SG10201505491UA - Copper corrosion inhibition system - Google Patents
Copper corrosion inhibition systemInfo
- Publication number
- SG10201505491UA SG10201505491UA SG10201505491UA SG10201505491UA SG10201505491UA SG 10201505491U A SG10201505491U A SG 10201505491UA SG 10201505491U A SG10201505491U A SG 10201505491UA SG 10201505491U A SG10201505491U A SG 10201505491UA SG 10201505491U A SG10201505491U A SG 10201505491UA
- Authority
- SG
- Singapore
- Prior art keywords
- corrosion inhibition
- copper corrosion
- inhibition system
- copper
- inhibition
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 230000007797 corrosion Effects 0.000 title 1
- 238000005260 corrosion Methods 0.000 title 1
- 230000005764 inhibitory process Effects 0.000 title 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/042—Acids
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2082—Polycarboxylic acids-salts thereof
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2086—Hydroxy carboxylic acids-salts thereof
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3723—Polyamines or polyalkyleneimines
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
- C11D3/3765—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions in liquid compositions
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3245—Aminoacids
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/12—Oxygen-containing compounds
- C23F11/124—Carboxylic acids
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/141—Amines; Quaternary ammonium compounds
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
- C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
- C23G1/061—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors nitrogen-containing compounds
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/16—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions using inhibitors
- C23G1/18—Organic inhibitors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/20—Other heavy metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/24—Cleaning or pickling metallic material with solutions or molten salts with neutral solutions
- C23G1/26—Cleaning or pickling metallic material with solutions or molten salts with neutral solutions using inhibitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462024046P | 2014-07-14 | 2014-07-14 | |
US14/790,966 US9957469B2 (en) | 2014-07-14 | 2015-07-02 | Copper corrosion inhibition system |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201505491UA true SG10201505491UA (en) | 2016-02-26 |
Family
ID=53773214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201505491UA SG10201505491UA (en) | 2014-07-14 | 2015-07-14 | Copper corrosion inhibition system |
Country Status (8)
Country | Link |
---|---|
US (1) | US9957469B2 (en) |
EP (1) | EP2975108B1 (en) |
JP (1) | JP6117866B2 (en) |
KR (1) | KR101874556B1 (en) |
CN (1) | CN105261554B (en) |
IL (1) | IL239853B (en) |
SG (1) | SG10201505491UA (en) |
TW (1) | TWI617705B (en) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9957469B2 (en) * | 2014-07-14 | 2018-05-01 | Versum Materials Us, Llc | Copper corrosion inhibition system |
US10233413B2 (en) * | 2015-09-23 | 2019-03-19 | Versum Materials Us, Llc | Cleaning formulations |
WO2017156304A1 (en) * | 2016-03-09 | 2017-09-14 | Entegris, Inc. | Tungsten post-cmp cleaning compositions |
KR102111307B1 (en) * | 2016-06-02 | 2020-05-15 | 후지필름 가부시키가이샤 | Process solution, substrate cleaning method and resist removal method |
US11149202B1 (en) | 2016-12-13 | 2021-10-19 | Ecolab Usa Inc. | Tetracarboxylic acid combinations for corrosion inhibition |
WO2019046409A1 (en) | 2017-08-30 | 2019-03-07 | Ecolab Usa Inc. | Molecules having one hydrophobic group and two identical hydrophilic ionic groups and compositions thereof |
KR20200058428A (en) | 2017-10-10 | 2020-05-27 | 미쯔비시 케미컬 주식회사 | Cleaning solution, cleaning method and manufacturing method of semiconductor wafer |
CN109971565B (en) * | 2017-12-27 | 2021-10-22 | 安集微电子(上海)有限公司 | Fluorine-containing cleaning solution |
US11560533B2 (en) * | 2018-06-26 | 2023-01-24 | Versum Materials Us, Llc | Post chemical mechanical planarization (CMP) cleaning |
