SE9303142L - Microwave circuit with impedance interface interface - Google Patents

Microwave circuit with impedance interface interface

Info

Publication number
SE9303142L
SE9303142L SE9303142A SE9303142A SE9303142L SE 9303142 L SE9303142 L SE 9303142L SE 9303142 A SE9303142 A SE 9303142A SE 9303142 A SE9303142 A SE 9303142A SE 9303142 L SE9303142 L SE 9303142L
Authority
SE
Sweden
Prior art keywords
interface
impedance
microwave circuit
interface means
matching
Prior art date
Application number
SE9303142A
Other languages
Swedish (sv)
Other versions
SE9303142D0 (en
SE500982C2 (en
Inventor
Lars Persson
Original Assignee
Sivers Ima Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sivers Ima Ab filed Critical Sivers Ima Ab
Priority to SE9303142A priority Critical patent/SE500982C2/en
Publication of SE9303142D0 publication Critical patent/SE9303142D0/en
Priority to PCT/SE1994/000888 priority patent/WO1995009452A1/en
Priority to EP94928544A priority patent/EP0721676A1/en
Publication of SE9303142L publication Critical patent/SE9303142L/en
Publication of SE500982C2 publication Critical patent/SE500982C2/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/0243Printed circuits associated with mounted high frequency components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/02Coupling devices of the waveguide type with invariable factor of coupling
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguides (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to a microwave circuit comprising a two-sided substrate (1) with microwave components, a ground plane (5) and at least one interface means impedance-matched for external connection of the microwave circuit. The interface means has an external-connection point (6). The impedance matching of the interface means comprises a matching pattern (11) arranged on one side of the substrate (1) and connected to a ground plane (5) arranged on the opposite side. The matching pattern provides a circuit with excellent matching, thus giving low power losses at significantly higher frequencies than the prior art.
SE9303142A 1993-09-27 1993-09-27 Microwave circuit with impedance interface interface SE500982C2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE9303142A SE500982C2 (en) 1993-09-27 1993-09-27 Microwave circuit with impedance interface interface
PCT/SE1994/000888 WO1995009452A1 (en) 1993-09-27 1994-09-26 Microwave circuit
EP94928544A EP0721676A1 (en) 1993-09-27 1994-09-26 Microwave circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9303142A SE500982C2 (en) 1993-09-27 1993-09-27 Microwave circuit with impedance interface interface

Publications (3)

Publication Number Publication Date
SE9303142D0 SE9303142D0 (en) 1993-09-27
SE9303142L true SE9303142L (en) 1994-10-10
SE500982C2 SE500982C2 (en) 1994-10-10

Family

ID=20391225

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9303142A SE500982C2 (en) 1993-09-27 1993-09-27 Microwave circuit with impedance interface interface

Country Status (3)

Country Link
EP (1) EP0721676A1 (en)
SE (1) SE500982C2 (en)
WO (1) WO1995009452A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE9502326D0 (en) * 1995-06-27 1995-06-27 Sivers Ima Ab Microwave circuit, such circuit of nested embodiment, and use of the microwave circuit in a circuit arrangement
US7956623B2 (en) 2007-02-16 2011-06-07 Countlab, Inc Container filling machine
US20130042943A1 (en) 2011-08-18 2013-02-21 Countlab, Inc. Container filling machine
JP2022141037A (en) * 2021-03-15 2022-09-29 住友電気工業株式会社 Printed board and printed board assembly

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4626805A (en) * 1985-04-26 1986-12-02 Tektronix, Inc. Surface mountable microwave IC package
US5057798A (en) * 1990-06-22 1991-10-15 Hughes Aircraft Company Space-saving two-sided microwave circuitry for hybrid circuits
US5097233A (en) * 1990-12-20 1992-03-17 Hughes Aircraft Company Coplanar 3dB quadrature coupler

Also Published As

Publication number Publication date
SE9303142D0 (en) 1993-09-27
WO1995009452A1 (en) 1995-04-06
EP0721676A1 (en) 1996-07-17
SE500982C2 (en) 1994-10-10

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Legal Events

Date Code Title Description
NUG Patent has lapsed