SE327466BSE06298/68ASE629868ASE327466BSE 327466 BSE327466 BSE 327466BSE 06298/68 ASE06298/68 ASE 06298/68ASE 629868 ASE629868 ASE 629868ASE 327466 BSE327466 BSE 327466B
Authority
SE
Sweden
Application number
SE06298/68A
Inventor
Iersel A Van
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL6706641Aexternal-prioritypatent/NL6706641A/xx
Application filed by Philips NvfiledCriticalPhilips Nv
Publication of SE327466BpublicationCriticalpatent/SE327466B/xx
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
H—ELECTRICITY
H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00