SE7412350L - - Google Patents

Info

Publication number
SE7412350L
SE7412350L SE7412350A SE7412350A SE7412350L SE 7412350 L SE7412350 L SE 7412350L SE 7412350 A SE7412350 A SE 7412350A SE 7412350 A SE7412350 A SE 7412350A SE 7412350 L SE7412350 L SE 7412350L
Authority
SE
Sweden
Application number
SE7412350A
Inventor
Jr J J Doherty
Original Assignee
Ife Devision Of Plastic Mold &
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ife Devision Of Plastic Mold & filed Critical Ife Devision Of Plastic Mold &
Publication of SE7412350L publication Critical patent/SE7412350L/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1038—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers with spring contact pieces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
SE7412350A 1973-11-16 1974-10-01 SE7412350L (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US416420A US3866999A (en) 1973-11-16 1973-11-16 Electronic microelement assembly

Publications (1)

Publication Number Publication Date
SE7412350L true SE7412350L (xx) 1975-05-20

Family

ID=23649907

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7412350A SE7412350L (xx) 1973-11-16 1974-10-01

Country Status (4)

Country Link
US (1) US3866999A (xx)
JP (1) JPS5083756A (xx)
DE (1) DE2453419A1 (xx)
SE (1) SE7412350L (xx)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3932012A (en) * 1974-09-27 1976-01-13 Gte Automatic Electric Laboratories Incorporated Component terminal system
DE3148018C1 (de) * 1981-12-04 1983-07-21 Standard Elektrik Lorenz Ag, 7000 Stuttgart Verbindungselement fuer Chiptraeger
US5041023A (en) * 1988-01-22 1991-08-20 Burndy Corporation Card edge connector
DE3802320C1 (xx) * 1988-01-27 1988-12-15 System Kontakt Gesellschaft Fuer Elektronische Bauelemente Mbh, 7107 Bad Friedrichshall, De
US4934961A (en) * 1988-12-21 1990-06-19 Burndy Corporation Bi-level card edge connector and method of making the same
EP0379176B1 (en) * 1989-01-19 1995-03-15 Burndy Corporation Card edge connector
DE9407499U1 (de) * 1994-05-05 1995-09-07 Itt Composants Instr Elektrisches Kontaktelement
SG71046A1 (en) * 1996-10-10 2000-03-21 Connector Systems Tech Nv High density connector and method of manufacture
JPH11142433A (ja) * 1997-11-10 1999-05-28 Mitsubishi Electric Corp 垂直針型プローブカード用のプローブ針とその製造方法
CN103001085B (zh) * 2011-09-16 2016-01-27 赛恩倍吉科技顾问（深圳）有限公司 连接器组件
DE102015102866B4 (de) * 2015-02-27 2023-02-02 Tdk Electronics Ag Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE327749B (xx) * 1969-09-25 1970-08-31 Saab Ab
US3701077A (en) * 1969-12-29 1972-10-24 Tech Inc K Electronic components
US3649950A (en) * 1970-01-27 1972-03-14 Amp Inc Post connector and assembly
US3636497A (en) * 1970-02-06 1972-01-18 Amp Inc Electrical connector and assembly
US3624586A (en) * 1970-02-09 1971-11-30 Ammon & Champion Co Inc Integrated circuit connector system
US3681743A (en) * 1970-07-08 1972-08-01 Amp Inc Electrical circuits and method of fabrication

Also Published As

Publication number Publication date
JPS5083756A (xx) 1975-07-07
DE2453419A1 (de) 1975-05-28
US3866999A (en) 1975-02-18

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