SE348233B - - Google Patents
Info
- Publication number
- SE348233B SE348233B SE03878/69A SE387869A SE348233B SE 348233 B SE348233 B SE 348233B SE 03878/69 A SE03878/69 A SE 03878/69A SE 387869 A SE387869 A SE 387869A SE 348233 B SE348233 B SE 348233B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02019—Chemical etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/906—Cleaning of wafer as interim step
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB03619/68A GB1206371A (en) | 1968-03-21 | 1968-03-21 | The etching of silicon semiconductor wafers and semiconductor devices incorporating such wafers |
Publications (1)
Publication Number | Publication Date |
---|---|
SE348233B true SE348233B (de) | 1972-08-28 |
Family
ID=10026340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE03878/69A SE348233B (de) | 1968-03-21 | 1969-03-20 |
Country Status (3)
Country | Link |
---|---|
US (1) | US3607477A (de) |
GB (1) | GB1206371A (de) |
SE (1) | SE348233B (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3767483A (en) * | 1970-05-11 | 1973-10-23 | Hitachi Ltd | Method of making semiconductor devices |
US3998653A (en) * | 1976-03-09 | 1976-12-21 | General Electric Company | Method for cleaning semiconductor devices |
US4964919A (en) * | 1988-12-27 | 1990-10-23 | Nalco Chemical Company | Cleaning of silicon wafers with an aqueous solution of KOH and a nitrogen-containing compound |
DE19525521B4 (de) * | 1994-07-15 | 2007-04-26 | Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont | Verfahren zum Reinigen von Substraten |
JP3620683B2 (ja) * | 1996-12-27 | 2005-02-16 | 信越半導体株式会社 | 半導体ウエーハの製造方法 |
DE10051052C2 (de) * | 2000-10-14 | 2003-06-05 | Bosch Gmbh Robert | Lösung und Verfahren zum Ätzen von Metalloberflächen sowie deren Verwendung |
DE102007058829A1 (de) * | 2007-12-06 | 2009-06-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Textur- und Reinigungsmedium zur Oberflächenbehandlung von Wafern und dessen Verwendung |
CN103924305B (zh) * | 2013-01-14 | 2017-12-05 | 东莞东阳光科研发有限公司 | 一种准单晶硅片绒面的制备方法 |
-
1968
- 1968-03-21 GB GB03619/68A patent/GB1206371A/en not_active Expired
-
1969
- 1969-03-17 US US807959A patent/US3607477A/en not_active Expired - Lifetime
- 1969-03-20 SE SE03878/69A patent/SE348233B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
US3607477A (en) | 1971-09-21 |
DE1913616A1 (de) | 1969-10-23 |
GB1206371A (en) | 1970-09-23 |
DE1913616B2 (de) | 1977-07-14 |