SE2151586A1 - A method to determine thickness and wave height of a thin substrate - Google Patents
A method to determine thickness and wave height of a thin substrate Download PDFInfo
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- SE2151586A1 SE2151586A1 SE2151586A SE2151586A SE2151586A1 SE 2151586 A1 SE2151586 A1 SE 2151586A1 SE 2151586 A SE2151586 A SE 2151586A SE 2151586 A SE2151586 A SE 2151586A SE 2151586 A1 SE2151586 A1 SE 2151586A1
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- 239000000758 substrate Substances 0.000 title claims abstract description 103
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000003990 capacitor Substances 0.000 claims description 18
- 239000000123 paper Substances 0.000 claims description 15
- 239000002655 kraft paper Substances 0.000 claims description 4
- 239000004627 regenerated cellulose Substances 0.000 claims description 2
- 229920002678 cellulose Polymers 0.000 description 12
- 239000001913 cellulose Substances 0.000 description 12
- 230000004888 barrier function Effects 0.000 description 11
- 239000000835 fiber Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000011326 mechanical measurement Methods 0.000 description 5
- 229920003043 Cellulose fiber Polymers 0.000 description 3
- 229920001131 Pulp (paper) Polymers 0.000 description 3
- 239000011084 greaseproof paper Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 239000011086 glassine Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 241000609240 Ambelania acida Species 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 229920002488 Hemicellulose Polymers 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 241000209140 Triticum Species 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- 229920002522 Wood fibre Polymers 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000010905 bagasse Substances 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 206010061592 cardiac fibrillation Diseases 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
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- 238000001035 drying Methods 0.000 description 1
- 230000002600 fibrillogenic effect Effects 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011121 hardwood Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920005610 lignin Polymers 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001404 mediated effect Effects 0.000 description 1
- GDOPTJXRTPNYNR-UHFFFAOYSA-N methyl-cyclopentane Natural products CC1CCCC1 GDOPTJXRTPNYNR-UHFFFAOYSA-N 0.000 description 1
- 230000000813 microbial effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
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- 238000001314 profilometry Methods 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 239000011122 softwood Substances 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000002025 wood fiber Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/34—Paper
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/28—Measuring arrangements characterised by the use of mechanical techniques for measuring roughness or irregularity of surfaces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- G01B7/08—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using capacitive means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/34—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring roughness or irregularity of surfaces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Paper (AREA)
Abstract
A BS T R A C TA method to measure thickness and wave height of a thin substrate (3), wherein that the method comprising the steps of a) placing a first electrode (2a) against a first side (3a) of the substrate (3) and a second electrode (2b) against a second side (3b) of the substrate (3), b) removing the substrate (3) from the electrodes (2a, 2b), c) measuring the electrical capacitance between the electrodes, using the electrical capacitance value from step (c) to determine the distance, dAC, between the first electrode (2a) and the second electrode (2b), i.e. the distance between the substrate's wave tops, measuring the thickness, dMECH, of the substrate with a micrometer (7), and combining the results from step (d) and step (e) to calculate the wave height of the substrate.
Description
A METHOD TO DETERMINE THICKNESS AND WAVE HEIGHT OF A THIN SUBSTRATE Technical field The present invention relates to a method. to measure thickness and wave height of a thin substrate.
The expression "thin substrate" is in this context a film or barrier substrate such as nucrofibrillated cellulose (MFC) or thin barrier paper such as greaseproof paper, glassine or coated kraft paper which substrate has a grammage of less than 100 gsm, preferably less than 80 gsm and most preferred 15-60 gsm.
In the following the expression MFC or microfibrillated cellulose will be frequently used. Microfibrillated cellulose (MFC) shall in the context of the patent application mean a cellulose particle, fiber or fibril having a width or diameter of from 4 nm to 1000 nm. such as followed by Various methods exist to make MFC, single or multiple pass refining, pre-hydrolysis refining or high shear disintegration or liberation of fibrils. One or several pre-treatment steps is usually required in order to make MFC manufacturing both energy efficient and sustainable. The cellulose fibers of the pulp used when producing MFC may thus be native or pre- treated enzymatically or chemically, for example to reduce the quantity of hemicellulose or lignin. The cellulose fibers may be chemically modified before fibrillation, wherein the cellulose molecules contain functional groups other (or more) than found in the original cellulose. Such groups include, among others, carboxymethyl (CM), aldehyde and/or carboxyl groups (cellulose obtained by N-oxyl mediated oxidation, for example "TEMPO"), or quaternary ammonium (cationic cellulose). After being nwdified or oxidized in one of the above-described næthods, it is easier to disintegrate the fibers into MFC.
MFC can be produced from wood cellulose fibers, both from hardwood or softwood fibers. It can also be made from microbial sources, agricultural fibers such as wheat straw pulp, bamboo, bagasse, or other non-wood fiber sources. It can be made from pulp, including pulp from virgin fiber, e.g. mechanical, chemical and/or thermomechanical pulps.
It can also be made from broke or recycled substrate.
Thin barrier substrates made from cellulose such as barrier comprising MFC or for example highly refined pulp, can be efficient barrier materials in packaging or in various laminate structures.
Prior art - Problem A "thin substrate" is in this context a film or barrier substrate such as microfibrillated cellulose film or barrier substrates such as microfibrillated cellulose (MFC) or thin barrier paper such as greaseproof paper, glassine or coated kraft paper which substrate has a grammage of less than 100 gsm, preferably less than 80 gsm and most preferred 15-60 gsm. A problem with these substrates is to determine their thickness and especially thickness variations i.e. wave height. This includes micro-wrinkles or small-scale unevenness in thickness profile. Variations in thickness can be harmful for lO convertibility, printing, lamination, gluing, vacuum coatability, or post-coatability, etc.
Standard methods are not sensitive enough and might not reveal protruding fibers or fiber flocs or micro-buckles or wrinkles due to drying or defects in the sheet.
Profilometry or other contact methods could reveal some roughness variations, although these methods are also very much dependent on how the substrate is adhered to a carrier medium.
One method is to apply Bristow wheel method to extrapolate the surface volume, whereas this is challenging and very (surface and dependent on liquid-substrate interaction base can swell upon contact with the liquid) It is also essential that base substrates and substrates should have good surface smoothness in order to gain low barrier coating uptake and hence good substrate formation at low coating amounts - in order to gain improvements in barrier properties (with low coating amounts).
Object of invention An object with the invention is to provide a method to determine the thickness and thickness variations i.e. wave height of thin substrates, which method solves, or at least reduces, the above-mentioned problems.
Summary of the invention In accordance with the invention the method comprising the steps of: lO a) placing a first electrode against a first side of the substrate and a second electrode against a second side of the substrate, b) fixing the position of the electrode and removing the substrate from the electrodes, c) measuring the electrical capacitance between the electrodes, d) using the electrical capacitance value from step (c) to determine the distance, dMU between the first electrode and the second electrode, i.e., the distance between the substrate's wave tops, e) measuring the thickness, dmmn, of the substrate with a micrometer, and f) combining the results from step (d) and step (e) to calculate the wave height of the substrate.
Detailed description of the invention and examples Figure l discloses a schematic view of a parallel plate capacitor to measure the thickness between the wave tops of a substrate.
Figure 2 discloses a thin substrate between the plates of a plate capacitor. 3 discloses the thickness dmy Figure capacitance and effective dielectric constant dependence on pressure.
Figure 4 discloses a schematic view of a ndcrometer for mechanical measurement of substrate thickness.
Figure 5 discloses the profile of a substrate thickness, wherein a mechanical measurement of the thickness is obtained dmmn. lO Figure 6 discloses the thickness ratio between the thickness from capacitor measuring dM; and mechanical measuring dmæn.
In the following, the invention will be described more in detail with reference to Figures l to 6. The inventive method for næasuring thickness the wave height of thin substrates comprising' three method. steps: A) Capacitor measuring of substrate with a parallel plate capacitor, dMy B) Mechanical measuring of substrate thickness with a micrometer, dmmfl, and C) Combining the thickness results from A) and B) to determine waviness / wave height of the substrate.
A) Capacitor measuring of substrate with a parallel plate capacitor, dm; Figure l discloses a parallel plate electrical capacitor l comprising a supporting frame 4, an upper, flat plate, first electrode 2a and a lower, flat plate, second 2b are connected to a 644OB, electrode 2b, where electrodes 2a, standard RLC meter, e.g. Wayne Kerr precision component analyzer. The plate capacitor l further comprising a first insulator 5a and a second insulator 5b which insulators 5a, 5b insulate the first and. second electrodes 2a, 2b respectively from the frame 4. A thin substrate 3 with an upper, first surface 3a and a lower, second surface 3b is placed between the first and second electrodes 2a, 2b. The first electrode 2a is then pushed against the first surface 3a of the substrate 3 such that it contacts the first surface 3a. The clamping pressure can be selected by selecting the weights. The clamping pressure is in the range 3-20 kPa, preferably 5-lO kPa and lO most preferred 5-7 kPa. Figure 3 discloses the thickness dm; capacitance and effective dielectric constant dependence on pressure. Then position of the first electrode may be fixed by using a screw. Distance between electrodes is the substrate thickness dm. The substrate is then pulled. out and. the electrical capacity Co is measured. The thickness (distance between electrodes) is calculated according formula for the electrical capacitance of a flat capacitor: ¿2S dAC= ° , <1) CO where ¿0==&85-10%2 F/m is an electrical constant, S - electrode area and Cb - measured capacitance of the capacitor without substrate. Using dM:[mmJ, GSM [g/m2] the substrate density pM;[kg/m3] is calculated: pAC 2 GSM _ (2) dAC Substrates are not flat and the thickness dM;may depend sometimes very strongly on the clamping pressure from the electrodes, as disclosed. in Figure 2. Hence, the calculated substrate density is depended on the clamping pressure. This density is not real substrate density and can be named as density of "substrate with air gaps".
B) Mechanical measuring of substrate thickness with a micrometer, dmmfl.
The substrate thickness dM;is determined testing large areas and it is difficult to make the substrate flat. The similar situation is in the ISO method although the testing area is smaller but large enough comparing with the wave dimension. Therefore, we use the testing with a small contact area "point" by using a micrometer.
A schematic view of a micrometer 7 for mechanical measurement of substrate 3 thickness dmmn is shown in Figure 4. The micrometer 7 comprising a cylinder 8 and a measuring rod 9, which moves freely inside the cylinder 8. The micrometer further comprising a spring 11 which generates a compressive force of the rod 9 against the substrate 3. A round head 10 is arranged at the end of the rod, which head faces against the substrate. The head 10 is rounded and the diameter of the head is 1 mm and the contact area (measuring area) is ~0.8 mm2. The compressive force of the rod is 90 g and the pressure against the substrate is 0.5-1 MPa during measuring.
The substrate thickness is measured in many (12-20) points and the mathematical average is calculated and the average of substrate thickness (mechanical thickness) is obtained. The accuracy of the thickness measurement depends on the measurements number. To increases the determination accuracy substrate thickness can be scanned. Substrate is dawned with the constant speed and thickness is recorded. The result is thickness profile and average thickness can be calculated, see Figure 5.
C) Combining the thickness results from. A and B to determine waviness / Wave height When substrate is flat and smooth, its real surface area is equal to the geometric area. When substrate is wavy, the real surface area ("surface volume") can be much larger depending on the wave height and "frequency component". Wave height can be determined using electrical capacitor and mechanical "point" thickness determination methods: the difference between dM;and mechanical "point" thickness is wave height. Some information about the wave "frequency" can be obtained analyzing (spectral analysis) thickness profile. Information about the waves can be obtained also analyzing the photo of the substrate cross section - the computer program will calculate the surface area S of the substrate with pixel accuracy.
Waviness is detected applying both methods together. Capacitance is measured at minimal pressure 7 kPa and from the capacitance value is calculated distance between both side wave tops. Then real substrate thickness is measured mechanically. The wave height is the distance between wave tops minus substrate real thickness, see table 1 below.
The capacitance is measured at minimal (kiss) pressure. It is 7 kPa. So, it can be said that the waviness is determined almost without pressure.