EP3843870A1 (en) | 2018-08-29 | 2021-07-07 | Ecolab USA Inc. | Multiple charged ionic compounds derived from polyamines and compositions thereof and methods of preparation thereof |
WO2020047015A1 (en) | 2018-08-29 | 2020-03-05 | Ecolab Usa Inc. | Use of multiple charged cationic compounds derived from primary amines or polyamines for microbial fouling control in a water system |
CA3110365C (en) | 2018-08-29 | 2023-05-09 | Ecolab Usa Inc. | Use of multiple charged ionic compounds derived from polyamines for waste water clarification |
US11084974B2 (en) | 2018-08-29 | 2021-08-10 | Championx Usa Inc. | Use of multiple charged cationic compounds derived from polyamines for clay stabilization in oil and gas operations |
US20220119739A1 (en) * | 2019-01-15 | 2022-04-21 | Showa Denko K.K. | Decomposing/cleaning composition, method for cleaning adhesive polymer, and method for producing device wafer |
EP3897143A1 (en) | 2019-01-29 | 2021-10-27 | Ecolab USA Inc. | Use of cationic sugar-based compounds for microbial fouling control in a water system |
US12089590B2 (en) | 2019-02-06 | 2024-09-17 | Virox Technologies, Inc. | Shelf-stable antimicrobial compositions |
US10952430B2 (en) | 2019-02-06 | 2021-03-23 | Virox Technologies Inc. | Shelf-stable antimicrobial compositions |
WO2020214196A1 (en) | 2019-04-16 | 2020-10-22 | Ecolab Usa Inc. | Use of multiple charged cationic compounds derived from polyamines and compositions thereof for corrosion inhibition in a water system |
CN111863712B (en) * | 2019-04-24 | 2024-07-16 | 台湾积体电路制造股份有限公司 | Semiconductor structure and method for forming semiconductor structure |
WO2021049330A1 (en) * | 2019-09-11 | 2021-03-18 | 富士フイルム株式会社 | Processing liquid, processing method |
WO2021097531A1 (en) * | 2019-11-22 | 2021-05-27 | Deakin University | Polyionic corrosion inhibitors |
WO2021097532A1 (en) * | 2019-11-22 | 2021-05-27 | Deakin University | Organic corrosion inhibitors |
CA3083522A1 (en) * | 2020-06-12 | 2021-12-12 | Fluid Energy Group Ltd. | Process to manufacture novel inhibited hydrofluoric acid composition |
CN113921383B (en) | 2021-09-14 | 2022-06-03 | 浙江奥首材料科技有限公司 | Copper surface passivation composition, application thereof and photoresist stripping liquid containing copper surface passivation composition |
Family Cites Families (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4970015A (en) | 1989-12-22 | 1990-11-13 | Chem Shield, Inc. | Radiator cleaning composition and method of manufacture thereof |
US5415813A (en) | 1993-11-22 | 1995-05-16 | Colgate-Palmolive Company | Liquid hard surface cleaning composition with grease release agent |
DE19616120A1 (en) | 1996-04-23 | 1997-10-30 | Basf Ag | Process for the preparation of finely divided water-insoluble polymers of aziridines, modified, water-insoluble polymers of aziridines and their use |
US6755989B2 (en) * | 1997-01-09 | 2004-06-29 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
US6224785B1 (en) * | 1997-08-29 | 2001-05-01 | Advanced Technology Materials, Inc. | Aqueous ammonium fluoride and amine containing compositions for cleaning inorganic residues on semiconductor substrates |
US6896826B2 (en) * | 1997-01-09 | 2005-05-24 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
US6268323B1 (en) | 1997-05-05 | 2001-07-31 | Arch Specialty Chemicals, Inc. | Non-corrosive stripping and cleaning composition |
US6910823B2 (en) | 1998-11-09 | 2005-06-28 | The Procter & Gamble Company | Cleaning composition, pad, wipe, implement, and system and method of use thereof |
US6669391B2 (en) | 1998-11-09 | 2003-12-30 | The Procter & Gamble Company | Cleaning composition, pad, wipe, implement, and system and method of use thereof |
US7144173B2 (en) | 1998-11-09 | 2006-12-05 | The Procter & Gamble Company | Cleaning composition, pad, wipe, implement, and system and method of use thereof |
US6948873B2 (en) | 1998-11-09 | 2005-09-27 | The Procter & Gamble Company | Cleaning composition, pad, wipe implement, and system and method of use thereof |
US7182537B2 (en) | 1998-12-01 | 2007-02-27 | The Procter & Gamble Company | Cleaning composition, pad, wipe, implement, and system and method of use thereof |
US20020168216A1 (en) | 1998-12-01 | 2002-11-14 | Policicchio Nicola John | Cleaning composition, pad, wipe, implement, and system and method of use thereof |
