SE411717B - DEVICE FOR CONTROL OF A PROCESSOR COMPUTER CONTROLLED LASER Beam - Google Patents

DEVICE FOR CONTROL OF A PROCESSOR COMPUTER CONTROLLED LASER Beam

Info

Publication number
SE411717B
SE411717B SE7706257A SE7706257A SE411717B SE 411717 B SE411717 B SE 411717B SE 7706257 A SE7706257 A SE 7706257A SE 7706257 A SE7706257 A SE 7706257A SE 411717 B SE411717 B SE 411717B
Authority
SE
Sweden
Prior art keywords
control
laser beam
computer controlled
processor computer
controlled laser
Prior art date
Application number
SE7706257A
Other languages
Swedish (sv)
Other versions
SE7706257L (en
Inventor
A Mattelin
M Heermann
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE7706257L publication Critical patent/SE7706257L/en
Publication of SE411717B publication Critical patent/SE411717B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SE7706257A 1976-05-28 1977-05-27 DEVICE FOR CONTROL OF A PROCESSOR COMPUTER CONTROLLED LASER Beam SE411717B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762624121 DE2624121A1 (en) 1976-05-28 1976-05-28 METHOD FOR EXACTLY PROCESSING A WORKPIECE ARRANGED IN THE WORKING FIELD OF A PROCESSING LASER AND DEVICE FOR EXECUTING THE PROCESS

Publications (2)

Publication Number Publication Date
SE7706257L SE7706257L (en) 1977-11-29
SE411717B true SE411717B (en) 1980-02-04

Family

ID=5979298

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7706257A SE411717B (en) 1976-05-28 1977-05-27 DEVICE FOR CONTROL OF A PROCESSOR COMPUTER CONTROLLED LASER Beam

Country Status (10)

Country Link
JP (1) JPS52145898A (en)
AT (1) AT355140B (en)
BE (1) BE855155A (en)
CH (1) CH616357A5 (en)
DE (1) DE2624121A1 (en)
FR (1) FR2352624A1 (en)
GB (1) GB1575054A (en)
IT (1) IT1079230B (en)
NL (1) NL7705878A (en)
SE (1) SE411717B (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5566825A (en) * 1978-11-14 1980-05-20 Toshiba Corp Assembling method of electron gun
JPS6121192Y2 (en) * 1980-09-02 1986-06-25
AU564020B2 (en) * 1981-09-24 1987-07-30 Morris, J.R. Microsurgical laser
DE3147355C2 (en) * 1981-11-30 1986-05-07 Siemens AG, 1000 Berlin und 8000 München Method for adjusting the reference system of a pre-programmable beam deflection system of a laser device operating in giant pulse mode
DE3235714A1 (en) * 1982-09-27 1984-03-29 Siemens AG, 1000 Berlin und 8000 München METHOD AND DEVICE FOR ADJUSTING CONTACT SPRINGS IN A RELAY
DE3411140A1 (en) * 1984-03-26 1985-09-26 BIAS Forschungs- und Entwicklungs-Labor für angewandte Strahltechnik GmbH, 2820 Bremen Process for aligning a working head for a focused high-output energy source, and a working head, in particular for executing the process
JPS61103695A (en) * 1984-10-29 1986-05-22 Mitsubishi Electric Corp Three-dimensional laser beam machine
DE3542328A1 (en) * 1985-01-16 1986-07-17 Wild Heerbrugg AG, Heerbrugg Method and device for automatically aligning a measuring instrument with a target point
WO1986004847A1 (en) * 1985-02-23 1986-08-28 N.I.S. Engineering Limited Laser apparatus
DE3528047A1 (en) * 1985-08-05 1987-02-05 Bbc Brown Boveri & Cie Method for locating unknown objects
DE3539933A1 (en) * 1985-11-11 1987-05-14 Nixdorf Computer Ag DEVICE FOR SOLELING ELECTRONIC COMPONENTS ON A CIRCUIT BOARD
DE3829350A1 (en) * 1988-08-30 1990-03-01 Messerschmitt Boelkow Blohm METHOD AND DEVICE FOR POSITIONING LOETLASERS
DE4430220C2 (en) * 1994-08-25 1998-01-22 Fraunhofer Ges Forschung Method for controlling the laser beam intensity distribution on the surface of components to be processed
DE29505985U1 (en) * 1995-04-06 1995-07-20 Bestenlehrer, Alexander, 91074 Herzogenaurach Device for processing, in particular for polishing and structuring any 3D shape surfaces by means of a laser beam
DE19722415A1 (en) * 1997-05-28 1998-12-03 Fraunhofer Ges Forschung Position and shape correction of the geometry of laser operations on workpieces
DE19963010B4 (en) * 1999-12-22 2005-02-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for laser processing of workpieces
EP1875469B1 (en) 2005-04-19 2008-12-17 Koninklijke Philips Electronics N.V. Device for directing radiation to a layer, apparatus with such device and method using such apparatus
PL1800813T3 (en) 2005-11-23 2012-05-31 Homag Holzbearbeitungssysteme Ag method and device for coating components
JP6003934B2 (en) * 2014-03-20 2016-10-05 トヨタ自動車株式会社 Laser welding inspection apparatus and laser welding inspection method
PL3124163T3 (en) * 2015-07-29 2020-10-19 Yaskawa Slovenija D.O.O System and method for laser processing

Also Published As

Publication number Publication date
NL7705878A (en) 1977-11-30
GB1575054A (en) 1980-09-17
AT355140B (en) 1980-02-11
DE2624121A1 (en) 1977-12-15
SE7706257L (en) 1977-11-29
BE855155A (en) 1977-09-16
IT1079230B (en) 1985-05-08
JPS5653470B2 (en) 1981-12-18
FR2352624B1 (en) 1981-07-17
JPS52145898A (en) 1977-12-05
FR2352624A1 (en) 1977-12-23
CH616357A5 (en) 1980-03-31

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