SE7110129L - - Google Patents
Info
- Publication number
- SE7110129L SE7110129L SE7110129A SE7110129A SE7110129L SE 7110129 L SE7110129 L SE 7110129L SE 7110129 A SE7110129 A SE 7110129A SE 7110129 A SE7110129 A SE 7110129A SE 7110129 L SE7110129 L SE 7110129L
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE7110129T |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE7110129L true SE7110129L (en:Method) | 1972-06-05 |
Family
ID=43979099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE7110129A SE7110129L (en:Method) |
Country Status (1)
| Country | Link |
|---|---|
| SE (1) | SE7110129L (en:Method) |
-
0
- SE SE7110129A patent/SE7110129L/xx unknown