SE306119B - - Google Patents

Info

Publication number
SE306119B
SE306119B SE2383/66A SE238366A SE306119B SE 306119 B SE306119 B SE 306119B SE 2383/66 A SE2383/66 A SE 2383/66A SE 238366 A SE238366 A SE 238366A SE 306119 B SE306119 B SE 306119B
Authority
SE
Sweden
Application number
SE2383/66A
Inventor
P Ullman
O Littrell
Original Assignee
Fairchild Camera Instr Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Camera Instr Co filed Critical Fairchild Camera Instr Co
Publication of SE306119B publication Critical patent/SE306119B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C29/00—Joining metals with the aid of glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Optical Measuring Cells (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Joining Of Glass To Other Materials (AREA)
SE2383/66A 1965-04-06 1966-02-23 SE306119B (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US44594465A 1965-04-06 1965-04-06

Publications (1)

Publication Number Publication Date
SE306119B true SE306119B (ja) 1968-11-18

Family

ID=23770766

Family Applications (1)

Application Number Title Priority Date Filing Date
SE2383/66A SE306119B (ja) 1965-04-06 1966-02-23

Country Status (7)

Country Link
US (1) US3421203A (ja)
BE (1) BE676666A (ja)
DE (1) DE1539959A1 (ja)
ES (1) ES325286A1 (ja)
GB (1) GB1090585A (ja)
NL (1) NL6603209A (ja)
SE (1) SE306119B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1295306A (ja) * 1969-04-23 1972-11-08
US3634690A (en) * 1970-03-23 1972-01-11 Itt Tubular photocell with secondary emission from internal surface
GB1403801A (en) * 1973-01-30 1975-08-28 Standard Telephones Cables Ltd Semiconductor device stud mount
US3946416A (en) * 1973-04-24 1976-03-23 The United States Of America As Represented By The Secretary Of The Army Low impedance diode mounting structure and housing
DE3732075A1 (de) * 1987-09-23 1989-04-06 Siemens Ag Hermetisch dichtes glas-metallgehaeuse fuer halbleiterbauelemente und verfahren zu dessen herstellung
US20050009239A1 (en) * 2003-07-07 2005-01-13 Wolff Larry Lee Optoelectronic packaging with embedded window

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB753136A (en) * 1953-08-28 1956-07-18 Standard Telephones Cables Ltd Improvements in or relating to light cells or rectifiers
US3119052A (en) * 1959-11-24 1964-01-21 Nippon Electric Co Enclosures for semi-conductor electronic elements
US3281606A (en) * 1963-07-26 1966-10-25 Texas Instruments Inc Small light sensor package

Also Published As

Publication number Publication date
US3421203A (en) 1969-01-14
NL6603209A (ja) 1966-10-07
ES325286A1 (es) 1967-02-16
GB1090585A (en) 1967-11-08
BE676666A (ja) 1966-07-18
DE1539959A1 (de) 1969-10-02

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