SG10201402193TA - Chemical mechanical polishing fixture having lateral perforation structures - Google Patents

Chemical mechanical polishing fixture having lateral perforation structures

Info

Publication number
SG10201402193TA
SG10201402193TA SG10201402193TA SG10201402193TA SG10201402193TA SG 10201402193T A SG10201402193T A SG 10201402193TA SG 10201402193T A SG10201402193T A SG 10201402193TA SG 10201402193T A SG10201402193T A SG 10201402193TA SG 10201402193T A SG10201402193T A SG 10201402193TA
Authority
SG
Singapore
Prior art keywords
lateral perforation
mechanical polishing
chemical mechanical
polishing fixture
lateral
Prior art date
Application number
SG10201402193TA
Inventor
Hui-Chen Yen
Original Assignee
Kai Fung Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kai Fung Technology Co Ltd filed Critical Kai Fung Technology Co Ltd
Publication of SG10201402193TA publication Critical patent/SG10201402193TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

CHEMICAL MECHANICAL POLISHING FIXTURE HAVING LATERAL PERFORATION 5 A chemical mechanical polishing fixture having lateral perforation structures includes: a holder and a retaining ring. The holder includes: an annular substrate, a plurality of third holes and a plurality of lateral perforation structures. The annular substrate has a first joint surface, an outer periphery and an inner periphery. The third holes are annularly arranged on the first joint surface, and each third hole includes first a inner thread structure 10 for individually providing a screw to be locked to a semiconductor machine. The lateral perforation structures penetrate from the outer periphery to the inner periphery of the annular substrate, where the lateral perforations are selected from: a converse U-shaped cube structure, an converse U-shaped cube structure, a cuboid stmcture, a cylinder structure, an elliptic cylinder structure, a flat cuboid structure or a hybrid structure of at least one 15 cuboid structure and the above. Figure 2A 28/28
SG10201402193TA 2013-05-17 2014-05-08 Chemical mechanical polishing fixture having lateral perforation structures SG10201402193TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102209298U TWM465989U (en) 2013-05-17 2013-05-17 Chemical mechanical grinding fixture having lateral through-hole structure

Publications (1)

Publication Number Publication Date
SG10201402193TA true SG10201402193TA (en) 2014-12-30

Family

ID=49992831

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201402193TA SG10201402193TA (en) 2013-05-17 2014-05-08 Chemical mechanical polishing fixture having lateral perforation structures

Country Status (3)

Country Link
US (1) US9337075B2 (en)
SG (1) SG10201402193TA (en)
TW (1) TWM465989U (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101455311B1 (en) * 2013-07-11 2014-10-27 주식회사 윌비에스엔티 Retainner Ring of Chemical Mechanical Polishing Apparatus
US20150050869A1 (en) * 2013-08-13 2015-02-19 Cnus Co., Ltd. Retainer ring structure for chemical-mechanical polishing machine and method for manufacturing the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070224864A1 (en) * 2005-05-24 2007-09-27 John Burns CMP retaining ring
KR101938706B1 (en) * 2012-06-05 2019-01-15 어플라이드 머티어리얼스, 인코포레이티드 Two-part retaining ring with interlock features
US9227297B2 (en) * 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments

Also Published As

Publication number Publication date
US20140342643A1 (en) 2014-11-20
US9337075B2 (en) 2016-05-10
TWM465989U (en) 2013-11-21

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