SE313374B - - Google Patents
Info
- Publication number
- SE313374B SE313374B SE2125/64A SE212564A SE313374B SE 313374 B SE313374 B SE 313374B SE 2125/64 A SE2125/64 A SE 2125/64A SE 212564 A SE212564 A SE 212564A SE 313374 B SE313374 B SE 313374B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
- H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL290931 | 1963-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE313374B true SE313374B (index.php) | 1969-08-11 |
Family
ID=19754574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE2125/64A SE313374B (index.php) | 1963-03-29 | 1964-02-21 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3324360A (index.php) |
| AT (1) | AT251038B (index.php) |
| BE (1) | BE643480A (index.php) |
| CH (1) | CH442531A (index.php) |
| DE (1) | DE1489140A1 (index.php) |
| DK (1) | DK112395B (index.php) |
| ES (1) | ES296319A1 (index.php) |
| GB (1) | GB1065531A (index.php) |
| NL (1) | NL290931A (index.php) |
| SE (1) | SE313374B (index.php) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1564648A1 (de) * | 1966-07-06 | 1970-02-12 | Siemens Ag | Mesa-Transistor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL299567A (index.php) * | 1952-06-14 | |||
| US3100927A (en) * | 1957-12-30 | 1963-08-20 | Westinghouse Electric Corp | Semiconductor device |
| US3204321A (en) * | 1962-09-24 | 1965-09-07 | Philco Corp | Method of fabricating passivated mesa transistor without contamination of junctions |
-
0
- NL NL290931D patent/NL290931A/xx unknown
-
1964
- 1964-02-06 BE BE643480A patent/BE643480A/xx unknown
- 1964-02-07 DE DE19641489140 patent/DE1489140A1/de active Pending
- 1964-02-10 AT AT108364A patent/AT251038B/de active
- 1964-02-11 ES ES0296319A patent/ES296319A1/es not_active Expired
- 1964-02-20 US US346167A patent/US3324360A/en not_active Expired - Lifetime
- 1964-02-21 SE SE2125/64A patent/SE313374B/xx unknown
- 1964-02-24 CH CH218464A patent/CH442531A/de unknown
- 1964-02-28 DK DK99764AA patent/DK112395B/da unknown
- 1964-03-29 GB GB7584/64A patent/GB1065531A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| ES296319A1 (es) | 1964-05-01 |
| AT251038B (de) | 1966-12-12 |
| DK112395B (da) | 1968-12-09 |
| CH442531A (de) | 1967-08-31 |
| BE643480A (index.php) | 1964-08-06 |
| US3324360A (en) | 1967-06-06 |
| GB1065531A (en) | 1967-04-19 |
| DE1489140A1 (de) | 1969-04-30 |
| NL290931A (index.php) | 1900-01-01 |