SE319825B - - Google Patents

Info

Publication number
SE319825B
SE319825B SE518/68A SE51868A SE319825B SE 319825 B SE319825 B SE 319825B SE 518/68 A SE518/68 A SE 518/68A SE 51868 A SE51868 A SE 51868A SE 319825 B SE319825 B SE 319825B
Authority
SE
Sweden
Application number
SE518/68A
Inventor
G Elmore
Z Cacka
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of SE319825B publication Critical patent/SE319825B/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SE518/68A 1967-01-16 1968-01-16 SE319825B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60935067A 1967-01-16 1967-01-16

Publications (1)

Publication Number Publication Date
SE319825B true SE319825B (de) 1970-01-26

Family

ID=24440421

Family Applications (1)

Application Number Title Priority Date Filing Date
SE518/68A SE319825B (de) 1967-01-16 1968-01-16

Country Status (8)

Country Link
US (1) US3518130A (de)
CH (1) CH462909A (de)
DE (1) DE1640579A1 (de)
ES (1) ES349275A1 (de)
FR (1) FR1549850A (de)
GB (1) GB1207723A (de)
NL (1) NL6717198A (de)
SE (1) SE319825B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3804689A (en) * 1971-12-03 1974-04-16 Ncr Process for removing copper films from substrates
FR2498412A1 (fr) * 1981-01-16 1982-07-23 Delair Michel Procede de fabrication de circuits imprimes base sur le principe du depot du reseau conducteur sur un outillage specifique reutilisable et du transfert de ce depot sur le support isolant
US5609704A (en) 1993-09-21 1997-03-11 Matsushita Electric Industrial Co., Ltd. Method for fabricating an electronic part by intaglio printing
US7510052B2 (en) * 2005-04-04 2009-03-31 Hexcel Corporation Acoustic septum cap honeycomb
CN110654159A (zh) * 2019-08-29 2020-01-07 上海渊泉集币收藏品有限公司 金属凹版画的制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2166366A (en) * 1935-11-30 1939-07-18 Edward O Norris Inc Means and method of producing metallic screens
US2447541A (en) * 1945-01-29 1948-08-24 Sabee Method of making plastic structure
US2997521A (en) * 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly

Also Published As

Publication number Publication date
GB1207723A (en) 1970-10-07
FR1549850A (de) 1968-12-13
ES349275A1 (es) 1969-04-01
US3518130A (en) 1970-06-30
DE1640579A1 (de) 1970-12-17
CH462909A (de) 1968-09-30
NL6717198A (de) 1968-07-17

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