SE9803180D0 - Mobile phone - Google Patents
Mobile phoneInfo
- Publication number
- SE9803180D0 SE9803180D0 SE9803180A SE9803180A SE9803180D0 SE 9803180 D0 SE9803180 D0 SE 9803180D0 SE 9803180 A SE9803180 A SE 9803180A SE 9803180 A SE9803180 A SE 9803180A SE 9803180 D0 SE9803180 D0 SE 9803180D0
- Authority
- SE
- Sweden
- Prior art keywords
- plastic material
- mobile phone
- metal
- deposition
- covered
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9803180A SE9803180L (sv) | 1998-09-18 | 1998-09-18 | Mobiltelefon |
BR9913796-8A BR9913796A (pt) | 1998-09-18 | 1999-09-16 | Processos para aplicar linhas condutoras em um detalhe, e para aplicar um padrão de circuito condutor em um detalhe |
AU63768/99A AU6376899A (en) | 1998-09-18 | 1999-09-16 | Method for applying conductive lines on the casing of mobile phone |
KR1020017003047A KR20010086392A (ko) | 1998-09-18 | 1999-09-16 | 이동 전화기의 케이싱 상에 도전성 라인을 형성하기 위한방법 |
PCT/SE1999/001551 WO2000018200A1 (en) | 1998-09-18 | 1999-09-16 | Method for applying conductive lines on the casing of mobile phone |
JP2000571725A JP2002525881A (ja) | 1998-09-18 | 1999-09-16 | 移動電話機のケーシングに導体線を形成する方法 |
CN99810845A CN1318272A (zh) | 1998-09-18 | 1999-09-16 | 在移动电话的外壳上敷设导电线路的方法 |
EP99951306A EP1133903A1 (en) | 1998-09-18 | 1999-09-16 | Method for applying conductive lines on the casing of mobile phone |
EEP200100094A EE200100094A (et) | 1998-09-18 | 1999-09-16 | Meetod mobiiltelefoni korpusele juhtribade kandmiseks |
HK02102754.0A HK1041153A1 (zh) | 1998-09-18 | 2002-04-11 | 在移動電話的外殼上敷設導電綫路的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9803180A SE9803180L (sv) | 1998-09-18 | 1998-09-18 | Mobiltelefon |
Publications (2)
Publication Number | Publication Date |
---|---|
SE9803180D0 true SE9803180D0 (sv) | 1998-09-18 |
SE9803180L SE9803180L (sv) | 2000-03-19 |
Family
ID=20412645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9803180A SE9803180L (sv) | 1998-09-18 | 1998-09-18 | Mobiltelefon |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP1133903A1 (sv) |
JP (1) | JP2002525881A (sv) |
KR (1) | KR20010086392A (sv) |
CN (1) | CN1318272A (sv) |
AU (1) | AU6376899A (sv) |
BR (1) | BR9913796A (sv) |
EE (1) | EE200100094A (sv) |
HK (1) | HK1041153A1 (sv) |
SE (1) | SE9803180L (sv) |
WO (1) | WO2000018200A1 (sv) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101133312B1 (ko) * | 2010-08-13 | 2012-04-04 | 삼성전기주식회사 | 전송 선로 패턴이 케이스에 매립되는 전자장치 및 그 제조방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2391392A1 (fr) * | 1977-05-16 | 1978-12-15 | Skf Cie Applic Mecanique | Butee d'embrayage a auto-centrage comportant des moyens de guidage |
FR2629665B1 (fr) * | 1988-03-30 | 1991-01-11 | Bendix Electronics Sa | Boitier pour circuit electronique |
US5693209A (en) * | 1989-09-14 | 1997-12-02 | Atotech Deutschland Gmbh | Process for metallization of a nonconductor surface |
-
1998
- 1998-09-18 SE SE9803180A patent/SE9803180L/sv not_active Application Discontinuation
-
1999
- 1999-09-16 KR KR1020017003047A patent/KR20010086392A/ko not_active Application Discontinuation
- 1999-09-16 WO PCT/SE1999/001551 patent/WO2000018200A1/en not_active Application Discontinuation
- 1999-09-16 CN CN99810845A patent/CN1318272A/zh active Pending
- 1999-09-16 AU AU63768/99A patent/AU6376899A/en not_active Abandoned
- 1999-09-16 EE EEP200100094A patent/EE200100094A/xx unknown
- 1999-09-16 EP EP99951306A patent/EP1133903A1/en not_active Withdrawn
- 1999-09-16 JP JP2000571725A patent/JP2002525881A/ja active Pending
- 1999-09-16 BR BR9913796-8A patent/BR9913796A/pt not_active IP Right Cessation
-
2002
- 2002-04-11 HK HK02102754.0A patent/HK1041153A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
SE9803180L (sv) | 2000-03-19 |
EP1133903A1 (en) | 2001-09-19 |
EE200100094A (et) | 2002-06-17 |
AU6376899A (en) | 2000-04-10 |
HK1041153A1 (zh) | 2002-06-28 |
KR20010086392A (ko) | 2001-09-10 |
CN1318272A (zh) | 2001-10-17 |
JP2002525881A (ja) | 2002-08-13 |
WO2000018200A1 (en) | 2000-03-30 |
BR9913796A (pt) | 2001-05-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |