SE201447C1 - - Google Patents
Info
- Publication number
- SE201447C1 SE201447C1 SE201447DA SE201447C1 SE 201447 C1 SE201447 C1 SE 201447C1 SE 201447D A SE201447D A SE 201447DA SE 201447 C1 SE201447 C1 SE 201447C1
- Authority
- SE
- Sweden
- Prior art keywords
- titanium
- nickel
- solder alloy
- alloys
- palladium
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/322—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C a Pt-group metal as principal constituent
Description
Uppfinnare: D W Rhys och RD Berry Prioritet begtird frdn den 26 november 1962 (Storbritannien) Vid framstallning av keramik—keramikeller keramik—metallskarvar genom lödning uppsta svhrigheter till fOljd av att de hittills anvanda lodlegeringarna joke Arta den keramiska ytan tillfredsstallande. Om skarvarna skola bildas vid framstallning av artiklar, som skola utsattas for hoga temperaturer, maste lodlegeringen naturligtvis ha en smallpunkt, som ligger gaff Over den maximitemperatur, som uppnas, sedan skarven har gjorts. mom exempelvis elektronikindustrin utsattas komponentcr .med sadana skarvar for temperaturer av 550° C och hogre under avgasning, och det har visat sig vara mycket svart att alstra goda skarvar i dessa komponenter. Inventors: D W Rhys and RD Berry Priority used from 26 November 1962 (Great Britain) In the manufacture of ceramics — ceramics or ceramics — metal joints by soldering, difficulties arise due to the fact that they have hitherto used solder alloys joke Arta the ceramic surface satisfactorily. If the joints are to be formed in the manufacture of articles which are to be exposed to high temperatures, the solder alloy must, of course, have a narrow point which is equal to the maximum temperature reached after the joint has been made. For example, in the electronics industry, components are exposed with such joints to temperatures of 550 ° C and higher during degassing, and it has been found to be very difficult to produce good joints in these components.
Till foljd av svarigheterna mat vatningen her man tillgripit mycket inveeklade metoder. Man har I. ex. framstallt sammansatta lodtradar, som ha en inre karna av titan och ett yttre holje av en silver-kopparlegering. Olyekligtvis smaller den sammansatta &Aden icke hell, forran en temperatur av ungefar 950° C uppnatts. Framstallningen av en skarv med en med karna forsedd trad av denna typ nadvandiggiir, att komponenterna med skarven maste hMlas vid mycket hogre temperaturer an legeringens smaltpunkt (ungefar 780° C) under en avsevard lid. Detta kan vara en avgjord nackdel, eftersom det kan resuItera i att metallkompon.enten angripes av lodlegeringen och ocksa i att lodlegeringen bringas att flyta till sadana stallen, dar den icke erfordras. Ett annat salt omfattar metallisering av den keramiska ytan med molybden med .eller utan mangan, titan eller zirkoMum, och att sedan pafora en lodlegering ph den metalliserade ytan. Vid sadana forfaranden, ha palladium-nickel- och palladium-kobolt-legeringar foreslagits sasorn. lodlegeringar. Vid sammanfogning av en metalldel och en keramisk del Or det emellertid ofta onskvart, att det icke skall finnas flagon elektrisk ledningsbana mellan metalldelarna. Eftersom dessa metalldelar kunna ligga flare varandra, är det ofta svart eller omojligt att pafora metalliseringsOverdraget ph den keramiska ytan utan att alstra •en sadan elektriskt ledande bane. Dessutom medfOr overdragningen och den efterfoljande lodningen tva eller flera fOrfaringssteg, som aro bade tidsOdande och arbetskravande. Metalliseringsbeha:ndlingen inbegriper dessutom upphettning till en mycket hog temperatur, vilket kan allvarligt farsamra det keramiska materialetx egenskaper. Due to the similarities in food irrigation, very complicated methods have been used. One has I. ex. Manufactured composite vertical radar having an inner titanium core and an outer casing of a silver-copper alloy. Unfortunately, the compound & Aden does not shrink until a temperature of about 950 ° C is reached. The production of a joint with a wire provided with this type of water requires that the components with the joint must be heated at much higher temperatures than the melting point of the alloy (approximately 780 ° C) for a considerable time. This can be a definite disadvantage, as it can result in the metal component being attacked by the solder alloy and also in the solder alloy being caused to float to such stalls where it is not required. Another salt involves metallizing the ceramic surface with molybdenum with or without manganese, titanium or zirconium, and then applying a solder alloy to the metallized surface. In such processes, palladium-nickel and palladium-cobalt alloys have been proposed. solder alloys. When joining a metal part and a ceramic part, however, it is often desirable that there should be no flake electrical wiring path between the metal parts. Since these metal parts can lie more than one another, it is often black or impossible to apply the metallization coating to the ceramic surface without generating such an electrically conductive path. In addition, the coating and the subsequent soldering involve two or more experiential steps, which are both time-consuming and labor-intensive. The metallization treatment also involves heating to a very high temperature, which can seriously impair the properties of the ceramic material.
