US20160233055A1 (en) * | 2015-02-06 | 2016-08-11 | Mks Instruments Inc. | Apparatus and Method for Metastable Enhanced Plasma Ignition |
CN107810542A (en) * | 2015-05-21 | 2018-03-16 | 普拉斯玛比利提有限责任公司 | Peripheral plasma processing unit with Forming Workpiece fixture |
JP2017088916A (en) * | 2015-11-04 | 2017-05-25 | 株式会社神戸製鋼所 | Film deposition apparatus using silicon raw material |
US11251019B2 (en) * | 2016-12-15 | 2022-02-15 | Toyota Jidosha Kabushiki Kaisha | Plasma device |
JP7021237B2 (en) * | 2017-02-09 | 2022-02-16 | アプライド マテリアルズ インコーポレイテッド | Plasma mitigation technology using water vapor and oxygen reactants |
JP6863199B2 (en) | 2017-09-25 | 2021-04-21 | トヨタ自動車株式会社 | Plasma processing equipment |
KR101959165B1 (en) * | 2018-04-27 | 2019-03-15 | (주)엔노피아 | Plasma waste gas processing apparatus and system |
US11019715B2 (en) * | 2018-07-13 | 2021-05-25 | Mks Instruments, Inc. | Plasma source having a dielectric plasma chamber with improved plasma resistance |
KR102630346B1 (en) * | 2018-10-31 | 2024-01-30 | 주식회사 뉴파워 프라즈마 | Plasma reactor for multi-controlling temperature |
GB2582948B (en) * | 2019-04-10 | 2021-12-08 | Thermo Fisher Scient Bremen Gmbh | Plasma source chamber for a spectrometer |
US10553403B1 (en) * | 2019-05-08 | 2020-02-04 | Mks Instruments, Inc. | Polygonal toroidal plasma source |
US11348784B2 (en) | 2019-08-12 | 2022-05-31 | Beijing E-Town Semiconductor Technology Co., Ltd | Enhanced ignition in inductively coupled plasmas for workpiece processing |
CN110718437A (en) * | 2019-09-16 | 2020-01-21 | 明远精密科技股份有限公司 | Remote plasma generating device |
CN111088087B (en) * | 2019-12-30 | 2021-07-20 | 广东瓦格耐电力科技有限公司 | Biogas pretreatment device for biogas generator set |
US20240194454A1 (en) * | 2022-12-08 | 2024-06-13 | Hamamatsu Photonics K.K. | Inductively Coupled Plasma Light Source with Direct Gas Injection |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
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US4282267A (en) * | 1979-09-20 | 1981-08-04 | Western Electric Co., Inc. | Methods and apparatus for generating plasmas |
US5773919A (en) | 1986-10-02 | 1998-06-30 | Electron Power Systems | Electron spiral toroid |
JPH05166595A (en) | 1991-12-12 | 1993-07-02 | Fuji Denpa Koki Kk | Method for generating plasma of high atmospheric pressure and high density |
JPH06166595A (en) | 1992-11-27 | 1994-06-14 | Toshiba Ceramics Co Ltd | Silicon wafer |
US6140752A (en) | 1992-12-24 | 2000-10-31 | Electron Power Systems | Energy storage device having a plurality of single charged particles and a charge neutralizer |
AU717031B2 (en) * | 1995-05-31 | 2000-03-16 | Electron Power Systems | Energy storage device |
US6815633B1 (en) | 1997-06-26 | 2004-11-09 | Applied Science & Technology, Inc. | Inductively-coupled toroidal plasma source |
US7569790B2 (en) * | 1997-06-26 | 2009-08-04 | Mks Instruments, Inc. | Method and apparatus for processing metal bearing gases |
US6924455B1 (en) | 1997-06-26 | 2005-08-02 | Applied Science & Technology, Inc. | Integrated plasma chamber and inductively-coupled toroidal plasma source |
US6150628A (en) * | 1997-06-26 | 2000-11-21 | Applied Science And Technology, Inc. | Toroidal low-field reactive gas source |
EP1212775A1 (en) | 1999-08-06 | 2002-06-12 | Advanced Energy Industries, Inc. | Inductively coupled ring-plasma source apparatus for processing gases and materials and method thereof |
US6361706B1 (en) | 1999-08-13 | 2002-03-26 | Philips Electronics North America Corp. | Method for reducing the amount of perfluorocompound gas contained in exhaust emissions from plasma processing |
US6156667A (en) | 1999-12-31 | 2000-12-05 | Litmas, Inc. | Methods and apparatus for plasma processing |
