SG10201405046XA - Direct drive arrangement to control confinement rings positioning and methods thereof - Google Patents

Direct drive arrangement to control confinement rings positioning and methods thereof

Info

Publication number
SG10201405046XA
SG10201405046XA SG10201405046XA SG10201405046XA SG10201405046XA SG 10201405046X A SG10201405046X A SG 10201405046XA SG 10201405046X A SG10201405046X A SG 10201405046XA SG 10201405046X A SG10201405046X A SG 10201405046XA SG 10201405046X A SG10201405046X A SG 10201405046XA
Authority
SG
Singapore
Prior art keywords
methods
drive arrangement
direct drive
confinement rings
control confinement
Prior art date
Application number
SG10201405046XA
Inventor
John W Rasnick
Fred D Egley
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201405046XA publication Critical patent/SG10201405046XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32807—Construction (includes replacing parts of the apparatus)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
SG10201405046XA 2009-09-01 2010-08-26 Direct drive arrangement to control confinement rings positioning and methods thereof SG10201405046XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/552,233 US8992722B2 (en) 2009-09-01 2009-09-01 Direct drive arrangement to control confinement rings positioning and methods thereof

Publications (1)

Publication Number Publication Date
SG10201405046XA true SG10201405046XA (en) 2014-10-30

Family

ID=43626035

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2012008330A SG178290A1 (en) 2009-09-01 2010-08-26 Direct drive arrangement to control confinement rings positioning and methods thereof
SG10201405046XA SG10201405046XA (en) 2009-09-01 2010-08-26 Direct drive arrangement to control confinement rings positioning and methods thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2012008330A SG178290A1 (en) 2009-09-01 2010-08-26 Direct drive arrangement to control confinement rings positioning and methods thereof

Country Status (7)

Country Link
US (1) US8992722B2 (en)
JP (1) JP5662451B2 (en)
KR (1) KR101711686B1 (en)
CN (2) CN102484043B (en)
SG (2) SG178290A1 (en)
TW (1) TWI536870B (en)
WO (1) WO2011028599A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110113066A (en) * 2010-04-08 2011-10-14 삼성전자주식회사 Plasma processing method of semiconductor manufacturing apparatus
US10837106B2 (en) * 2015-05-12 2020-11-17 Corner Star Limited Clamping assembly for a reactor system
CN107335919B (en) * 2016-04-29 2019-05-31 上海微电子装备（集团）股份有限公司 A kind of laser package device and packaging method
US11670490B2 (en) * 2017-09-29 2023-06-06 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit fabrication system with adjustable gas injector

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5646733A (en) * 1996-01-29 1997-07-08 Medar, Inc. Scanning phase measuring method and system for an object at a vision station
US5796066A (en) * 1996-03-29 1998-08-18 Lam Research Corporation Cable actuated drive assembly for vacuum chamber
US6019060A (en) * 1998-06-24 2000-02-01 Lam Research Corporation Cam-based arrangement for positioning confinement rings in a plasma processing chamber
US6350317B1 (en) * 1999-12-30 2002-02-26 Lam Research Corporation Linear drive system for use in a plasma processing system
US6492774B1 (en) * 2000-10-04 2002-12-10 Lam Research Corporation Wafer area pressure control for plasma confinement
JP3388228B2 (en) * 2000-12-07 2003-03-17 株式会社半導体先端テクノロジーズ Plasma etching apparatus and plasma etching method
KR20030067196A (en) * 2002-02-07 2003-08-14 삼성전자주식회사 robot control system
US6744212B2 (en) * 2002-02-14 2004-06-01 Lam Research Corporation Plasma processing apparatus and method for confining an RF plasma under very high gas flow and RF power density conditions
US6841943B2 (en) * 2002-06-27 2005-01-11 Lam Research Corp. Plasma processor with electrode simultaneously responsive to plural frequencies
US20050263070A1 (en) * 2004-05-25 2005-12-01 Tokyo Electron Limited Pressure control and plasma confinement in a plasma processing chamber
KR20060020809A (en) * 2004-09-01 2006-03-07 삼성전자주식회사 Etching apparatus of semiconductor fabrication process
KR100790392B1 (en) * 2004-11-12 2008-01-02 삼성전자주식회사 Device for making semiconductor
US7364623B2 (en) * 2005-01-27 2008-04-29 Lam Research Corporation Confinement ring drive
US7575638B2 (en) * 2007-02-02 2009-08-18 Lam Research Corporation Apparatus for defining regions of process exclusion and process performance in a process chamber
US7740736B2 (en) * 2006-06-08 2010-06-22 Lam Research Corporation Methods and apparatus for preventing plasma un-confinement events in a plasma processing chamber
US8043430B2 (en) * 2006-12-20 2011-10-25 Lam Research Corporation Methods and apparatuses for controlling gas flow conductance in a capacitively-coupled plasma processing chamber
US7732728B2 (en) * 2007-01-17 2010-06-08 Lam Research Corporation Apparatuses for adjusting electrode gap in capacitively-coupled RF plasma reactor
TWI516175B (en) * 2008-02-08 2016-01-01 蘭姆研究公司 A method to stabilize pressure in a plasma processing chamber, and a program storage medium of same
US8313612B2 (en) * 2009-03-24 2012-11-20 Lam Research Corporation Method and apparatus for reduction of voltage potential spike during dechucking

Also Published As

Publication number Publication date
CN102484043B (en) 2015-08-19
KR20120073220A (en) 2012-07-04
US20110054661A1 (en) 2011-03-03
CN104362067B (en) 2017-04-12
TW201130393A (en) 2011-09-01
SG178290A1 (en) 2012-03-29
CN104362067A (en) 2015-02-18
JP5662451B2 (en) 2015-01-28
KR101711686B1 (en) 2017-03-02
CN102484043A (en) 2012-05-30
US8992722B2 (en) 2015-03-31
WO2011028599A3 (en) 2011-06-16
JP2013504202A (en) 2013-02-04
TWI536870B (en) 2016-06-01
WO2011028599A2 (en) 2011-03-10

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