Substrate Grammage Capacitor Mechanical Wave [gsm] thickness, dA@ thickness, height (distance dmmn [Um] between wave [um] tOpS) , [um] D1 39.9 49.2 30.9 18.3 D2 49.4 59.6 38.6 21.0 D3 21.3 34.6 17.5 17.1 D4 27.0 40.6 22.2 18.4 D5 41.4 68.5 31.2 37.3 D6 30.9 55.3 25.3 30.0 Table 1 The samples in the figure 6 are: S1: A substrate comprising MFC and softener.
S2: A substrate comprising MFC which has been coated with UV varnish.
S3: A substrate comprising MFC with modified rougnhness. S4: A substrate comprising MFC with 1-side coating of PVOH.
S5: A substrate comprising MFC with 1-side coating of PVOH and applied with higher amount.
S6: A substrate comprising MFC - uncoated (ca 30 gsm). S7: A substrate comprising MFC with slightly higher grammage (ca 32 gsm).
S8: A substrate comprising MFC with higher grammage (ca 40 gsm).
S9: A substrate comprising MFC with higher grammage (ca 50 gsm).
S10: A substrate comprising MFC with higher grammage (ca 60 gsm).
S11: A regular office paper substrate. from Figure 6 discloses a. ratio between. the thickness mechanical measurement with a micrometer 7 dmmn and capacitor* measurement with. a capacitor* dM; This ratio could be defined as "macroroughness". The ratio should have a value higher than 0.4, preferably higher than 0.5 and most preferred higher than 0.6.
The benefit with the inventive method is that it reveals more efficiently micro buckliness and protruding fibers in the substrate that can cause problem with air entrapment etc.
The method can be applied on very thin substrates less than 100 gsm, preferable less than 80 gsm and most preferred 15-60 gsm. The density can vary, but is preferably between 100-2000 kg/m3, more preferred 200-1800 and most preferred 600-1400 kg/m3.
The method can also be made at different relative humidity as disclosed in Figure 6. The relative humidity during the O measuring may vary in the range 0-90 fiRH, preferably in the range 0-85 %RH. -60 %RH.
The most preferred is in the range Moreover, the temperature during the measuring may vary in 0-100 °C, 10-70 °C preferred 20-50 °C. in the range preferably and most The moisture content in the substrate may vary in the range 0-30 %. The most preferred moisture content in the O substrate in the range 1-25 6.
In the foregoing, the invention has been described based on some specific embodiments. However, a person skilled in the art realises that other embodiments and variants are possible within the scope of the following claims. For example, it is obvious that the clamping pressure and arrangement of the capacitor measuring may be conducted in several different ways e.g. springs, weights etc. Also, the clamping pressure with the mechanical measurement may be conducted in other ways e.g. weights, springs etc.
Moreover, the moving and the fixing of the electrode during the measuring may be done in many various ways such as screws, clamp arrangement, tape etc.
The substrate can be various coated on uncoated cellulose or fiber-based substrates such as substrate comprising MFC ll or higher refined pulp, greaseproof paper, glassing paper, kraft paper, translucent paper, transparent paper, tracing paper, capacitor paper, label paper or regenerated cellulose. Furthermore, the substrate can be coated on one or both sides with various polymers or nwterials. The substrate is preferably' a substrate for barrier application in packaging. Moreover, it can be used as free- standing substrate and/or in various forms of laminates.
Claims (10)
1.l. A method to measure thickness and wave height of a thin substrate (3), wherein that the method comprising the steps of: a) placing a first electrode (2a) against a first side (3a) of the substrate (3) and a second electrode (2b) against a second side (3b) of the substrate (3), b) fixing the position of the electrode and removing the substrate (3) from the electrodes (2a, 2b), c) measuring the electrical capacitance between the electrodes, d) using the electrical capacitance value from step (c) to dm, between the first electrode (2b), i.e., determine the distance, (2a) and the second electrode the distance between the substrate's wave tops, e) measuring the thickness, dmmn, of the substrate with a micrometer (7), and f) combining the results from step (d) and step (e) to calculate the wave height of the substrate.
2. Method according to claim l, wherein the measuring in step (e) is performed at several points, preferably more than lO, over the substrate and that the thickness dmmnis an average value of the measuring points.