US6558635B2 (en) | 2001-03-12 | 2003-05-06 | Bruce Minaee | Microwave gas decomposition reactor |
US6685803B2 (en) * | 2001-06-22 | 2004-02-03 | Applied Materials, Inc. | Plasma treatment of processing gases |
US6855906B2 (en) * | 2001-10-16 | 2005-02-15 | Adam Alexander Brailove | Induction plasma reactor |
GB0416385D0 (en) | 2004-07-22 | 2004-08-25 | Boc Group Plc | Gas abatement |
WO2006078340A2 (en) | 2004-11-08 | 2006-07-27 | Mks Instruments, Inc. | Method and apparatus for processing metal bearing gases |
US20070272299A1 (en) * | 2004-12-03 | 2007-11-29 | Mks Instruments, Inc. | Methods and apparatus for downstream dissociation of gases |
GB0516695D0 (en) | 2005-08-15 | 2005-09-21 | Boc Group Plc | Microwave plasma reactor |
GB0521944D0 (en) * | 2005-10-27 | 2005-12-07 | Boc Group Plc | Method of treating gas |
GB0522088D0 (en) | 2005-10-28 | 2005-12-07 | Boc Group Plc | Plasma abatement device |
GB0523947D0 (en) | 2005-11-24 | 2006-01-04 | Boc Group Plc | Microwave plasma system |
US8932430B2 (en) | 2011-05-06 | 2015-01-13 | Axcelis Technologies, Inc. | RF coupled plasma abatement system comprising an integrated power oscillator |
US20080083701A1 (en) * | 2006-10-04 | 2008-04-10 | Mks Instruments, Inc. | Oxygen conditioning of plasma vessels |
US7969096B2 (en) | 2006-12-15 | 2011-06-28 | Mks Instruments, Inc. | Inductively-coupled plasma source |
US8257455B2 (en) * | 2007-07-30 | 2012-09-04 | Korea Institute Of Machinery & Materials | Plasma burner and diesel particulate filter trap |
CN101939812B (en) * | 2007-10-19 | 2013-05-01 | Mks仪器股份有限公司 | Toroidal plasma chamber for high gas flow rate process |
KR20100031960A (en) | 2008-09-17 | 2010-03-25 | 삼성전자주식회사 | Plasma generating apparatus |
GB0902784D0 (en) | 2009-02-19 | 2009-04-08 | Gasplas As | Plasma reactor |
US8999104B2 (en) | 2010-08-06 | 2015-04-07 | Lam Research Corporation | Systems, methods and apparatus for separate plasma source control |
US9449793B2 (en) | 2010-08-06 | 2016-09-20 | Lam Research Corporation | Systems, methods and apparatus for choked flow element extraction |
US9155181B2 (en) * | 2010-08-06 | 2015-10-06 | Lam Research Corporation | Distributed multi-zone plasma source systems, methods and apparatus |
-
2014
- 2014-03-14 KR KR1020157029447A patent/KR102009513B1/en active IP Right Grant
- 2014-03-14 US US14/212,398 patent/US9630142B2/en active Active
- 2014-03-14 SG SG10201705205WA patent/SG10201705205WA/en unknown
- 2014-03-14 SG SG11201507152RA patent/SG11201507152RA/en unknown
- 2014-03-14 TW TW103109788A patent/TWI634938B/en active
- 2014-03-14 WO PCT/US2014/028194 patent/WO2014152908A1/en active Application Filing
- 2014-03-14 JP JP2016502728A patent/JP6154953B2/en active Active
- 2014-03-14 EP EP14724568.2A patent/EP2969134A1/en not_active Withdrawn
- 2014-03-14 CN CN201480027798.7A patent/CN105209156B/en active Active
-
2017
- 2017-04-10 US US15/484,072 patent/US9991098B2/en active Active
- 2017-06-02 JP JP2017109876A patent/JP6474855B2/en active Active
-
2018
- 2018-04-12 US US15/952,168 patent/US20180233333A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TWI634938B (en) | 2018-09-11 |
CN105209156A (en) | 2015-12-30 |
US20180233333A1 (en) | 2018-08-16 |
JP6154953B2 (en) | 2017-06-28 |
SG11201507152RA (en) | 2015-10-29 |
US9991098B2 (en) | 2018-06-05 |
US9630142B2 (en) | 2017-04-25 |
US20140262746A1 (en) | 2014-09-18 |
WO2014152908A1 (en) | 2014-09-25 |
CN105209156B (en) | 2017-05-10 |
KR102009513B1 (en) | 2019-08-09 |
KR20150131294A (en) | 2015-11-24 |
JP2016521432A (en) | 2016-07-21 |
EP2969134A1 (en) | 2016-01-20 |
US20170213704A1 (en) | 2017-07-27 |
TW201501775A (en) | 2015-01-16 |
JP2017199685A (en) | 2017-11-02 |
JP6474855B2 (en) | 2019-02-27 |
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