SG10201605683WA - High-efficiency line-forming optical systems and methods using a serrated spatial filter - Google Patents
High-efficiency line-forming optical systems and methods using a serrated spatial filterInfo
- Publication number
- SG10201605683WA SG10201605683WA SG10201605683WA SG10201605683WA SG10201605683WA SG 10201605683W A SG10201605683W A SG 10201605683WA SG 10201605683W A SG10201605683W A SG 10201605683WA SG 10201605683W A SG10201605683W A SG 10201605683WA SG 10201605683W A SG10201605683W A SG 10201605683WA
- Authority
- SG
- Singapore
- Prior art keywords
- serrated
- methods
- optical systems
- spatial filter
- forming optical
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/0977—Reflective elements
- G02B27/0983—Reflective elements being curved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/2636—Bombardment with radiation with high-energy radiation for heating, e.g. electron beam heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/0988—Diaphragms, spatial filters, masks for removing or filtering a part of the beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02678—Beam shaping, e.g. using a mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02683—Continuous wave laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02686—Pulsed laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02691—Scanning of a beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/22—Gases
- H01S3/223—Gases the active gas being polyatomic, i.e. containing two or more atoms
- H01S3/2232—Carbon dioxide (CO2) or monoxide [CO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma & Fusion (AREA)
- Recrystallisation Techniques (AREA)
- Lasers (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562195349P | 2015-07-22 | 2015-07-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201605683WA true SG10201605683WA (en) | 2017-02-27 |
Family
ID=57837860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201605683WA SG10201605683WA (en) | 2015-07-22 | 2016-07-12 | High-efficiency line-forming optical systems and methods using a serrated spatial filter |
Country Status (6)
Country | Link |
---|---|
US (2) | US10353208B2 (en) |
JP (1) | JP6345737B2 (en) |
KR (1) | KR102509137B1 (en) |
CN (1) | CN106373909A (en) |
SG (1) | SG10201605683WA (en) |
TW (1) | TWI604515B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201528379A (en) * | 2013-12-20 | 2015-07-16 | Applied Materials Inc | Dual wavelength annealing method and apparatus |
US11622440B2 (en) * | 2014-05-30 | 2023-04-04 | Hypertherm, Inc. | Cooling plasma cutting system consumables and related systems and methods |
US11262591B2 (en) | 2018-11-09 | 2022-03-01 | Kla Corporation | System and method for pumping laser sustained plasma with an illumination source having modified pupil power distribution |
KR20210094835A (en) | 2020-01-22 | 2021-07-30 | 삼성전자주식회사 | Method of Annealing a Reflective Photomask Using LASER |
CN111624689A (en) * | 2020-06-15 | 2020-09-04 | 中国科学院福建物质结构研究所 | Diaphragm and preparation method thereof |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3977772A (en) * | 1974-06-21 | 1976-08-31 | Itek Corporation | Apodized optical system |
JPH0727129B2 (en) | 1986-11-28 | 1995-03-29 | 富士写真フイルム株式会社 | Laser optical system |
US4832446A (en) * | 1986-11-28 | 1989-05-23 | Fuji Photo Co., Ltd. | Laser optical system |
US4947413A (en) | 1988-07-26 | 1990-08-07 | At&T Bell Laboratories | Resolution doubling lithography technique |
US6320648B1 (en) | 1998-10-12 | 2001-11-20 | Steven R. J. Brueck | Method and apparatus for improving pattern fidelity in diffraction-limited imaging |
US6259055B1 (en) * | 1998-10-26 | 2001-07-10 | Lsp Technologies, Inc. | Apodizers for laser peening systems |
KR100549776B1 (en) | 1999-07-01 | 2006-02-06 | 에이에스엠엘 네델란즈 비.브이. | Apparatus and method of image enhancement through spatial filtering |
JP4556302B2 (en) * | 2000-07-27 | 2010-10-06 | ソニー株式会社 | Thin film transistor manufacturing system and method, polysilicon evaluation method and polysilicon inspection apparatus |
