SE9203531L - With cooler integrated substrate for power electronics elements - Google Patents
With cooler integrated substrate for power electronics elementsInfo
- Publication number
- SE9203531L SE9203531L SE9203531A SE9203531A SE9203531L SE 9203531 L SE9203531 L SE 9203531L SE 9203531 A SE9203531 A SE 9203531A SE 9203531 A SE9203531 A SE 9203531A SE 9203531 L SE9203531 L SE 9203531L
- Authority
- SE
- Sweden
- Prior art keywords
- power electronics
- layer
- conducting
- integrated substrate
- electronics elements
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a substrate (10) integrated with a cooler, for power electronics elements. The substrate comprises an electrically insulating, heat conducting plate (12), each side of which is joined to a layer (14, 16) of electrically conducting and heat conducting material. One conducting layer (14) has a circuit pattern and acts as the support for at least one power electronics element, such as a power semiconductor. According to the invention the other conducting layer (16) is made with a many times greater area than the electrically insulating plate (12), and the portion (18-32) of said other layer (16) extending outside the plate is folded into a heat sink.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9203531A SE9203531L (en) | 1992-11-24 | 1992-11-24 | With cooler integrated substrate for power electronics elements |
PCT/SE1993/000825 WO1994013013A1 (en) | 1992-11-24 | 1993-10-11 | Cooler integrated substrate for power electronics elements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9203531A SE9203531L (en) | 1992-11-24 | 1992-11-24 | With cooler integrated substrate for power electronics elements |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9203531D0 SE9203531D0 (en) | 1992-11-24 |
SE470369B SE470369B (en) | 1994-01-31 |
SE9203531L true SE9203531L (en) | 1994-01-31 |
Family
ID=20387919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9203531A SE9203531L (en) | 1992-11-24 | 1992-11-24 | With cooler integrated substrate for power electronics elements |
Country Status (2)
Country | Link |
---|---|
SE (1) | SE9203531L (en) |
WO (1) | WO1994013013A1 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2113470A (en) * | 1982-01-14 | 1983-08-03 | Redpoint Limited | Heat sink |
US4970579A (en) * | 1988-09-21 | 1990-11-13 | International Business Machines Corp. | Integrated circuit package with improved cooling means |
US5117282A (en) * | 1990-10-29 | 1992-05-26 | Harris Corporation | Stacked configuration for integrated circuit devices |
-
1992
- 1992-11-24 SE SE9203531A patent/SE9203531L/en not_active IP Right Cessation
-
1993
- 1993-10-11 WO PCT/SE1993/000825 patent/WO1994013013A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
SE470369B (en) | 1994-01-31 |
SE9203531D0 (en) | 1992-11-24 |
WO1994013013A1 (en) | 1994-06-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR960011645B1 (en) | Semiconductor device | |
ATE34249T1 (en) | POWER SEMICONDUCTOR MODULE. | |
EP0337686A3 (en) | Semiconductor chip module | |
EP0996154A4 (en) | Semiconductor device and method for manufacturing the same, circuit substrate, and electronic device | |
DE69132880D1 (en) | SEMICONDUCTOR CHIP ARRANGEMENTS, MANUFACTURING METHODS AND COMPONENTS FOR THE SAME | |
SE9802453D0 (en) | Capsule for semiconductor component | |
KR960035995A (en) | Package for semiconductor | |
EP0368743A3 (en) | High performance integrated circuit chip package and method of making same | |
ATE126396T1 (en) | ELECTRONIC DEVICE WITH HEAT DISTRIBUTION BODY. | |
EP0350588A3 (en) | Electronic package with improved heat sink | |
ES2125649T3 (en) | SUPPORT ELEMENT FOR INTEGRATED CIRCUIT. | |
KR910008854A (en) | Ceramic substrates used for forming electrical or electronic circuits | |
DE69937781D1 (en) | Power semiconductor | |
SE8504431D0 (en) | INTEGRATED CIRCUIT WITH DISLOCATION-FREE SUBSTRATE | |
KR0178564B1 (en) | Semiconductor device having temperature regulation means for med in circuit board | |
GB2137807B (en) | A semiconductor component and method of manufacture | |
RU2138098C1 (en) | High-power hybrid microwave integrated circuit | |
ATE34881T1 (en) | INSTALLATION OF SEMICONDUCTOR CHIPS. | |
SE9203531L (en) | With cooler integrated substrate for power electronics elements | |
US4536825A (en) | Leadframe having severable fingers for aligning one or more electronic circuit device components | |
TW366547B (en) | Semiconductor device, its manufacturing method and method of mounting, circuit substrate having the semiconductor device, flexible substrate and the manufacturing method | |
GB2202994B (en) | Circuit assembly, e.g. for an electronic timepiece | |
KR100861863B1 (en) | Semiconductor module having multiple semiconductor chips | |
FR2571921B1 (en) | HEAT DISSIPATOR FOR ELECTRONIC COMPONENTS WITH CERAMIC SUBSTRATE | |
JPS62134956A (en) | Power hybrid integrated circuit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAL | Patent in force |
Ref document number: 9203531-0 Format of ref document f/p: F |
|
NUG | Patent has lapsed |
Ref document number: 9203531-0 Format of ref document f/p: F |