US6673757B1 (en) | 2000-03-22 | 2004-01-06 | Ashland Inc. | Process for removing contaminant from a surface and composition useful therefor |
US6147002A (en) | 1999-05-26 | 2000-11-14 | Ashland Inc. | Process for removing contaminant from a surface and composition useful therefor |
TWI270749B (en) | 1999-06-07 | 2007-01-11 | Tokyo Ohka Kogyo Co Ltd | Photoresist stripping liquid composition and a method of stripping photoresists using the same |
US6344432B1 (en) | 1999-08-20 | 2002-02-05 | Advanced Technology Materials, Inc. | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures |
US6726386B1 (en) | 1999-10-08 | 2004-04-27 | The Procter & Gamble Company | Semi-enclosed applicator and a cleaning composition contained therein |
US6599370B2 (en) * | 2000-10-16 | 2003-07-29 | Mallinckrodt Inc. | Stabilized alkaline compositions for cleaning microelectronic substrates |
JP4810764B2 (en) | 2001-06-29 | 2011-11-09 | 三菱瓦斯化学株式会社 | Resist stripper composition |
EP1407326A1 (en) | 2001-07-13 | 2004-04-14 | Ekc Technology, Inc. | Sulfoxide pyrrolid(in)one alkanolamine stripping and cleaning composition |
US7416680B2 (en) | 2001-10-12 | 2008-08-26 | International Business Machines Corporation | Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate |
US20030119692A1 (en) * | 2001-12-07 | 2003-06-26 | So Joseph K. | Copper polishing cleaning solution |
US20030129846A1 (en) * | 2002-01-09 | 2003-07-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for achieving a uniform material removal rate in a CMP process |
EP1335016A1 (en) | 2002-02-06 | 2003-08-13 | Shipley Company LLC | Cleaning composition |
JP4443864B2 (en) | 2002-07-12 | 2010-03-31 | 株式会社ルネサステクノロジ | Cleaning solution for removing resist or etching residue and method for manufacturing semiconductor device |
BR0314184B1 (en) | 2002-09-12 | 2013-02-05 | polymer system, cleaning composition and site cleaning method. | |
SG129274A1 (en) * | 2003-02-19 | 2007-02-26 | Mitsubishi Gas Chemical Co | Cleaaning solution and cleaning process using the solution |
JP2004302271A (en) * | 2003-03-31 | 2004-10-28 | Nippon Zeon Co Ltd | Stripping liquid for resist and stripping method |
TWI250202B (en) * | 2003-05-13 | 2006-03-01 | Eternal Chemical Co Ltd | Process and slurry for chemical mechanical polishing |
US20050089489A1 (en) | 2003-10-22 | 2005-04-28 | Carter Melvin K. | Composition for exfoliation agent effective in removing resist residues |
TWI244498B (en) * | 2003-11-20 | 2005-12-01 | Eternal Chemical Co Ltd | Chemical mechanical abrasive slurry and method of using the same |
CN101923294B (en) | 2004-02-11 | 2013-12-04 | 安万托特性材料股份有限公司 | Composition for cleaning microelectronic substrates containing halogen oxygen acids, salts and derivatives thereof |
CN101885736B (en) * | 2004-03-30 | 2012-10-03 | 克斯莫石油株式会社 | 5-aminolevulinic acid phosphate salt, process for producing the same and use thereof |
JP4440689B2 (en) | 2004-03-31 | 2010-03-24 | 東友ファインケム株式会社 | Resist stripper composition |
US7306681B2 (en) * | 2004-05-12 | 2007-12-11 | United Microelectronics Corp. | Method of cleaning a semiconductor substrate |
US7273813B2 (en) | 2005-02-08 | 2007-09-25 | Applied Materials, Inc. | Wafer cleaning solution for cobalt electroless application |
US20070015133A1 (en) | 2005-07-13 | 2007-01-18 | Umc Utrecht Holding B.V. | Method for detecting and/or removing protein and/or peptide comprising a cross-beta structure from an aqueous solution comprising a protein |
WO2007063767A1 (en) | 2005-12-01 | 2007-06-07 | Mitsubishi Gas Chemical Company, Inc. | Cleaning solution for semiconductor device or display device, and cleaning method |
JP5770424B2 (en) | 2006-03-21 | 2015-08-26 | ザ プロクター アンド ギャンブルカンパニー | Cleaning composition |
US9058975B2 (en) | 2006-06-09 | 2015-06-16 | Lam Research Corporation | Cleaning solution formulations for substrates |
JP4912791B2 (en) | 2006-08-21 | 2012-04-11 | Jsr株式会社 | Cleaning composition, cleaning method, and manufacturing method of semiconductor device |
AU2008261700B2 (en) | 2007-06-12 | 2014-06-05 | Rhodia Inc. | Hard surface cleaning composition with hydrophilizing agent and method for cleaning hard surfaces |
