SG10201406786SA - Method and apparatus for component removal - Google Patents

Method and apparatus for component removal

Info

Publication number
SG10201406786SA
SG10201406786SA SG10201406786SA SG10201406786SA SG10201406786SA SG 10201406786S A SG10201406786S A SG 10201406786SA SG 10201406786S A SG10201406786S A SG 10201406786SA SG 10201406786S A SG10201406786S A SG 10201406786SA SG 10201406786S A SG10201406786S A SG 10201406786SA
Authority
SG
Singapore
Prior art keywords
components
component removal
proposed invention
isothermal
component
Prior art date
Application number
SG10201406786SA
Inventor
Pranamesh Das
Nitin Gupta
Khadak Singh
Abdul Rehman
Original Assignee
Attero Recycling Pvt Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Attero Recycling Pvt Ltd filed Critical Attero Recycling Pvt Ltd
Publication of SG10201406786SA publication Critical patent/SG10201406786SA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
    • B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
    • B07B1/46—Constructional details of screens in general; Cleaning or heating of screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
    • B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
    • B07B1/28—Moving screens not otherwise provided for, e.g. swinging, reciprocating, rocking, tilting or wobbling screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Processing Of Solid Wastes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

\"Method and Apparatus for Component Removals\" The proposed invention relates to an apparatus and a method of separating all the parts including but not limited to electronic components, mechanical components, and electromechanical components, modules etc either individually or in sections and modular parts from the main input PCB. The proposed invention is an apparatus and method for component removal during recycling of an electronic device comprising in combination an isothermal system; heating to achieve desired range of temperature within the said isothermal system; at least one system for mechanical handling of the object being recycled; at least one system for selective separation of components being removed. Fig. 1 20
SG10201406786SA 2011-04-20 2012-04-20 Method and apparatus for component removal SG10201406786SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IN1048DE2011 2011-04-20

Publications (1)

Publication Number Publication Date
SG10201406786SA true SG10201406786SA (en) 2014-12-30

Family

ID=54193676

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2013077052A SG194507A1 (en) 2011-04-20 2012-04-20 Method and apparatus for component removal
SG10201406786SA SG10201406786SA (en) 2011-04-20 2012-04-20 Method and apparatus for component removal

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2013077052A SG194507A1 (en) 2011-04-20 2012-04-20 Method and apparatus for component removal

Country Status (8)

Country Link
US (1) US9597711B2 (en)
EP (1) EP2700291B1 (en)
KR (1) KR20140029455A (en)
CN (1) CN103563507B (en)
AU (1) AU2012245886B2 (en)
BR (1) BR112013026901A2 (en)
SG (2) SG194507A1 (en)
WO (1) WO2012143951A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140217157A1 (en) * 2013-02-07 2014-08-07 Greene Lyon Group, Inc. Removal of electronic chips and other components from printed wire boards using liquid heat media
US10362720B2 (en) 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
CN104942527B (en) * 2015-06-01 2017-12-08 合肥京东方光电科技有限公司 A kind of integrated chip pulling machine and its application method
TW201726286A (en) * 2015-12-19 2017-08-01 艾特羅回收股份有限公司 Method and a system for salvaging functional components from e-waste
CN109073320A (en) 2016-02-08 2018-12-21 新南创新私人有限公司 A kind of methods, devices and systems handling compound rubbish source
CN106492976B (en) * 2017-01-10 2018-08-28 中冶北方（大连）工程技术有限公司 A kind of deslagging screen case apparatus
US11045913B1 (en) 2018-04-13 2021-06-29 Apple Inc. Modular system for automated portable electronic device disassembly
US11136191B1 (en) 2018-04-13 2021-10-05 Apple Inc. Modular system for automated portable electronic device disassembly
US11051441B1 (en) * 2018-04-13 2021-06-29 Apple Inc. Modular system for automated portable electronic device disassembly
US11157043B1 (en) 2018-04-13 2021-10-26 Apple Inc. Modular system for automated portable electronic device disassembly
US11129318B1 (en) 2018-04-13 2021-09-21 Apple Inc. Modular system for automated portable electronic device disassembly

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4696096A (en) * 1986-02-21 1987-09-29 Micro Electronic Systems, Inc. Reworking methods and apparatus for surface mounted technology circuit boards
EP0274059B1 (en) 1986-12-12 1992-02-05 Recytec S.A. Process for the recycling of electrical batteries, assembled printed circuit boards and electronic components
US5148969A (en) * 1991-11-27 1992-09-22 Digital Equipment Corporation Component reclamation apparatus and method
JP2707189B2 (en) * 1992-08-26 1998-01-28 株式会社日立製作所 Method and apparatus for removing electronic component from substrate
DE4241412C2 (en) * 1992-12-09 1994-10-06 F E S Used Electronics Elektro System for the simultaneous removal of surface-mounted components
DE4330677A1 (en) * 1993-09-10 1995-03-16 Schenck Eng Gmbh Method and device for removing components from printed circuit boards having electrical and/or electronic components arranged on them
US5715592A (en) * 1994-11-08 1998-02-10 Nec Corporation Parts disassembling apparatus
DE19518277C1 (en) 1995-05-18 1996-05-23 Daimler Benz Ag Process for processing scrap from assembled printed circuit boards from electrical or electronic devices
US5758817A (en) * 1996-03-19 1998-06-02 Resource Concepts, Inc. Apparatus and process for removing surface mounted components from printed wiring assemblies
US6220503B1 (en) * 1999-02-02 2001-04-24 International Business Machines Corporation Rework and underfill nozzle for electronic components
US6234317B1 (en) 1999-04-15 2001-05-22 Wolfgang Sommer Device for sorting raw, pre-treated or recycled bulk material
TW546994B (en) * 2002-10-24 2003-08-11 Htc Corp Electronic components carrier for collecting electronic components dropping from a circuit board and related method
WO2007004259A1 (en) * 2005-06-30 2007-01-11 Fujitsu Limited Method and device for removing micro component
US20110024484A1 (en) * 2008-03-24 2011-02-03 Vapor Works, Inc. Vapor phase rework station and method

Also Published As

Publication number Publication date
EP2700291A2 (en) 2014-02-26
BR112013026901A2 (en) 2017-10-03
SG194507A1 (en) 2013-12-30
US9597711B2 (en) 2017-03-21
WO2012143951A2 (en) 2012-10-26
CN103563507B (en) 2016-06-29
KR20140029455A (en) 2014-03-10
AU2012245886B2 (en) 2016-04-14
CN103563507A (en) 2014-02-05
WO2012143951A3 (en) 2013-05-23
EP2700291B1 (en) 2017-11-29
US20140251876A1 (en) 2014-09-11
AU2012245886A1 (en) 2013-12-05
WO2012143951A4 (en) 2013-07-11

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