SE0200402D0 - High density electrical interconnect system with enhanced grounding and cross-talk reduction capability - Google Patents

High density electrical interconnect system with enhanced grounding and cross-talk reduction capability

Info

Publication number
SE0200402D0
SE0200402D0 SE0200402A SE0200402A SE0200402D0 SE 0200402 D0 SE0200402 D0 SE 0200402D0 SE 0200402 A SE0200402 A SE 0200402A SE 0200402 A SE0200402 A SE 0200402A SE 0200402 D0 SE0200402 D0 SE 0200402D0
Authority
SE
Sweden
Prior art keywords
cross
high density
electrical interconnect
interconnect system
reduction capability
Prior art date
Application number
SE0200402A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE0200402L (en
SE523764C2 (en
Inventor
Carmine Gugliotti
Robert M Bradley
Original Assignee
Litton Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/640,182 external-priority patent/US6267625B1/en
Application filed by Litton Systems Inc filed Critical Litton Systems Inc
Publication of SE0200402D0 publication Critical patent/SE0200402D0/en
Publication of SE0200402L publication Critical patent/SE0200402L/en
Publication of SE523764C2 publication Critical patent/SE523764C2/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/04—Payment circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/08—Payment architectures
    • G06Q20/12—Payment architectures specially adapted for electronic shopping systems
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F19/00—Complete banking systems; Coded card-freed arrangements adapted for dispensing or receiving monies or the like and posting such transactions to existing accounts, e.g. automatic teller machines
    • G07F19/20—Automatic teller machines [ATMs]
    • G07F19/211—Software architecture within ATMs or in relation to the ATM network
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/727—Coupling devices presenting arrays of contacts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/931—Conductive coating
SE0200402A 1999-08-17 2002-02-13 Electrical interconnect system, includes backpanel connector having upstanding pillars, each provided with central ground contact electrically isolated from the corresponding signal contacts SE523764C2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14917899A 1999-08-17 1999-08-17
US09/640,182 US6267625B1 (en) 1999-04-21 2000-08-17 High density electrical interconnect system having enhanced grounding and cross-talk reduction capability
PCT/US2000/022534 WO2001013468A2 (en) 1999-08-17 2000-08-17 High density electrical interconnect system having enhanced grounding and cross-talk reduction capability

Publications (3)

Publication Number Publication Date
SE0200402D0 true SE0200402D0 (en) 2002-02-13
SE0200402L SE0200402L (en) 2002-04-16
SE523764C2 SE523764C2 (en) 2004-05-18

Family

ID=30447945

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0200402A SE523764C2 (en) 1999-08-17 2002-02-13 Electrical interconnect system, includes backpanel connector having upstanding pillars, each provided with central ground contact electrically isolated from the corresponding signal contacts

Country Status (2)

Country Link
JP (1) JP2004500684A (en)
SE (1) SE523764C2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6814619B1 (en) * 2003-06-26 2004-11-09 Teradyne, Inc. High speed, high density electrical connector and connector assembly
JP2013134926A (en) 2011-12-27 2013-07-08 Fujitsu Component Ltd Plug, jack, connector
JP2014026830A (en) 2012-07-26 2014-02-06 Fujitsu Component Ltd Header, receptacle, connector and method for producing header

Also Published As

Publication number Publication date
SE0200402L (en) 2002-04-16
JP2004500684A (en) 2004-01-08
SE523764C2 (en) 2004-05-18

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Legal Events

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