TWI437093B (en) * | 2007-08-03 | 2014-05-11 | Epoch Material Co Ltd | Aqueous cleaning composition for semiconductor copper processing |
KR101382700B1 (en) | 2007-08-22 | 2014-04-08 | 다이킨 고교 가부시키가이샤 | Solution for removal of residue after semiconductor dry processing, and residue removal method using the same |
US20090137191A1 (en) | 2007-10-29 | 2009-05-28 | Wai Mun Lee | Copper cmp polishing pad cleaning composition comprising of amidoxime compounds |
TW200946621A (en) | 2007-10-29 | 2009-11-16 | Ekc Technology Inc | Chemical mechanical polishing and wafer cleaning composition comprising amidoxime compounds and associated method for use |
US7825079B2 (en) | 2008-05-12 | 2010-11-02 | Ekc Technology, Inc. | Cleaning composition comprising a chelant and quaternary ammonium hydroxide mixture |
US20090291873A1 (en) | 2008-05-22 | 2009-11-26 | Air Products And Chemicals, Inc. | Method and Composition for Post-CMP Cleaning of Copper Interconnects Comprising Noble Metal Barrier Layers |
JP5086893B2 (en) | 2008-05-26 | 2012-11-28 | 花王株式会社 | Cleaning solution for semiconductor device substrates |
US8227394B2 (en) | 2008-11-07 | 2012-07-24 | Lam Research Corporation | Composition of a cleaning material for particle removal |
WO2010125827A1 (en) | 2009-04-30 | 2010-11-04 | ライオン株式会社 | Method for cleaning of semiconductor substrate and acidic solution |
US8277394B2 (en) | 2009-08-18 | 2012-10-02 | Devicor Medical Products, Inc. | Multi-button biopsy device |
WO2011027773A1 (en) | 2009-09-02 | 2011-03-10 | 和光純薬工業株式会社 | Resist remover composition and method for removing resist using the composition |
US20110150817A1 (en) | 2009-12-17 | 2011-06-23 | Ricky Ah-Man Woo | Freshening compositions comprising malodor binding polymers and malodor control components |
US8148310B2 (en) | 2009-10-24 | 2012-04-03 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
US8148311B2 (en) | 2009-10-24 | 2012-04-03 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
US8431516B2 (en) | 2009-10-24 | 2013-04-30 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
TWI447224B (en) | 2009-12-25 | 2014-08-01 | Uwiz Technology Co Ltd | Cleaning composition |
CN102811955B (en) | 2010-01-26 | 2014-07-30 | 控制工程学公司 | Method And Composition For Removing Deposits |
JP5508130B2 (en) * | 2010-05-14 | 2014-05-28 | 富士フイルム株式会社 | Cleaning composition, semiconductor device manufacturing method and cleaning method |
CN102533273A (en) * | 2010-12-31 | 2012-07-04 | 第一毛织株式会社 | Cleaning composition for semiconductor device and method of cleaning semiconductor device using the same |
US20120285484A1 (en) * | 2011-05-13 | 2012-11-15 | Li-Chung Liu | Method for cleaning a semiconductor wafer |
WO2013138278A1 (en) * | 2012-03-12 | 2013-09-19 | Advanced Technology Materials, Inc. | Copper cleaning and protection formulations |
US9536730B2 (en) * | 2012-10-23 | 2017-01-03 | Air Products And Chemicals, Inc. | Cleaning formulations |
JP2014101476A (en) | 2012-11-22 | 2014-06-05 | Sanyo Chem Ind Ltd | Detergent composition for a copper wiring semiconductor |
US9472420B2 (en) | 2013-12-20 | 2016-10-18 | Air Products And Chemicals, Inc. | Composition for titanium nitride hard mask and etch residue removal |
US9957469B2 (en) * | 2014-07-14 | 2018-05-01 | Versum Materials Us, Llc | Copper corrosion inhibition system |
-
2015
- 2015-07-02 US US14/790,966 patent/US9957469B2/en active Active
- 2015-07-09 IL IL239853A patent/IL239853B/en unknown
- 2015-07-09 TW TW104122412A patent/TWI617705B/en active
- 2015-07-09 EP EP15176104.6A patent/EP2975108B1/en active Active
- 2015-07-14 SG SG10201505491UA patent/SG10201505491UA/en unknown
- 2015-07-14 CN CN201510413897.5A patent/CN105261554B/en active Active
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Also Published As
Publication number | Publication date |
---|---|
US20160010035A1 (en) | 2016-01-14 |
KR101874556B1 (en) | 2018-07-05 |
EP2975108B1 (en) | 2018-04-18 |
IL239853B (en) | 2022-01-01 |
KR20160008478A (en) | 2016-01-22 |
JP6117866B2 (en) | 2017-04-19 |
CN105261554B (en) | 2018-08-21 |
TWI617705B (en) | 2018-03-11 |
JP2016021573A (en) | 2016-02-04 |
CN105261554A (en) | 2016-01-20 |
EP2975108A1 (en) | 2016-01-20 |
TW201602413A (en) | 2016-01-16 |
US9957469B2 (en) | 2018-05-01 |
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