3. Method. according' to any of claim. l-2, wherein the contact area of the measuring in step (e) is less than l.O mm2, preferably about 0.8 mm wherein the
4. Method. according' to any of claim. l-3, clamping pressure of the electrodes (2a, 2b) against thesubstrate in step (a) is in the range 3-20 kPa, preferably 5-10 kPa and most preferred 5-7 kPa.
5. Method. according' to any of claim. 1-4, wherein the clamping pressure by the micrometer in step (e) is in the range 0.5-1.0 MPa.
6. Method. according' to any of claim. 1-5, wherein the substrate has a grammage of less than 100 gsm, preferably less than 80 and most preferred 15-60 gsm.
7. Method. according' to any of claim. 1-6, wherein the temperature during the measuring is in the range 0-100 °C, preferably 10-70 °C and most preferred 20-50 °C.
8. Method according tm) any of claim 1-7, wherein the relative humidity during the Hæasuring is in the range 0-90 %RH, preferably 0-85 %RH and most preferred 10-60 %RH.
9. Method. according' to any of claim. 1-8, wherein the moisture content in the substrate is in the range 0-30 %, O preferably 1-25 6.
10. Method according to any of claim 1-9, wherein the substrate is a substrate comprising MFC or higher refined glassing' paper, kraft paper, translucent paper, label Pulp, transparent paper, tracing paper, capacitor paper, paper or regenerated cellulose.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE2151586A SE545420C2 (en) | 2021-12-22 | 2021-12-22 | A method to determine thickness and wave height of a thin substrate |
| PCT/IB2022/062292 WO2023119081A1 (en) | 2021-12-22 | 2022-12-15 | A method to determine thickness and wave height of a thin substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE2151586A SE545420C2 (en) | 2021-12-22 | 2021-12-22 | A method to determine thickness and wave height of a thin substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE2151586A1 true SE2151586A1 (en) | 2023-06-23 |
| SE545420C2 SE545420C2 (en) | 2023-09-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE2151586A SE545420C2 (en) | 2021-12-22 | 2021-12-22 | A method to determine thickness and wave height of a thin substrate |
Country Status (2)
| Country | Link |
|---|---|
| SE (1) | SE545420C2 (en) |
| WO (1) | WO2023119081A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3679972A (en) * | 1971-04-26 | 1972-07-25 | Lion Precision Corp | Micrometer thickness gage |
| JPH1026507A (en) * | 1996-07-11 | 1998-01-27 | Sony Corp | Method and apparatus for measurement of sheet thickness of board |
| US6388452B1 (en) * | 2000-04-20 | 2002-05-14 | Hewlett-Packard Company | Device for sensing media thickness using capacitance measurements |
| US20110309572A1 (en) * | 2007-07-26 | 2011-12-22 | Fujitsu Limited | Paper thickness detecting apparatus |
| CN105953719A (en) * | 2016-06-24 | 2016-09-21 | 国家档案局档案科学技术研究所 | Nondestructive archival paper measuring instrument and method for simultaneous measurement of water content and thickness of paper |
-
2021
- 2021-12-22 SE SE2151586A patent/SE545420C2/en not_active IP Right Cessation
-
2022
- 2022-12-15 WO PCT/IB2022/062292 patent/WO2023119081A1/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3679972A (en) * | 1971-04-26 | 1972-07-25 | Lion Precision Corp | Micrometer thickness gage |
| JPH1026507A (en) * | 1996-07-11 | 1998-01-27 | Sony Corp | Method and apparatus for measurement of sheet thickness of board |
| US6388452B1 (en) * | 2000-04-20 | 2002-05-14 | Hewlett-Packard Company | Device for sensing media thickness using capacitance measurements |
| US20110309572A1 (en) * | 2007-07-26 | 2011-12-22 | Fujitsu Limited | Paper thickness detecting apparatus |
| CN105953719A (en) * | 2016-06-24 | 2016-09-21 | 国家档案局档案科学技术研究所 | Nondestructive archival paper measuring instrument and method for simultaneous measurement of water content and thickness of paper |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023119081A1 (en) | 2023-06-29 |
| SE545420C2 (en) | 2023-09-05 |
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