SE443696B - PROCEDURE FOR MANUFACTURING MATERIALS FOR PRINTED WIRING - Google Patents

PROCEDURE FOR MANUFACTURING MATERIALS FOR PRINTED WIRING

Info

Publication number
SE443696B
SE443696B SE7302830A SE7302830A SE443696B SE 443696 B SE443696 B SE 443696B SE 7302830 A SE7302830 A SE 7302830A SE 7302830 A SE7302830 A SE 7302830A SE 443696 B SE443696 B SE 443696B
Authority
SE
Sweden
Prior art keywords
procedure
printed wiring
manufacturing materials
manufacturing
materials
Prior art date
Application number
SE7302830A
Other languages
Swedish (sv)
Inventor
J K Konicek
Original Assignee
Perstorp Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perstorp Ab filed Critical Perstorp Ab
Priority to SE7302830A priority Critical patent/SE443696B/en
Priority to LU69493A priority patent/LU69493A1/xx
Priority to GB900574A priority patent/GB1460602A/en
Priority to US05/446,334 priority patent/US3936548A/en
Priority to NL7402670A priority patent/NL7402670A/xx
Priority to JP49023725A priority patent/JPS501042A/ja
Priority to DE19742409353 priority patent/DE2409353A1/en
Priority to FR7406777A priority patent/FR2219608A2/fr
Priority to BE141488A priority patent/BE811692R/en
Priority to BR1421/74A priority patent/BR7401421D0/en
Priority to IT4880274A priority patent/IT1048268B/en
Publication of SE443696B publication Critical patent/SE443696B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
SE7302830A 1971-08-30 1973-02-28 PROCEDURE FOR MANUFACTURING MATERIALS FOR PRINTED WIRING SE443696B (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SE7302830A SE443696B (en) 1973-02-28 1973-02-28 PROCEDURE FOR MANUFACTURING MATERIALS FOR PRINTED WIRING
LU69493A LU69493A1 (en) 1971-08-30 1974-02-27
GB900574A GB1460602A (en) 1971-08-30 1974-02-27 Method of electroplating a metallic foil
US05/446,334 US3936548A (en) 1973-02-28 1974-02-27 Method for the production of material for printed circuits and material for printed circuits
NL7402670A NL7402670A (en) 1971-08-30 1974-02-27
JP49023725A JPS501042A (en) 1973-02-28 1974-02-27
DE19742409353 DE2409353A1 (en) 1971-08-30 1974-02-27 PROCESS FOR COPPER PLATING OF METAL FOILS
FR7406777A FR2219608A2 (en) 1971-08-30 1974-02-28
BE141488A BE811692R (en) 1971-08-30 1974-02-28 PROCESS FOR THE PRODUCTION OF ELEMENTS FOR PRINTED CIRCUITS
BR1421/74A BR7401421D0 (en) 1973-02-28 1974-02-28 PROCESS FOR FINISHING AN ALUMINUM SHEET
IT4880274A IT1048268B (en) 1973-02-28 1974-03-01 Printed circuit board prodn. - controlling copper adhesion to temporary support for bonding to insulating board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7302830A SE443696B (en) 1973-02-28 1973-02-28 PROCEDURE FOR MANUFACTURING MATERIALS FOR PRINTED WIRING

Publications (1)

Publication Number Publication Date
SE443696B true SE443696B (en) 1986-03-03

Family

ID=20316764

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7302830A SE443696B (en) 1971-08-30 1973-02-28 PROCEDURE FOR MANUFACTURING MATERIALS FOR PRINTED WIRING

Country Status (4)

Country Link
JP (1) JPS501042A (en)
BR (1) BR7401421D0 (en)
IT (1) IT1048268B (en)
SE (1) SE443696B (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2871171A (en) * 1956-05-10 1959-01-27 Atkinson James Thomas Nesbitt Method of electroplating copper on aluminum

Also Published As

Publication number Publication date
IT1048268B (en) 1980-11-20
JPS501042A (en) 1975-01-08
BR7401421D0 (en) 1974-10-29

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