SE1500081A1 - Subsea unit with cooling of a semiconductor module - Google Patents
Subsea unit with cooling of a semiconductor module Download PDFInfo
- Publication number
- SE1500081A1 SE1500081A1 SE1500081A SE1500081A SE1500081A1 SE 1500081 A1 SE1500081 A1 SE 1500081A1 SE 1500081 A SE1500081 A SE 1500081A SE 1500081 A SE1500081 A SE 1500081A SE 1500081 A1 SE1500081 A1 SE 1500081A1
- Authority
- SE
- Sweden
- Prior art keywords
- cooling
- semiconductor module
- subsea unit
- subsea
- unit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Claims (1)
1. Ansökningsnummer: 1500081-3 I denna ansökan saknades patentkrav vid ingivningen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE1500081A SE1500081A1 (sv) | 2015-02-13 | 2015-02-13 | Subsea unit with cooling of a semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE1500081A SE1500081A1 (sv) | 2015-02-13 | 2015-02-13 | Subsea unit with cooling of a semiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE1500081A1 true SE1500081A1 (sv) | 2015-02-17 |
Family
ID=52633955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE1500081A SE1500081A1 (sv) | 2015-02-13 | 2015-02-13 | Subsea unit with cooling of a semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| SE (1) | SE1500081A1 (sv) |
-
2015
- 2015-02-13 SE SE1500081A patent/SE1500081A1/sv not_active Application Discontinuation
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NAV | Patent application has lapsed |