SG10201402255WA - Dressing apparatus, polishing apparatus having the dressing apparatus, and polishing method - Google Patents

Dressing apparatus, polishing apparatus having the dressing apparatus, and polishing method

Info

Publication number
SG10201402255WA
SG10201402255WA SG10201402255WA SG10201402255WA SG10201402255WA SG 10201402255W A SG10201402255W A SG 10201402255WA SG 10201402255W A SG10201402255W A SG 10201402255WA SG 10201402255W A SG10201402255W A SG 10201402255WA SG 10201402255W A SG10201402255W A SG 10201402255WA
Authority
SG
Singapore
Prior art keywords
polishing
dressing
dressing apparatus
polishing method
kvyf
Prior art date
Application number
SG10201402255WA
Inventor
Nagai Satoshi
Ogura Suguru
Hamaura Kaoru
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201402255WA publication Critical patent/SG10201402255WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/005—Positioning devices for conditioning tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

mfrMwZhZo pvr>y^stft, mmzwm-tzwmmcmmvxmwm M© Yvy'yytfH T5 KVyf-i^ KVyf-fc^g^SB^-S KVyf-v-^y V t, Kl'S'f-o«8®©-f|5lcTlPJtWaSr#^5^< i 11 Figure 4 17
SG10201402255WA 2013-05-15 2014-05-12 Dressing apparatus, polishing apparatus having the dressing apparatus, and polishing method SG10201402255WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013102970A JP6121795B2 (en) 2013-05-15 2013-05-15 Dressing apparatus, polishing apparatus equipped with the dressing apparatus, and polishing method

Publications (1)

Publication Number Publication Date
SG10201402255WA true SG10201402255WA (en) 2014-12-30

Family

ID=51935668

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201402255WA SG10201402255WA (en) 2013-05-15 2014-05-12 Dressing apparatus, polishing apparatus having the dressing apparatus, and polishing method

Country Status (3)

Country Link
US (1) US9855638B2 (en)
JP (1) JP6121795B2 (en)
SG (1) SG10201402255WA (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10702972B2 (en) * 2012-05-31 2020-07-07 Ebara Corporation Polishing apparatus
JP6307428B2 (en) 2014-12-26 2018-04-04 株式会社荏原製作所 Polishing apparatus and control method thereof
US11292101B2 (en) * 2017-11-22 2022-04-05 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
JP7265848B2 (en) * 2018-08-23 2023-04-27 株式会社荏原製作所 Method for determining polishing pad height, and polishing system

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1071560A (en) * 1996-08-27 1998-03-17 Speedfam Co Ltd Wafer pressurizing device
US5738568A (en) * 1996-10-04 1998-04-14 International Business Machines Corporation Flexible tilted wafer carrier
US6077385A (en) * 1997-04-08 2000-06-20 Ebara Corporation Polishing apparatus
JPH10315118A (en) * 1997-05-19 1998-12-02 Toshiba Corp Abrasive cloth dressing device
JPH11179651A (en) * 1997-12-17 1999-07-06 Ebara Corp Substrate holder and polishing device provided with this substrate holder
JPH11277406A (en) * 1998-03-27 1999-10-12 Ebara Corp Polishing device
JP2000005988A (en) * 1998-04-24 2000-01-11 Ebara Corp Polishing device
JP2000052233A (en) 1998-08-10 2000-02-22 Sony Corp Polishing device
JP3772946B2 (en) 1999-03-11 2006-05-10 株式会社荏原製作所 Dressing apparatus and polishing apparatus provided with the dressing apparatus
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
JP2001162513A (en) * 1999-12-09 2001-06-19 Daido Steel Co Ltd Lapping surface truing device for single-side lapping machine
US6969305B2 (en) * 2000-02-07 2005-11-29 Ebara Corporation Polishing apparatus
US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
TW495416B (en) * 2000-10-24 2002-07-21 Ebara Corp Polishing apparatus
CN1553842A (en) * 2001-09-10 2004-12-08 株式会社尼康 Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method
US7011566B2 (en) * 2002-08-26 2006-03-14 Micron Technology, Inc. Methods and systems for conditioning planarizing pads used in planarizing substrates
US7004825B1 (en) * 2003-09-29 2006-02-28 Lam Research Corporation Apparatus and associated method for conditioning in chemical mechanical planarization
US7182680B2 (en) * 2004-06-22 2007-02-27 Applied Materials, Inc. Apparatus for conditioning processing pads
US7077722B2 (en) * 2004-08-02 2006-07-18 Micron Technology, Inc. Systems and methods for actuating end effectors to condition polishing pads used for polishing microfeature workpieces
JP2006175534A (en) 2004-12-21 2006-07-06 Nippon Quality Links Kk Polishing method and polishing device
JP2008087081A (en) * 2006-09-29 2008-04-17 Oki Electric Ind Co Ltd Grinder, and grinding adjusting method of grinding pad
US8096852B2 (en) * 2008-08-07 2012-01-17 Applied Materials, Inc. In-situ performance prediction of pad conditioning disk by closed loop torque monitoring
JP5976522B2 (en) 2012-05-31 2016-08-23 株式会社荏原製作所 Polishing apparatus and polishing method

Also Published As

Publication number Publication date
US9855638B2 (en) 2018-01-02
US20140349552A1 (en) 2014-11-27
JP2014223683A (en) 2014-12-04
JP6121795B2 (en) 2017-04-26

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