SG10201406857YA - Liquid Processing Jig And Liquid Processing Method - Google Patents
Liquid Processing Jig And Liquid Processing MethodInfo
- Publication number
- SG10201406857YA SG10201406857YA SG10201406857YA SG10201406857YA SG10201406857YA SG 10201406857Y A SG10201406857Y A SG 10201406857YA SG 10201406857Y A SG10201406857Y A SG 10201406857YA SG 10201406857Y A SG10201406857Y A SG 10201406857YA SG 10201406857Y A SG10201406857Y A SG 10201406857YA
- Authority
- SG
- Singapore
- Prior art keywords
- liquid processing
- jig
- processing method
- processing jig
- liquid
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title 2
- 238000003672 processing method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/12—Etching of semiconducting materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013219014A JP2015081362A (en) | 2013-10-22 | 2013-10-22 | Liquid treatment jig and method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201406857YA true SG10201406857YA (en) | 2015-05-28 |
Family
ID=52825215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201406857YA SG10201406857YA (en) | 2013-10-22 | 2014-10-23 | Liquid Processing Jig And Liquid Processing Method |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150108001A1 (en) |
JP (1) | JP2015081362A (en) |
KR (1) | KR20150046759A (en) |
SG (1) | SG10201406857YA (en) |
TW (1) | TW201529176A (en) |
-
2013
- 2013-10-22 JP JP2013219014A patent/JP2015081362A/en active Pending
-
2014
- 2014-10-16 TW TW103135871A patent/TW201529176A/en unknown
- 2014-10-21 US US14/520,031 patent/US20150108001A1/en not_active Abandoned
- 2014-10-22 KR KR20140143194A patent/KR20150046759A/en not_active Application Discontinuation
- 2014-10-23 SG SG10201406857YA patent/SG10201406857YA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2015081362A (en) | 2015-04-27 |
TW201529176A (en) | 2015-08-01 |
KR20150046759A (en) | 2015-04-30 |
US20150108001A1 (en) | 2015-04-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2998844A4 (en) | Application association processing method and apparatus | |
HUE053410T2 (en) | Application method and application facility | |
EP2923791A4 (en) | Machining device and machining method | |
GB201302787D0 (en) | Method and apparatus | |
GB201311264D0 (en) | Apparatus and method | |
EP2962801A4 (en) | Machining device and machining method | |
EP2967002A4 (en) | Spherification/reverse spherification automated and integrated apparatus and method | |
HK1206506A1 (en) | Operational processing method and apparatus | |
GB201306083D0 (en) | Method and apparatus | |
GB201319319D0 (en) | Apparatus and method | |
GB201309915D0 (en) | Stall-start method and apparatus | |
GB201306495D0 (en) | Apparatus and method | |
GB201311150D0 (en) | Apparatus and method | |
GB201309689D0 (en) | Method and apparatus | |
GB201413597D0 (en) | Apparatus and method | |
EP3076642A4 (en) | Operation processing method and device | |
GB201320657D0 (en) | Apparatus and method | |
GB201416607D0 (en) | Method and apparatus | |
GB201321397D0 (en) | Method and apparatus | |
GB201305942D0 (en) | Apparatus and method | |
GB201315763D0 (en) | Method and apparatus | |
GB201315003D0 (en) | Apparatus and method | |
GB201319453D0 (en) | Apparatus and method | |
GB201317037D0 (en) | Apparatus and method | |
GB201316037D0 (en) | Apparatus and method |