SE348598BSE01736/70ASE173670ASE348598BSE 348598 BSE348598 BSE 348598BSE 01736/70 ASE01736/70 ASE 01736/70ASE 173670 ASE173670 ASE 173670ASE 348598 BSE348598 BSE 348598B
Authority
SE
Sweden
Application number
SE01736/70A
Inventor
Waard P De
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL6902447Aexternal-prioritypatent/NL6902447A/xx
Application filed by Philips NvfiledCriticalPhilips Nv
Publication of SE348598BpublicationCriticalpatent/SE348598B/xx
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
H01L2224/161—Disposition
H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation