SE2250240A1 - Sensor - Google Patents

Abstract

OFTHE DISCLOSUREThe present disclosure provides a sensor comprising a connector, a sensor body and a sensing circuit assembly. The sensor body and the connector are fixedly connected and enclose to form an accommodation cavity. The sensing circuit assembly is disposed in the accommodation cavity and configured to generate a sensing signal. The connector comprises a connector body, a supporting plate disposed inside the connector body, and at least one conduction pin fixedly connected to the supporting plate and electrically connected to the sensing circuit assembly. One side surface of the supporting plate is provided with an annular sealing groove surrounding a peripheral of the conduction pin. According to the sensor provided by the present disclosure, the waterproof and sealing performance of the connector is improved while decreasing the glue consumption in packaging, and the manufacturing cost is reduced.

Description

SENSOR TECHNICAL FIELD The present disclosure relates to a sensor.

BACKGROUND Sensors are widely used to measure various environmental physical quantities,such as temperature, humidity, displacement, vibration, acceleration, pressure, andthe like. Although various sensors are of different structures, they essentially includesensing elements, conversion elements and signal conditioning and conversioncircuits. ln order to ensure the normal operation of the signal conditioning andconversion circuit and avoid the impact of external environment, the signalconditioning and conversion circuit is usually placed in a connection base andconnected with a conduction pin on a connector by a conduction sheet on a circuitboard, and then the connector and the connection base are crimped together to forma completely sealed working space of the conversion circuit board. Moreover, it isnecessary to ensure the sealing of the connector provided with the conduction pin,and meet the high protection requirements of lP6K9K, ICE WATER SHOCK andSUBMERSION TEST. ln the prior arts, glue filling is used on a surface of the conduction pin supportingplate of the connector connected with the connection base to accommodate thesignal conditioning and conversion circuit board. ln such glue filling, if less glue isfilled, the sealing will not be tight enough, which will affect the sealing of the workingspace of the conversion circuit board, or if too much glue is filled, on the one hand,the glue consumption will be increased and the manufacturing cost will be increased,and on the other hand, the working space of the conversion circuit board will beoccupied. ln addition, if too much glue is filled, some glue may be stuck on a surfaceof the conduction pin of the connector, resulting in poor conduction between theconnector and the signal conditioning and conversion circuit and affecting signal transmission.

SUMMARY The purpose of the present disclosure is to provide a sensor to solve thetechnical problem of poor waterproof and sealing performance of the connector of thesensor in the prior arts.

To achieve the above purpose, the technical solution adopted by the presentdisclosure is to provide a sensor comprising a connector, a sensor body and asensing circuit assembly, the sensor body and the connector being fixedly connectedand enclosing to form an accommodation cavity, the sensing circuit assembly beingdisposed in the accommodation cavity and configured to generate a sensing signal;the connector comprising a connector body, a supporting plate disposed inside theconnector body, and at least one conduction pin fixedly connected to the supportingplate and electrically connected to the sensing circuit assembly; one side surface ofthe supporting plate being provided with an annular sealing groove surrounding aperipheral of the conduction pin.

Further, the supporting plate is opened with at least one through hole formounting the conduction pin, an outer sidewall of the conduction pin protruding toform a flange, an inner sidewall of the through hole being recessed to form a first yieldgroove corresponding to the flange of the through pin and receiving the flange.

Further, the surface of the supporting plate is recessed to form severalaccommodation grooves with notches being disposed toward the sensing circuitassembly.

Further, the sensing circuit assembly comprises a circuit board and electricalelements connected on the circuit board, at least part of the electrical elementsextending into the accommodation grooves in the surface of the supporting board.

Further, the annular sealing groove is disposed in the surface of the supportingplate facing the sensing circuit assembly.

Further, a sealing member is fixedly disposed in the annular sealing groove anddisposed in contact with the conduction pin.

Further, the sealing member is a sealant which is provided in the annular sealing groove by dropping glue.

Further, the supporting plate comprises a pressure relief portion which comprisesa vent hole penetrating the supporting plate, the supporting plate being opened witha second yield groove surrounding a periphery of the vent hole and communicatingwith the vent hole, the second yield groove being configured for receiving a filter.

Further, the number of the conduction pins is plural, the plurality of conductionpins being arranged at intervals along a circumferential direction of the supportingplate; and the number of the annular sealing grooves is plural, the plurality of annularsealing grooves corresponding to the plurality of conduction pins respectively.

Further, the sensing circuit assembly comprises a circuit board and at least oneconduction sheet electrically connected to the conduction pin.

Further, the sensor body comprises a first annular connecting body, one end ofthe connector body extending circumferentially to form a second annular connectingbody, the second annular connecting body and the first annular connecting bodybeing crimped and enclosing to form the accommodation cavity for receiving thesensing circuit assembly.

Further, a sealing ring is provided between the first annular connecting body andthe second annular connecting body to seal a gap therebetween.

Further, the sensor body comprises a force transmission member and aconnection base comprising a protrusion located at a bottom of the accommodationcavity, an annular mounting groove for crimping the second annular connecting bodybeing formed between the protrusion and the first annular connecting body; theprotrusion being provided with a first yield hole communicating with an interior of theaccommodation cavity and the external environment and configured for receiving partof the force transmission member, one end of the first yield hole is covered with thesensing circuit assembly.

Further, the force transmission member is connected with the connection basein a sealed manner.

Further, the force transmission member comprises a buffer member and an inner pot with a pressure chamber, the inner pot being provided with a force transmission membrane at one end facing toward the sensing circuit assembly and a connectingportion at the other end, the connecting portion being provided with a second yieldhole communicating with the interior of the pressure chamber and the externalenvironment; the connecting portion being fixedly connected with the buffer member.

Further, the force transmission member is provided with a connecting groove forreceiving the buffer member, the connecting portion of the inner pot being located ata bottom of the connecting groove.

Further, the buffer member is provided with a throttling orifice penetrating thebuffer member, the buffer member being recessed on a surface facing the inner potto form a step hole surrounding a periphery of the throttling orifice and communicatingwith the throttling orifice, the pressure chamber being arranged in communicationwith the step hole and the throttling orifice.

Further, the buffer member is connected with the inner pot in a sealed manner.

Further, the force transmission member is a metal member, the connection baseis a metal base, and the force transmission membrane is a metal membrane.

Further, the connector is an integrally formed piece, and the connector is a plasticconnector.

The sensor provided by the present disclosure has the following beneficialeffects: compared with the prior art, in the sensor of the present disclosure, the sensorbody and the connector are fixedly connected and enclose to form an accommodationcavity, the sensing circuit assembly is disposed in the accommodation cavity andconfigured to generate a sensing signal, at least one conduction pin provided on thesupporting plate inside the connector body is electrically connected with the sensingcircuit assembly, and one side surface of the supporting plate is provided with anannular sealing groove surrounding the periphery of the conduction pin, so that whenthe connector is sealed with glue, the glue may be directly injected into the annularsealing groove to seal the gap between the conduction pin and the support plate,thereby sealing the accommodation cavity with less glue consumption. The process is simple and the manufacturing cost is reduced.

BRIEF DESCRIPTION OF THE DRAWINGS ln order to explain the technical scheme in embodiments of the presentdisclosure more clearly, the following will make a brief introduction to theembodiments or the drawings required in the description of the embodiments or theprior arts. lt is obvious that the drawings in the following description are only someembodiments of the present disclosure. For those skilled in the art, other drawingscan be obtained based on these drawings without paying inventive effort.

Figure 1 is a three-dimensional structure schematic diagram of a sensorprovided by an embodiment of the present disclosure; Figure 2 is an exploded structure schematic diagram of the sensor provided byan embodiment of the present disclosure; Figure 3 is a cross-sectional structure diagram of the sensor provided by anembodiment of the present disclosure taken along line A-A in the figure; Figure 4 is a three-dimensional structure schematic diagram of a connector ofthe sensor provided by an embodiment of the present disclosure; Figure 5 is a cross-sectional structure diagram of the connector of the sensorprovided by an embodiment of the present disclosure taken along line B-B in thefigure; Figure 6 is a three-dimensional structure schematic diagram of a sensor bodyof the sensor provided by an embodiment of the present disclosure; and Figure 7 is a cross-sectional structure diagram of the sensor body of the sensorprovided by an embodiment of the present disclosure taken along line C-C in thefigure. ln which the reference signs represent: 1: connector 11: connector body 12: supporting plate 121: through hole 1211: first yield groove 122: annular sealing groove 123: accommodation groove124: pressure relief portion1241: vent hole 1242: second yield groove 13: conduction pin 131:flange 14: second annular connecting body2: force transmission member21: inner pot 211: pressure chamber 212: force transmission membrane213: second yield hole 22: buffer member 221: throttling orifice 222: step hole 23: connecting groove 3: connection base 31: first annular connecting body32: protrusion 321 : first yield hole 33: annular mounting groove 4: accommodation cavity : sensing circuit assembly 51: circuit board 52: conduction sheet 6: sealing ring 7: sensor body DETAILED DESCRIPTIONln order to make the technical problems to be solved, technical solutions and 6 beneficial effects of the present disclosure more clear, the present disclosure will befurther described in detail below in combination with the drawings and embodiments.lt should be understood that the specific embodiments described herein are only usedto explain the present disclosure and are not intended to limit the present disclosure. lt should be noted that when a element is referred to as being "fixed to" or"disposed on" another element, it can be directly or indirectly on another component.When a element is referred to as being "connected" to another element, it can bedirectly or indirectly connected to another element. lt should be understood that the orientational or positional relationships indicatedby the terms "length", "width", "above", "below", "front", "back", "left", "right", "vertical","horizontal", "top", "bottom", "inside", "outside" and so on are based on those shownin the drawings, only for the convenience of describing the present disclosure andsimplifying the description, rather than indicating or implying that the device orelement must have a specific orientation and be constructed and operated in aspecific orientation, and therefore cannot be understood as a limitation to the presentdisclosure. ln addition, the terms "first" and "second" are used for descriptive purposes onlyand cannot be understood as indicating or implying relative importance or implyingthe number of indicated technical features. Thus, a feature defined with "first" or"second" may explicitly or implicitly include one or more such features. ln thedescription of the present disclosure, "a plurality of" means two or more, unless otherwise specified.

Referring to Figures 1 to 7, the sensor provided by this embodiment comprisesa connector 1, a sensor body 7 and a sensing circuit assembly 5. The sensor body 7and the connector 1 are fixedly connected and enclose to form an accommodationcavity 4. The sensing circuit assembly 5 is disposed in the accommodation cavity 4and configured to generate a sensing signal. The connector 1 comprises a connectorbody 11, a supporting plate 12 disposed inside the connector body 11, and at leastone conduction pin 13 fixedly connected to the supporting plate 12 and electrically connected to the sensing circuit assembly 5. One side surface of the supporting plate 7 12 is provided with an annular sealing groove 122 surrounding a peripheral of theconduction pin 13.

According to the sensor provided by the present disclosure, the sensor body 7and the connector 1 are fixedly connected and enclose to form the accommodationcavity 4, the sensing circuit assembly 5 is disposed in the accommodation cavity 4and configured to generate the sensing signal, at least one conduction pin 13provided on the supporting plate 12 inside the connector body 11 is electricallyconnected with the sensing circuit assembly 5, and one side surface of the supportingplate 12 is provided with the annular sealing groove 122 surrounding the periphery ofthe conduction pin 13, so that when the connector 1 is sealed with glue, the glue maybe directly injected into the annular sealing groove 122 to seal a gap between theconduction pin 13 and the supporting plate 12, thereby sealing the accommodationcavity 4 with less glue consumption. The process is simple and the manufacturingcost is reduced.

Referring to Figures 1 to 3, as a specific implementation of the sensor providedby the present embodiment, the sensor comprises the connector 1 and the sensorbody 7, the sensor body 7 and the connector 1 are fixedly connected and enclose toform the accommodation cavity 4 into which the sensing circuit assembly 5 is placed,and the accommodation cavity 4 is a closed cavity. The sensor is used to sensedifferent physical quantities in various environments. Therefore, in order to ensurethat the sensing circuit assembly 5 may stably and accurately generate sensingsignals and perform signal conversion, the sensing circuit assembly 5 is placed intothe closed accommodation cavity 4 to avoid the impact of the external environment.The connector 1 comprises the connector body 11, the supporting plate 12 disposedinside the connector body 11, and at least one conduction pin 13 fixedly connectedto the supporting plate 12 and electrically connected to the sensing circuit assembly5, so that the signal converted by the sensing circuit assembly 5 may be transmittedto a back end by the conduction pin 13 in the connector body 11, and then acquiredby the back end. The supporting plate 12 is opened with at least one through hole 121 for mounting the conduction pin 13, so that the conduction pin 13 may pass through the through hole 121 penetrating the supporting plate 12 and be connectedwith a device for signal transmission. The supporting plate 12 is provided with theannular sealing groove 122 surrounding the periphery of the conduction pin 13 in thesurface facing the sensing circuit assembly 5. Furthermore, a sealing member isfixedly provided in the annular sealing groove 122, and the sealing member isarranged in contact with the conduction pin 13, so as to further seal the gap betweenthe conduction pin 13 and the supporting plate 12. Preferably, the sealing member isa sealant, which is provided in the annular sealing groove 122 by dropping glue toseal the gap between the conduction pin 13 and the supporting plate 12. The processis simple and easy to operate and may achieve a better sealing effect. By fixing thesealing member in the annular sealing groove 122 instead of conventional direct gluesealing on the supporting plate 12, the sealing effect is better, the glue consumptionfor sealing is decreased, and the manufacturing cost is reduced. The glue used hereis not limited. Either soft glue or hard glue may be used. Preferably, the hard glue isused for sealing, which may reduce the manufacturing cost of the sensor. At the sametime, it avoids that a large amount of sealing glue occupies the space of aaccommodation groove 123, which reduces a working space of the sensing circuitassembly 5, and avoids that some glue may be stuck to a surface of the conductionpin 13 during the sealing process, which affects the signal transmission between theconduction pin 13 and the sensing circuit assembly 5. The sensing circuit assembly5 comprises a circuit board 51 and at least one conduction sheet 52 electricallyconnected with the conduction pin 13. According to different characteristics of thesensors, the physical quantities sensed by the sensors are different, generallyincluding temperature, humidity, displacement, vibration, acceleration, pressure andother factors. Although different sensors are of different structures, the sensing circuitassembly 5 of the sensors comprises the circuit board 51 and electrical elementsconnected to the circuit board 51. ln order to ensure the normal operation of the signalconditioning and conversion circuit and avoid the impact of the external environment,the signal conditioning and conversion circuit is disposed on the circuit board 51, and the sensing circuit assembly 5 is placed in the accommodation cavity 4. The circuit board 51 is electrically connected with the conduction pin 13 on the connector body11 by the conduction sheet 52, and then the connector body 11 and the sensor body7 are crimped together to form a completely sealed conversion circuit working space.The sensor body 7 comprises a first annular connecting body 31. One end of theconnector body 11 connected with the sensor body 7 extends circumferentially toform a second annular connecting body 14. The second annular connecting body 14and the first annular connecting body 31 are crimped and enc|ose to form the closedaccommodation cavity 4 into which the sensing circuit assembly 5 is placed, and thefirst annular connecting body 31 is disposed on an outer side of the second annularconnecting body 14. An outer wall of the first annular connecting body 31 is recessedat equal intervals to form several crimping portions. After the sensor body 7 and theconnector1 are crimped, the first annular connecting body 31 surrounds an outerwallof the second annular connecting body 14, and the crimping portions are embeddedin the outer wall of the second annular connecting body 14, forming a stable clamping,so it may withstand greater torque and radial shaking force along a central axis of thesensor, has a good sealing effect, and will not cause leakage in the working space ofthe sensing circuit assembly 5. A sealing ring 6 is provided between the first annularconnecting body 31 and the second annular connecting body 14 to seal a gaptherebetvveen, further improving the sealing of the accommodation cavity 4, so thatthe circuit board 51 has the stable and sealed working space and meets the highprotection requirements of lP6K9K, ICE WATER SHOCK and SUBMERSION TEST.Further, the sensor body 7 comprises a force transmission member 2 and aconnection base 3. The connector 1, the force transmission member 2 and theconnection base 3 are all made by an integral molding process, so there is no partingline on the surface thereof, which greatly improves the stability of the structure andthe waterproof and sealing performance.

Referring to Figures 4 to 5, in the present embodiment, the number of theconduction pins 13 is plural, the plurality of conduction pins 13 being arranged atintervals along a circumferential direction of the supporting plate 12; the number of the annular sealing groove 122 is plural, the plurality of annular sealing grooves 122 corresponding to the plurality of conduction pins 13 respectively. A plurality ofconduction sheets 52 are provided on the circuit board 51 at corresponding positionsof the conduction pins 13. The conduction sheets 52 are electrically connected withthe conduction pins 13, so that the sensor may stably output data to the back end bythe plurality of conduction pins 13 circumferentially arranged on the supporting plate12. The outer sidewa|| of the conduction pin 13 provided on the supporting plate 12protrudes to form a flange 131. The inner sidewa|| of the through hole 121 is recessedto form a first yield groove 1211 corresponding to the flange 131 of the conductionpin 13, the flange 131 being p|aced in the first yield groove 1211, so that theconduction pin 13 is disposed more stably on the supporting plate 12. By forming asnap connection between the flange 131 on the conduction pin 13 and the first yieldgroove 1211 in the inner sidewa|| of the through hole 121, the connection betweenthe supporting plate 12 and the conduction pin 13 is further stabilized, which maycounteract a thrust force received when the connector 1 is inserted, preventgeneration of the gap between the conduction pin 13 and the through hole 121,further enhances the waterproof and sealing performance, and further improves thestructural reliability of the connector 1. The surface of the supporting plate 12 isrecessed to form several accommodation grooves 123 with notches facing towardthe sensing circuit assembly 5. With the several accommodation grooves 123provided in the supporting plate 12, the wall thickness of the supporting plate 12 maybe reduced. Since the connector body 11 is made of plastic, plastic surface shrinkageand surface warpage, which may result in uneven surface of the supporting plate 12,may be reduced with the several accommodation grooves 123 provided in thesupporting plate 12. The accommodation grooves 123 in the supporting plate 12 arearranged around the through holes 121, which may increase an internal space of theaccommodation cavity 4. At least part of the electrical elements of the sensing circuitassembly 5 extend into the accommodation grooves 123 in the surface of thesupporting plate 12, which increases the working space of the sensing circuitassembly 5. The supporting plate 12 comprises a pressure relief portion 124 which comprises a vent hole 1241 penetrating the supporting plate 12. The supporting plate 12 is opened with a second yield groove 1242 surrounding a peripheral of the venthole 1241 and communicating with the vent hole 1241, the second yield groove beingconfigured for receiving a filter. The connector 1 provided with the pressure reliefportion 124 may utilize the vent hole 1241 of the pressure relief portion 124 for airrelease. At the same time, the filter is installed in the second yield groove 1242arranged circumferentially at the notch of the vent hole 1241 to prevent water, dustor other stains from entering the accommodation cavity 4 through the vent hole 1241,so as to ensure the sealing performance of the accommodation cavity 4 whileachieving the function of pressure release. Preferably, the connector1 is an integrallyformed piece, and the connector 1 is a plastic connector. The connector body 11 andthe second annular connecting body 14 are made by an integral molding process,which effectively strengths the connection between the connector body 11 and thesecond annular connecting body 14, so that a more stable force is provided toconnect the connector 1 and the sensor body 7 when the second annular connectingbody 14 and the first annular connecting body 31 are engaged.

Referring to Figures 6 to 7, in the present embodiment, the sensor body 7comprises the force transmission member 2 and the connection base 3. Theconnection base 3 comprises a protrusion 32 located at the bottom of theaccommodation cavity 4. An annular mounting groove 33 for crimping the secondannular connecting body 14 is formed between the protrusion 32 and the first annularconnecting body 31. The annular mounting groove 33 has a width adapted to a widthof the second annular connecting body 14. After the second annular connecting body14 is inserted into the annular mounting groove 33, the outer sidewalls of the firstannular connecting body 31 and the protrusion 32 are wrapped on the second annularconnecting body 14 together, and the crimping portions of the first annular connectingbody 31 are embedded in the second annular connecting body 14 to form a stablesnap connection, so it may withstand greater torque and radial shaking force alongthe central axis of the sensor, has a good sealing effect, and will not cause leakagein the working space of the signal conditioning and conversion circuit. The protrusion 32 is provided with a first yield hole 321 communicating with an interior of the accommodation cavity 4 and the external environment, the force transmissionmember 2 is partially placed into the first yield hole 321. The force transmissionmember 2 is connected with the connection base 3 in a sealed manner, so that thewater, dust or stains in the external environment cannot enter the first yield hole 321through the gap between the force transmission member 2 and the connection base3 and cannot further enter the accommodation cavity 4 in which the sensing circuitassembly 5 is placed, further improving the waterproof and sealing performance ofthe sensor. Preferably, the sidewall of the force transmission member 2 and thesidewall of the first yield hole 321 of the connection base 3 are fixedly connected bywelding. One end of the first yield hole 321 is covered with the sensing circuitassembly 5. The force transmission member 2 comprises a buffer member 22 aninner pot 21 having a pressure chamber 211. The inner pot 21 is provided with a forcetransmission membrane 212 at the end facing toward the sensing circuit assembly 5,so that a medium may flow into the pressure chamber 211 of the inner pot 21 of theforce transmission member 2 and pressurize the force transmission membrane 212to transmit a pressure signal to the sensing circuit assembly 5 in the accommodationchamber 4 by the force transmission membrane 212. Preferably, the forcetransmission member 2 is a metal member, and the force transmission member 2 ismade by an integral molding process, which effectively strengthens the connectionbetween the force transmission member 2 and the connection base 3, therebystrengthening the sealing between the force transmission member 2 and theconnection base 3. The force transmission membrane 212 is a metal membrane,which improves the durability of the sensor. The use of the metal membrane makesthe force transmission membrane 212 being better welded to the end of the inner pot21. The process is simple and easy to operate. The inner pot 21 of the forcetransmission member 2 is provided with a connecting portion at the other endopposite to the end provided with the force transmission membrane 212, and theforce transmission member 2 is provided with a connecting groove 23 for receivingthe buffer member 22. The connecting portion of the inner pot 21 is located at the bottom of the connecting groove 23, so that the buffer member 22 is fixedly connected to the connecting portion. ln order to further improve the sealing of the connectionbetween the connecting portion and the buffer member 22, the buffer member 22 andthe inner pot 21 are connected in a sealed manner, that is, the buffer member 22 inclearance fit in the connecting groove 23 ofthe force transmission member 2 is fixedlyconnected with the connecting portion of the inner pot 21 , and then the buffer member22 and the inner wall of the connecting groove 23 are sealed by welding, so that thebuffer member 22 is firmly disposed in the connecting groove 23 of the forcetransmitting member 2. The buffer member 22 is provided with a thrott|ing orifice 221penetrating the buffer member 22, and the connecting portion is provided with asecond yield hole 213 communicating with the inside of the pressure chamber 211and the external environment, that is, the pressure chamber 211 is arranged incommunication with the thrott|ing orifice 221 so that the medium may pass throughthe thrott|ing orifice 221 of the buffer member 22, and then flows through the secondyield hole 213 of the connecting portion of the inner pot 21, and then enters thepressure chamber 211 of the inner pot 21 of the force transmission member 2 andapplies pressure to the force transmission membrane 212, so that its pressure signalis transmitted to the sensing circuit assembly 5 in the accommodation cavity 4 by theforce transmission membrane 212. When the sensor is under instantaneousoverpressure protection, it may be buffered by the buffer member 22 of the forcetransmission member 2, so that the pressure needs to pass through the thrott|ingorifice 221 provided in the buffer member 22 to enter the pressure chamber 211 ofthe force transmission member 2. With the thrott|ing orifice 221, the flow rate of themedium is reduced to protect the sensor from damage caused by excessively highinstantaneous pressure, and the sensor is enabled to pass the pressure peakresponse test. The buffer member 22 may protect the sensor, which is beneficial toincrease the service life of the sensor. Preferably, the surface of the buffer member22 facing the inner pot 21 is recessed to form a step hole 222 surrounding a peripheryof the thrott|ing orifice 221 and communicating with the thrott|ing orifice 221. Theconnecting portion of the inner pot 21 is placed in the step hole 222 of the buffer member 22. The pressure chamber 211 is arranged in communication with the step hole 222 and the throttling orifice 21. The step hole 222 provided on the buffermember 22 is beneficial to improve the versatility of the buffer member 22, which isconvenient for processing and manufacturing, and the two may be connected byordinary machining, that is, by welding, which reduces the processing cost.

The above is only the preferred embodiment of the present disclosure, and is notintended to limit the present disclosure. Any modification, equivalent replacement andimprovement made within the spirit and principle of the present disclosure should be included in the scope of protection of the present disclosure.

Claims (20)

What is claimed is,

1.A sensor comprising a connector, a sensor body and a sensing circuitassembly, the sensor body and the connector being fixedly connected andenclosing to form an accommodation cavity, the sensing circuit assembly beingdisposed in the accommodation cavity and configured to generate a sensingsignal; the connector comprising a connector body, a supporting plate disposedinside the connector body, and at least one conduction pin fixedly connected tothe supporting plate and electrically connected to the sensing circuit assembly;one side surface of the supporting plate being provided with an annular sealing groove surrounding a peripheral of the conduction pin.

2. The sensor according to claim 1, characterized in that: the supportingplate is opened with at least one through hole for mounting the conduction pin,an outer sidewall of the conduction pin protruding to form a flange, an innersidewall of the through hole being recessed to form a first yield groove corresponding to the flange of the through pin and receiving the flange.

3. The sensor according to claim 1, characterized in that: the surface of thesupporting plate is recessed to form several accommodation grooves with notches being disposed toward the sensing circuit assembly.

4. The sensor according to claim 3, characterized in that: the sensing circuitassembly comprises a circuit board and electrical elements connected on thecircuit board, at least part of the electrical elements extending into the accommodation grooves in the surface of the supporting board.

5. The sensor according to claim 1, characterized in that: the annularsealing groove is disposed in the surface of the supporting plate facing the sensing circuit assembly.

6. The sensor according to claim 1, characterized in that: a sealing memberis fixedly disposed in the annular sealing groove and disposed in contact with the conduction pin.

7. The sensor according to claim 6, characterized in that: the sealingmember is a sea|ant which is provided in the annular sealing groove by dropping glue.

8. The sensor according to claim 1, characterized in that: the supportingplate comprises a pressure relief portion which comprises a vent holepenetrating the supporting plate, the supporting plate being opened with asecond yield groove surrounding a periphery of the vent hole andcommunicating with the vent hole, the second yield groove being configured for receiving a filter.

9. The sensor according to claim 1, characterized in that: the number of theconduction pins is plural, the plurality of conduction pins being arranged atintervals along a circumferential direction of the supporting plate; and thenumber of the annular sealing grooves is plural, the plurality of annular sealing grooves corresponding to the plurality of conduction pins respectively.

10. The sensor according to claim 1, characterized in that: the sensingcircuit assembly comprises a circuit board and at least one conduction sheet electrically connected to the conduction pin.

11. The sensor according to claim 1, characterized in that: the sensor bodycomprises a first annular connecting body, one end of the connector bodyextending circumferentially to form a second annular connecting body, thesecond annular connecting body and the first annular connecting body being crimped and enclosing to form the accommodation cavity for receiving the sensing circuit assembly.

12. The sensor according to c|aim 11, characterized in that: a sealing ringis provided between the first annular connecting body and the second annular connecting body to sea| a gap therebetween.

13. The sensor according to c|aim 11, characterized in that: the sensorbody comprises a force transmission member and a connection basecomprising a protrusion located at a bottom of the accommodation cavity, anannular mounting groove for crimping the second annular connecting bodybeing formed between the protrusion and the first annular connecting body; theprotrusion being provided with a first yield hole communicating with an interiorof the accommodation cavity and the external environment and configured forreceiving part of the force transmission member, one end of the first yield hole is covered with the sensing circuit assembly.

14. The sensor according to c|aim 13, characterized in that: the forcetransmission member is connected with the connection base in a sealed manner.

15. The sensor according to c|aim 13, characterized in that: the forcetransmission member comprises a buffer member and an inner pot with apressure chamber, the inner pot being provided with a force transmissionmembrane at one end facing toward the sensing circuit assembly and aconnecting portion at the other end, the connecting portion being provided witha second yield hole communicating with the interior of the pressure chamberand the external environment; the connecting portion being fixedly connected with the buffer member.

16. The sensor according to claim 15, characterized in that: the forcetransmission member is provided with a connecting groove for receiving thebuffer member, the connecting portion of the inner pot being located at a bottom of the connecting groove.

17. The sensor according to claim 15, characterized in that: the buffermember is provided with a thrott|ing orifice penetrating the buffer member, thebuffer member being recessed on a surface facing the inner pot to form a stephole surrounding a periphery of the thrott|ing orifice and communicating withthe thrott|ing orifice, the pressure chamber being arranged in communication with the step hole and the thrott|ing orifice.

18. The sensor according to claim 15, characterized in that: the buffer member is connected with the inner pot in a sea|ed manner.

19. The sensor according to claim 15, characterized in that: the forcetransmission member is a metal member, the connection base is a metal base, and the force transmission membrane is a metal membrane.

20. The sensor according to claim 1, characterized in that: the connector is an integrally formed piece, and the connector is a plastic connector.