SE0101690D0 - Methods and apparatus for a martensite-free multi-soldering process - Google Patents

Methods and apparatus for a martensite-free multi-soldering process

Info

Publication number
SE0101690D0
SE0101690D0 SE0101690A SE0101690A SE0101690D0 SE 0101690 D0 SE0101690 D0 SE 0101690D0 SE 0101690 A SE0101690 A SE 0101690A SE 0101690 A SE0101690 A SE 0101690A SE 0101690 D0 SE0101690 D0 SE 0101690D0
Authority
SE
Sweden
Prior art keywords
martensite
methods
soldering process
free multi
free
Prior art date
Application number
SE0101690A
Other languages
Swedish (sv)
Other versions
SE0101690L (en
Inventor
Ola Pettersen
Original Assignee
Safetrack Baavhammar Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Safetrack Baavhammar Ab filed Critical Safetrack Baavhammar Ab
Priority to SE0101690A priority Critical patent/SE0101690L/en
Publication of SE0101690D0 publication Critical patent/SE0101690D0/en
Publication of SE0101690L publication Critical patent/SE0101690L/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/021—Soldered or welded connections between two or more cables or wires
    • H01R4/022—Soldered or welded connections between two or more cables or wires comprising preapplied solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
SE0101690A 2001-05-15 2001-05-15 Methods and apparatus for a martensite-free multi-soldering process SE0101690L (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SE0101690A SE0101690L (en) 2001-05-15 2001-05-15 Methods and apparatus for a martensite-free multi-soldering process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0101690A SE0101690L (en) 2001-05-15 2001-05-15 Methods and apparatus for a martensite-free multi-soldering process

Publications (2)

Publication Number Publication Date
SE0101690D0 true SE0101690D0 (en) 2001-05-15
SE0101690L SE0101690L (en) 2002-11-16

Family

ID=20284099

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0101690A SE0101690L (en) 2001-05-15 2001-05-15 Methods and apparatus for a martensite-free multi-soldering process

Country Status (1)

Country Link
SE (1) SE0101690L (en)

Also Published As

Publication number Publication date
SE0101690L (en) 2002-11-16

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Legal Events

Date Code Title Description
NAV Patent application has lapsed