SE9303142L - Microwave circuit with impedance interface interface - Google Patents
Microwave circuit with impedance interface interfaceInfo
- Publication number
- SE9303142L SE9303142L SE9303142A SE9303142A SE9303142L SE 9303142 L SE9303142 L SE 9303142L SE 9303142 A SE9303142 A SE 9303142A SE 9303142 A SE9303142 A SE 9303142A SE 9303142 L SE9303142 L SE 9303142L
- Authority
- SE
- Sweden
- Prior art keywords
- interface
- impedance
- microwave circuit
- interface means
- matching
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguides (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a microwave circuit comprising a two-sided substrate (1) with microwave components, a ground plane (5) and at least one interface means impedance-matched for external connection of the microwave circuit. The interface means has an external-connection point (6). The impedance matching of the interface means comprises a matching pattern (11) arranged on one side of the substrate (1) and connected to a ground plane (5) arranged on the opposite side. The matching pattern provides a circuit with excellent matching, thus giving low power losses at significantly higher frequencies than the prior art.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9303142A SE500982C2 (en) | 1993-09-27 | 1993-09-27 | Microwave circuit with impedance interface interface |
PCT/SE1994/000888 WO1995009452A1 (en) | 1993-09-27 | 1994-09-26 | Microwave circuit |
EP94928544A EP0721676A1 (en) | 1993-09-27 | 1994-09-26 | Microwave circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9303142A SE500982C2 (en) | 1993-09-27 | 1993-09-27 | Microwave circuit with impedance interface interface |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9303142D0 SE9303142D0 (en) | 1993-09-27 |
SE9303142L true SE9303142L (en) | 1994-10-10 |
SE500982C2 SE500982C2 (en) | 1994-10-10 |
Family
ID=20391225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9303142A SE500982C2 (en) | 1993-09-27 | 1993-09-27 | Microwave circuit with impedance interface interface |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0721676A1 (en) |
SE (1) | SE500982C2 (en) |
WO (1) | WO1995009452A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE9502326D0 (en) * | 1995-06-27 | 1995-06-27 | Sivers Ima Ab | Microwave circuit, such circuit of nested embodiment, and use of the microwave circuit in a circuit arrangement |
US7956623B2 (en) | 2007-02-16 | 2011-06-07 | Countlab, Inc | Container filling machine |
US20130042943A1 (en) | 2011-08-18 | 2013-02-21 | Countlab, Inc. | Container filling machine |
JP2022141037A (en) * | 2021-03-15 | 2022-09-29 | 住友電気工業株式会社 | Printed board and printed board assembly |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4626805A (en) * | 1985-04-26 | 1986-12-02 | Tektronix, Inc. | Surface mountable microwave IC package |
US5057798A (en) * | 1990-06-22 | 1991-10-15 | Hughes Aircraft Company | Space-saving two-sided microwave circuitry for hybrid circuits |
US5097233A (en) * | 1990-12-20 | 1992-03-17 | Hughes Aircraft Company | Coplanar 3dB quadrature coupler |
-
1993
- 1993-09-27 SE SE9303142A patent/SE500982C2/en not_active IP Right Cessation
-
1994
- 1994-09-26 EP EP94928544A patent/EP0721676A1/en not_active Withdrawn
- 1994-09-26 WO PCT/SE1994/000888 patent/WO1995009452A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
SE9303142D0 (en) | 1993-09-27 |
WO1995009452A1 (en) | 1995-04-06 |
EP0721676A1 (en) | 1996-07-17 |
SE500982C2 (en) | 1994-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |