SE8701579L - - Google Patents
Info
- Publication number
- SE8701579L SE8701579L SE8701579A SE8701579A SE8701579L SE 8701579 L SE8701579 L SE 8701579L SE 8701579 A SE8701579 A SE 8701579A SE 8701579 A SE8701579 A SE 8701579A SE 8701579 L SE8701579 L SE 8701579L
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/06—Wiring by machine
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE8701579A SE8701579D0 (sv) | 1987-04-15 | 1987-04-15 | Anordning for att lasa elektronikkomponenter pa en panel genom att bocka komponenternas ben |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE8701579A SE8701579D0 (sv) | 1987-04-15 | 1987-04-15 | Anordning for att lasa elektronikkomponenter pa en panel genom att bocka komponenternas ben |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE8701579D0 SE8701579D0 (sv) | 1987-04-15 |
| SE8701579L true SE8701579L (en:Method) | 1988-02-19 |
Family
ID=20368214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE8701579A SE8701579D0 (sv) | 1987-04-15 | 1987-04-15 | Anordning for att lasa elektronikkomponenter pa en panel genom att bocka komponenternas ben |
Country Status (1)
| Country | Link |
|---|---|
| SE (1) | SE8701579D0 (en:Method) |
-
1987
- 1987-04-15 SE SE8701579A patent/SE8701579D0/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| SE8701579D0 (sv) | 1987-04-15 |