SE339268B - - Google Patents

Info

Publication number
SE339268B
SE339268B SE06223/67A SE622367A SE339268B SE 339268 B SE339268 B SE 339268B SE 06223/67 A SE06223/67 A SE 06223/67A SE 622367 A SE622367 A SE 622367A SE 339268 B SE339268 B SE 339268B
Authority
SE
Sweden
Application number
SE06223/67A
Inventor
S Arita
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Publication of SE339268B publication Critical patent/SE339268B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
SE06223/67A 1966-05-09 1967-05-02 SE339268B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2952966 1966-05-09

Publications (1)

Publication Number Publication Date
SE339268B true SE339268B (de) 1971-10-04

Family

ID=12278617

Family Applications (1)

Application Number Title Priority Date Filing Date
SE06223/67A SE339268B (de) 1966-05-09 1967-05-02

Country Status (6)

Country Link
BE (1) BE698145A (de)
CH (1) CH472784A (de)
DE (1) DE1614156B2 (de)
GB (1) GB1172280A (de)
NL (1) NL143370B (de)
SE (1) SE339268B (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3629669A (en) * 1968-11-25 1971-12-21 Gen Motors Corp Passivated wire-bonded semiconductor device

Also Published As

Publication number Publication date
NL6706403A (de) 1967-11-10
GB1172280A (en) 1969-11-26
BE698145A (de) 1967-10-16
DE1614156B2 (de) 1973-11-08
NL143370B (nl) 1974-09-16
DE1614156A1 (de) 1972-03-23
CH472784A (de) 1969-05-15

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