Foreliggande uppfinning Or grundad pa den overraskande upptacktert, att ternara legeringar av palladium, nickel och titan ha 110- desegenskaper, som aro vat lampade Thr framstallning av skarven, varvid den smalta metallen faktiskt vater en keramisk yta i tillfredsstallande utstrackning. Enligt uppfinningen bestar en lodlegeTing av 30-75 % palladium och 2-9 % titan, varvid resten. (bortsett frau fororeningar) är nickel, dvs. nickelhalten kan vara 16-68 %. The present invention is based on the surprising discovery that ternary alloys of palladium, nickel and titanium have 110 properties which have been illuminated during the production of the joint, the molten metal actually having a ceramic surface to a satisfactory extent. According to the invention, a solder composition consists of 30-75% palladium and 2-9% titanium, the remainder. (except for pollutants) is nickel, ie. the nickel content can be 16-68%.
Derma legering har vatningsegenskaper, vilka aro alit battre ju hogre titanhalten Or och vilka aro utmarkta vid 4 % titan och twat Legeringar med upp till 6 % titan kunna dragas ned till trad aro aro saledes ytterst lampliga for framstallning av lokala skarvar med invecklad natur, sasom ofta erfordras vid 2 elektriska och elektroniska komponenter, men vid ungefar 5 % titan aro legeringarna svara att bearbetta. Da titanhalten ãr over 6 %, aro legeringarna praktiskt taget obearbetbara men k-u.nua anvandas i pulverform,. Sanaltpunkterna for legeringar med mera an 9 % titan aro sa hoga, att dessa legeringar icke ha na.got praktiskt varde. This alloy has irrigation properties, which are better the higher the titanium content Or and which are excellent at 4% titanium and twat. often required for 2 electrical and electronic components, but for about 5% titanium aro the alloys answer to be processed. Since the titanium content is over 6%, the alloys are practically unworkable but k-u.nua are used in powder form. The sanitary points for alloys with more than 9% titanium are so high that these alloys have no practical value.
Nagra exempel pa legeringar enligt uppfinningen framga av efterfoljande tabell: Lege- ring nr % Pd % Ni % Ti Likvidus- tempera- tur °C Solidus-temperatur °C 1 58 39 3 1226 1224 2 58 38 4 1224 1221 3 57 318 1221 1214 4 56 37 7 1217 1212 54,36,9 1218 1212, Del framgar, .att legeringarna 3, 4 och 5, i vilka forhallandet mellan palladium och är i huvudsak lika med 3 : 2, ha de lagsta smaltpunkterna. Some examples of alloys according to the invention are shown in the following table: Alloy no% Pd% Ni% Ti Liquidus temperature ° C Solidus temperature ° C 1 58 39 3 1226 1224 2 58 38 4 1224 1221 3 57 318 1221 1214 4 56 37 7 1217 1212 54,36,9 1218 1212, Part shows that the alloys 3, 4 and 5, in which the ratio between palladium and is substantially equal to 3: 2, have the lowest melting points.