US7098155B2 (en) | 2003-09-29 | 2006-08-29 | Ultratech, Inc. | Laser thermal annealing of lightly doped silicon substrates |
TWI297521B (en) | 2004-01-22 | 2008-06-01 | Ultratech Inc | Laser thermal annealing of lightly doped silicon substrates |
US7253376B2 (en) | 2005-01-21 | 2007-08-07 | Ultratech, Inc. | Methods and apparatus for truncating an image formed with coherent radiation |
US7539371B2 (en) | 2005-04-11 | 2009-05-26 | Capella Photonics, Inc. | Optical apparatus with reduced effect of mirror edge diffraction |
US7847213B1 (en) | 2007-09-11 | 2010-12-07 | Ultratech, Inc. | Method and apparatus for modifying an intensity profile of a coherent photonic beam |
CN101726868B (en) * | 2009-12-15 | 2011-04-27 | 北京理工大学 | Method and device for multiplexing and encoding orbital angular momentum states of light beams |
US8014427B1 (en) * | 2010-05-11 | 2011-09-06 | Ultratech, Inc. | Line imaging systems and methods for laser annealing |
CN102540473B (en) | 2012-01-04 | 2014-07-02 | 北京工业大学 | Method for realizing Gaussian beam shaping and determining average radius of serrated aperture with random radius |
SG10201503482QA (en) | 2012-06-11 | 2015-06-29 | Ultratech Inc | Laser annealing systems and methods with ultra-short dwell times |
CN102749801A (en) * | 2012-06-29 | 2012-10-24 | 北京京东方光电科技有限公司 | Mask plate |
JP6193305B2 (en) * | 2014-07-29 | 2017-09-06 | ウルトラテック インク | High performance line forming optical system and method |
US9613815B2 (en) * | 2014-11-24 | 2017-04-04 | Ultratech, Inc. | High-efficiency line-forming optical systems and methods for defect annealing and dopant activation |
-
2016
- 2016-07-12 SG SG10201605683WA patent/SG10201605683WA/en unknown
- 2016-07-14 US US15/210,399 patent/US10353208B2/en active Active
- 2016-07-15 TW TW105122517A patent/TWI604515B/en active
- 2016-07-19 KR KR1020160091376A patent/KR102509137B1/en active IP Right Grant
- 2016-07-20 JP JP2016141947A patent/JP6345737B2/en active Active
- 2016-07-21 CN CN201610578685.7A patent/CN106373909A/en active Pending
-
2019
- 2019-07-15 US US16/511,136 patent/US11415809B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW201705230A (en) | 2017-02-01 |
JP6345737B2 (en) | 2018-06-20 |
TWI604515B (en) | 2017-11-01 |
US10353208B2 (en) | 2019-07-16 |
KR20170012067A (en) | 2017-02-02 |
US20170025287A1 (en) | 2017-01-26 |
US20190339536A1 (en) | 2019-11-07 |
JP2017028281A (en) | 2017-02-02 |
KR102509137B1 (en) | 2023-03-10 |
CN106373909A (en) | 2017-02-01 |
US11415809B2 (en) | 2022-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3467437A4 (en) | Position capture method and system | |
SG10202001295TA (en) | System and method for a semi-lit market | |
EP3243185A4 (en) | Object recognition based photo filters | |
EP3360320C0 (en) | Projection systems and methods | |
EP3111552A4 (en) | Improved end clamps for solar systems | |
EP3180912A4 (en) | System and method for generalized view morphing over a multi-camera mesh | |
ZA201802133B (en) | Systems and methods for collecting a species | |
PL2966605T3 (en) | Method and system for authenticating a user | |
PL3285909T3 (en) | Secondary element for a filter system and filter system with a secondary element | |
GB201507281D0 (en) | Methods and systems for bonding | |
GB201505697D0 (en) | A system and method | |
GB201518641D0 (en) | A system and method | |
EP3371683A4 (en) | A design system and method | |
SG10201605683WA (en) | High-efficiency line-forming optical systems and methods using a serrated spatial filter | |
HK1220277A1 (en) | System and method for executing synchronized trades in multiple exchanges | |
EP3229728A4 (en) | Ivc filter retrieval systems with releasable capture feature | |
HK1252964A1 (en) | Filter devices methods and system | |
EP3315091A4 (en) | Emboli capture device | |
PT3544712T (en) | Filter system | |
PT3278010T (en) | A camera system | |
EP3066508A4 (en) | Method and system for creating a camera refocus effect | |
GB201605142D0 (en) | A camera system | |
GB201619804D0 (en) | Filter systems | |
GB201519032D0 (en) | A Market research system | |
GB201508702D0 (en) | A system and method |