SE324840B - - Google Patents

Info

Publication number
SE324840B
SE324840B SE7844/64A SE784464A SE324840B SE 324840 B SE324840 B SE 324840B SE 7844/64 A SE7844/64 A SE 7844/64A SE 784464 A SE784464 A SE 784464A SE 324840 B SE324840 B SE 324840B
Authority
SE
Sweden
Application number
SE7844/64A
Inventor
E Cave
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US291338A external-priority patent/US3300832A/en
Application filed by Rca Corp filed Critical Rca Corp
Publication of SE324840B publication Critical patent/SE324840B/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01Manufacture or treatment
    • H10W10/011Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/014Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01Manufacture or treatment
    • H10W10/021Manufacture or treatment of air gaps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10Isolation regions comprising dielectric materials
    • H10W10/17Isolation regions comprising dielectric materials formed using trench refilling with dielectric materials, e.g. shallow trench isolations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/20Air gaps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/085Isolated-integrated
SE7844/64A 1963-06-28 1964-06-26 SE324840B (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US291338A US3300832A (en) 1963-06-28 1963-06-28 Method of making composite insulatorsemiconductor wafer
US571276A US3370204A (en) 1963-06-28 1966-08-09 Composite insulator-semiconductor wafer

Publications (1)

Publication Number Publication Date
SE324840B true SE324840B (https=) 1970-06-15

Family

ID=26966711

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7844/64A SE324840B (https=) 1963-06-28 1964-06-26

Country Status (6)

Country Link
US (1) US3370204A (https=)
CA (1) CA947881A (https=)
DE (1) DE1238517B (https=)
GB (1) GB1058296A (https=)
NL (1) NL143367B (https=)
SE (1) SE324840B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3489952A (en) * 1967-05-15 1970-01-13 Singer Co Encapsulated microelectronic devices
US3521128A (en) * 1967-08-02 1970-07-21 Rca Corp Microminiature electrical component having integral indexing means
US3753056A (en) * 1971-03-22 1973-08-14 Texas Instruments Inc Microwave semiconductor device
US4095330A (en) * 1976-08-30 1978-06-20 Raytheon Company Composite semiconductor integrated circuit and method of manufacture
EP0011418A1 (en) * 1978-11-20 1980-05-28 THE GENERAL ELECTRIC COMPANY, p.l.c. Manufacture of electroluminescent display devices
US4335501A (en) * 1979-10-31 1982-06-22 The General Electric Company Limited Manufacture of monolithic LED arrays for electroluminescent display devices
GB2138205B (en) * 1983-04-13 1986-11-05 Philips Electronic Associated Methods of manufacturing a microwave circuit
KR100380701B1 (ko) * 1994-07-26 2003-07-22 코닌클리케 필립스 일렉트로닉스 엔.브이. 표면장착용반도체장치제조방법및표면장착용반도체장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT225236B (de) * 1959-05-06 1963-01-10 Texas Instruments Inc Verfahren zur Herstellung von abgeschlossenen Schaltungseinheiten sehr geringer Abmessungen
NL250171A (https=) * 1959-06-23
US3173101A (en) * 1961-02-15 1965-03-09 Westinghouse Electric Corp Monolithic two stage unipolar-bipolar semiconductor amplifier device
US3235428A (en) * 1963-04-10 1966-02-15 Bell Telephone Labor Inc Method of making integrated semiconductor devices

Also Published As

Publication number Publication date
GB1058296A (en) 1967-02-08
NL143367B (nl) 1974-09-16
DE1238517B (de) 1967-04-13
CA947881A (en) 1974-05-21
NL6407299A (https=) 1964-12-29
US3370204A (en) 1968-02-20

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