Fororeningar, som kunna vara narvarande, aTet upp till 1 % kobolt, upp till 1 % jam, upp till 1koppar och upp till 0,1 % kol. Spe- ciellt skadliga fororeningar aro bor och Miura, vilka bidraga till angrepp och nedbrytning av keramiska artiklar, som lodas med hjalp av legeringarna, och dessa tva fororeningar bora foljaktligen undvikas. Contaminants that may be present, such as up to 1% cobalt, up to 1% jam, up to 1 copper and up to 0.1% carbon. Particularly harmful contaminants are boron and Miura, which contribute to the attack and degradation of ceramic articles, which are soldered with the aid of the alloys, and these two contaminants should therefore be avoided.
Metaller, som maste fastIodas pa keramiska material, besta vanligen av legeringar, vilka till foljd av narvaro av krom, aluminium, titan eller andra grundamnen ha benagenhet att fa sammanhangande och vidhangande oxidfilmer pa sina ytor. Exempel harpa aro de ausfenitis- kaoch legeringar, som aro grun- dade pa nickel, pa nickel och krom, pa nickel och kobolt eller pa nickel, krom och kobolt. Vid framstallning av skarvar mellan sadana metaller och keramiska material pa sattet enligt uppfinningen kan lOdningsoperationen utfOras i vate, i vakuum eller i argon, och da reagerar lOdlegeringen med ytan av det keramiska materialet och med oxidfilmen pa metallen, sa att en tillfredsstallande skarv bildas. Metals which must be solidified on ceramic materials usually consist of alloys which, due to the presence of chromium, aluminum, titanium or other elements, tend to have cohesive and adherent oxide films on their surfaces. Examples are the ausfenitis and alloys, which are based on nickel, nickel and chromium, nickel and cobalt or nickel, chromium and cobalt. In the production of joints between such metals and ceramic materials in the method according to the invention, the soldering operation can be carried out in water, in vacuum or in argon, and then the solder alloy reacts with the surface of the ceramic material and with the oxide film on the metal, so that a satisfactory joint is formed.
Keranaiska material, som kunna fastlodas pa sig sjalva, pa andra keramiska material eller pa. metal' pa sattet enligt uppfinningen inbegripa isolationsmaterial, vilka besta i huvudsak av metalloxider, t. ex. aluminiumoxid, magnesiumoxid, toriumoxid och zirkoniumdioxid, eller av aluminokiselsyra, zirkoniumsilikat eller kiselnitrid, vilka alla kunna innehalla mera 'eller mindre frammande material, t. ex. jarn(III)oxid, kiseldioxid och kalciumkarbonat. Det formodas, att Mallet I lOdlegeringen reagerar rued oxiden pa ytan fOr att bilda en bindning, som farbattrar metallens flytning i skarven. Ceramic materials, which can be soldered on themselves, on other ceramic materials or on. metal 'in the method according to the invention include insulating materials, which consist mainly of metal oxides, e.g. alumina, magnesium oxide, thorium oxide and zirconia, or of aluminosilicic acid, zirconium silicate or silicon nitride, all of which may contain more or less foreign materials, e.g. iron (III) oxide, silica and calcium carbonate. It is believed that the metal in the lead alloy reacts with the oxide on the surface to form a bond which improves the flow of the metal in the joint.
Claims (5)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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SE201447T |
Publications (1)
Publication Number | Publication Date |
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SE201447C1 true SE201447C1 (en) | 1965-01-01 |
Family
ID=41985747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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SE201447D SE201447C1 (en) |
Country Status (1)
Country | Link |
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SE (1) | SE201447C1 (en) |
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0
- SE SE201447D patent/SE201447C1/sv unknown
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