SE350149B - - Google Patents

Info

Publication number
SE350149B
SE350149B SE04080/66A SE408066A SE350149B SE 350149 B SE350149 B SE 350149B SE 04080/66 A SE04080/66 A SE 04080/66A SE 408066 A SE408066 A SE 408066A SE 350149 B SE350149 B SE 350149B
Authority
SE
Sweden
Application number
SE04080/66A
Inventor
M Hoffmann
P Fries
R Wendelin
E Kaetscher
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE1965S0096711 external-priority patent/DE1514450B2/de
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE350149B publication Critical patent/SE350149B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
SE04080/66A 1965-04-23 1966-03-28 SE350149B (xx)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1965S0096711 DE1514450B2 (de) 1965-04-23 1965-04-23 Gleichrichteranordnung mit einer scheibenfoermigen halbleiter-gleichrichterzelle
DES0097379 1965-05-31

Publications (1)

Publication Number Publication Date
SE350149B true SE350149B (xx) 1972-10-16

Family

ID=25998059

Family Applications (1)

Application Number Title Priority Date Filing Date
SE04080/66A SE350149B (xx) 1965-04-23 1966-03-28

Country Status (5)

Country Link
US (1) US3467897A (xx)
CH (1) CH442502A (xx)
DE (1) DE1514468A1 (xx)
GB (1) GB1076237A (xx)
SE (1) SE350149B (xx)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2053419A6 (xx) * 1969-07-04 1971-04-16 Ferraz & Cie Lucien
SE340321B (xx) * 1970-03-23 1971-11-15 Asea Ab
US3715632A (en) * 1971-01-08 1973-02-06 Gen Electric Liquid cooled semiconductor device clamping assembly
US3718841A (en) * 1971-07-09 1973-02-27 Gen Electric Modular rectifier holding assembly with heat sink supporting circuit protecting means
DE2160001C2 (de) * 1971-12-03 1974-01-10 Siemens Ag, 1000 Berlin U. 8000 Muenchen Halbleiteranordnung, insbesondere Thyristorbaugruppe
US3808471A (en) * 1972-10-26 1974-04-30 Borg Warner Expandible pressure mounted semiconductor assembly
CH592961A5 (xx) * 1975-09-23 1977-11-15 Bbc Brown Boveri & Cie
CS180334B1 (en) * 1975-11-28 1977-12-30 Jiri Kovar Power semiconducting disc elements suppressing and jigging equipment
DE3137408A1 (de) * 1981-09-19 1983-04-07 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau Leistungshalbleiterbauelement fuer siedekuehlung oder fluessigkeitskuehlung
DE3740233A1 (de) * 1987-11-27 1989-06-08 Asea Brown Boveri Kuehldose zum abfuehren der verlustwaerme von halbleitern
DE4322932A1 (de) * 1993-07-09 1995-01-19 Abb Patent Gmbh Flüssigkeitskühlkörper mit Isolierscheiben, elektrischen Anschlußblechen und einem Isolationsring

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1071233B (xx) * 1959-12-17
DE1042762B (de) * 1955-02-26 1958-11-06 Siemens Ag Flaechengleichrichter bzw. -transistor, welcher mit mindestens einer seiner Elektroden flaechenhaft mit einem die Verlustwaerme abfuehrenden Koerper in Kontakt steht
BE628175A (xx) * 1961-08-04 1900-01-01
US3206646A (en) * 1959-08-17 1965-09-14 Westinghouse Electric Corp Means for housing circuit arrangements
US3179814A (en) * 1962-06-29 1965-04-20 Bendix Corp Electrical subassembly
FR1381184A (fr) * 1963-02-06 1964-12-04 Westinghouse Brake & Signal Dispositif à conductibilité asymétrique
US3289068A (en) * 1963-05-02 1966-11-29 Ite Circuit Breaker Ltd Bus arrangement for semiconductor rectifiers
NL302170A (xx) * 1963-06-15
US3371227A (en) * 1963-10-18 1968-02-27 Gen Electric Transistor-s.c.r. circuitry providing a thyratron equivalent
US3293508A (en) * 1964-04-21 1966-12-20 Int Rectifier Corp Compression connected semiconductor device
US3340413A (en) * 1964-11-04 1967-09-05 Gen Motors Corp Traction motor power supply unit

Also Published As

Publication number Publication date
DE1514468A1 (de) 1969-05-22
US3467897A (en) 1969-09-16
CH442502A (de) 1967-08-31
GB1076237A (en) 1967-07-19

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